# SMAJ8.0CA-TP

**MCC(Micro Commercial Components)** · TVS · SMA(DO-214AC)

SMAJ8.0CA-TP from MCC(Micro Commercial Components), in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMA(DO-214AC) |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage V(BR) (min) | V(BR) | 8.89 |  | 9.83 | V | @ IT = 1 mA (bi-directional SMAJ8.0CA) | 2 |
| Maximum clamping voltage | VC |  |  | 13.6 | V | @ IPP = 29.4 A | 2 |
| Maximum reverse leakage current | ID |  |  | 50 | μA | @ VWM | 2 |
| Peak pulse current | IPP |  |  | 29.4 | A | 10/1000μs waveform, Note 3 | 2 |
| Peak pulse power dissipation | PPPM | 400 |  |  | W | 10/1000μs waveform, Note 3,4,7 | 1 |
| Steady state power dissipation | PM(AV) |  |  | 1.5 | W | Lead temperature TL = 75°C, Note 3,6 | 1 |
| Operating junction temperature range | TJ | -55 |  | 175 | °C |  | 1 |
| Storage temperature range | TSTG | -55 |  | 175 | °C |  | 1 |
| Typical thermal resistance junction to lead | RθJL |  | 30 |  | °C/W | Junction to lead | 1 |
| Typical thermal resistance junction to ambient | RθJA |  | 120 |  | °C/W | Junction to ambient | 1 |
| Reverse stand-off voltage | VWM |  | 8 |  | V |  | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | copper pads to each terminal. | 1 |

## CAD (KiCad official)

- Symbol: `SMAJ8.0CA-TP`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files: `smaj8-0ca-tp-etched.step` / `smaj8-0ca-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smaj8-0ca-tp.step` / `smaj8-0ca-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/smaj8-0ca-tp-datasheet.pdf) (5 pp, sha256 `41f84b99bdef7450`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smaj8-0ca-tp-datasheet.pdf)