component

SMAJ6.0CAE3

Public Made by Adom

by adom

Microsemi TVS, DO-214AC(SMA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componenttvs-fuse-board level protectionsmaj6.0cae3factory-2.0.0extractor-text

Verified SMAJ6.0CAE3

by Ray · last 8 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

8 Nov 2026RayPublished by the parts factory: tier lcsc, 2 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: SMAJ6.0CAE3 · DO-214AC(SMA) · 2 pins
  • ✓copper: 2 copper pads, none touching another net
  • ✓datasheet: all 2 pin names found in the 5-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: D_SMA
  • ✓files: 6 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-_p0bztfu/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 1 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 2 pins = 2 pads
  • ✓pose: 1 STEP(s) Z-up, seated, centred
  • ✓symbol: 2 pins agree
  • ✓symbol_text: no pin names collide
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ smaj6-0cae3.kicad_sym✓ smaj6-0cae3.kicad_mod✓ smaj6-0cae3.step
Spot something wrong? Report it as an issue Propose a fix Records are signed by members of adom.
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← Commit history

smaj6-0cae3: factory component page (tier=lcsc)

Ray ·6150eded32 ·1d ago ·parent 06f1704
1 file changed +175−29
page.json+175−29
page.json+175−29
@@ -1,8 +1,11 @@ {+  "schema_version": 1,+  "type": "component",   "slug": "smaj6-0cae3",+  "title": "SMAJ6.0CAE3",+  "brief": "Microsemi TVS, DO-214AC(SMA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.",   "version": "0.1.0",-  "type": "component",-  "description": "Microsemi TVS, DO-214AC(SMA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.",+  "license": "CC-BY-SA-4.0",   "tags": [     "component",     "tvs-fuse-board level protection",@@ -10,26 +13,6 @@     "factory-2.0.0",     "extractor-text"   ],-  "dependencies": {},-  "hero": {-    "type": "image",-    "path": "docs/hero.png"-  },-  "files": [-    "page.json",-    "README.md",-    "smaj6-0cae3.kicad_sym",-    "smaj6-0cae3.kicad_mod",-    "smaj6-0cae3.glb",-    "smaj6-0cae3.step",-    "smaj6-0cae3.lbr",-    "docs/hero.png",-    "docs/smaj6-0cae3-datasheet.pdf",-    "viewers/symbol.html",-    "viewers/footprint.html",-    "smaj6-0cae3-hero.glb",-    "smaj6-0cae3-hero.overlay.json"-  ],   "component": {     "mpn": "SMAJ6.0CAE3",     "manufacturer": "Microsemi",@@ -119,12 +102,12 @@         "origin": "footprint origin = pad-pattern centre",         "seat": "z = 0",         "extents_mm": [-          5,+          5.0,           2.7,           2.22         ],-        "zmin_mm": 0,-        "centre_offset_mm": 0,+        "zmin_mm": -0.0,+        "centre_offset_mm": 0.0,         "footprint_binding": "identity",         "sha256": "1cfddd4e3b1bf22b8fc6ee3258c2aade882ed7b85b528e23b9db42437775a1db",         "checked": "2026-11-08",@@ -132,10 +115,173 @@       }     ]   },-  "visibility": "public",-  "org": "adom",+  "metadata": {+    "specs": {+      "Manufacturer": "Microsemi",+      "Package": "DO-214AC(SMA)",+      "Category": "TVS/Fuse/Board Level Protection",+      "Pins": "2"+    },+    "appearance": {+      "contacts": {+        "quote": "• TERMINALS: C-bend (modified J-bend) leads Tin￾Lead or RoHS compliant annealed matte-Tin plating solderable per MIL-STD-750, method 2026",+        "page": 1,+        "doc": "ds.pdf",+        "plating": "tin"+      },+      "version": 1,+      "datasheet_sha256": "b271a9ec62e26f5998087793c3df96b101272fdf607277189f449e11ce05dbad"+    },+    "characteristics": {+      "version": 1,+      "source": "datasheet",+      "datasheet_sha256": "b271a9ec62e26f5998087793c3df96b101272fdf607277189f449e11ce05dbad",+      "rows": [+        {+          "name": "Peak pulse power dissipation",+          "symbol": "PPP",+          "kind": "absolute_maximum",+          "unit": "W",+          "min": null,+          "typ": null,+          "max": 500,+          "conditions": "10/1000 µs",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Operating and storage temperature",+          "symbol": "",+          "kind": "absolute_maximum",+          "unit": "ºC",+          "min": -65,+          "typ": null,+          "max": 150,+          "conditions": "Operating and storage temperature",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Steady-state power dissipation",+          "symbol": "",+          "kind": "absolute_maximum",+          "unit": "W",+          "min": null,+          "typ": null,+          "max": 5,+          "conditions": "TL = 75 ºC",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Steady-state power dissipation",+          "symbol": "",+          "kind": "absolute_maximum",+          "unit": "W",+          "min": null,+          "typ": null,+          "max": 1.56,+          "conditions": "TA = 25 ºC, mounted on FR4 PC board with recommended footprint",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Impulse repetition rate (duty factor)",+          "symbol": "",+          "kind": "absolute_maximum",+          "unit": "%",+          "min": null,+          "typ": null,+          "max": 0.01,+          "conditions": "Impulse repetition rate (duty factor)",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Clamping time (0 V to V(BR) min.), bidirectional",+          "symbol": "",+          "kind": "timing",+          "unit": "ns",+          "min": null,+          "typ": null,+          "max": 5,+          "conditions": "0 V to V(BR) min., bidirectional",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Solder temperature",+          "symbol": "",+          "kind": "absolute_maximum",+          "unit": "ºC",+          "min": null,+          "typ": null,+          "max": 260,+          "conditions": "10 s maximum",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Thermal resistance, junction to lead",+          "symbol": "",+          "kind": "thermal",+          "unit": "ºC/W",+          "min": null,+          "typ": 15,+          "max": null,+          "conditions": "Junction to lead",+          "source_page": 1,+          "source": "datasheet"+        },+        {+          "name": "Thermal resistance, junction to ambient",+          "symbol": "",+          "kind": "thermal",+          "unit": "ºC/W",+          "min": null,+          "typ": 80,+          "max": null,+          "conditions": "Junction to ambient when mounted on FR4 PC board (1oz Cu) with recommended footprint",+          "source_page": 1,+          "source": "datasheet"+        }+      ]+    }+  },+  "variants": [],+  "sections": [+    "hero",+    "viewers",+    "readme",+    "breadcrumbs",+    "info"+  ],+  "discovery_triggers": [+    "smaj6.0cae3"+  ],+  "discovery_pitch": "SMAJ6.0CAE3 (Microsemi) component page: datasheet pinout, KiCad symbol, footprint and 3D.",   "author": {     "name": "Ray",     "email": "[email protected]"-  }-}\ No newline at end of file+  },+  "dependencies": {},+  "hero": {+    "type": "image",+    "path": "docs/hero.png"+  },+  "files": [+    "page.json",+    "README.md",+    "smaj6-0cae3.kicad_sym",+    "smaj6-0cae3.kicad_mod",+    "smaj6-0cae3.glb",+    "smaj6-0cae3.step",+    "smaj6-0cae3.lbr",+    "docs/hero.png",+    "docs/smaj6-0cae3-datasheet.pdf",+    "viewers/symbol.html",+    "viewers/footprint.html",+    "smaj6-0cae3-hero.glb",+    "smaj6-0cae3-hero.overlay.json"+  ]+}