component

SMAJ30CA-TR

Public Made by Adom

by adom

STMicroelectronics TVS, SMA(DO-214AC). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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SMAJ30CA-TR

STMicroelectronics · TVS · SMA(DO-214AC)

SMAJ30CA-TR from STMicroelectronics, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMA(DO-214AC)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power dissipation PPP 400 W Tj initial = Tamb 2
Storage temperature range Tstg -65 150 °C 2
Operating junction temperature range Tj -55 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Leakage current IRM 0.2 µA @VRM, 25 °C 3
Leakage current IRM 1 µA @VRM, 85 °C 3
Breakdown voltage VBR 30 33.3 35.1 V @IR 1 mA, pulse test tp < 50 ms 3
Clamping voltage, 10/1000 µs VCL 48.4 V @IPP 8.3 A, 10/1000 µs 3
Dynamic resistance, 10/1000 µs RD 1.39 Ω 10/1000 µs 3
Clamping voltage, 8/20 µs VCL 64.3 V @IPP 36 A, 8/20 µs 3
Dynamic resistance, 8/20 µs RD 0.762 Ω 8/20 µs 3
Voltage temperature coefficient αT 9.9 10-4/°C 3
Junction to leads thermal resistance Rth(j-l) 30 °C/W 2
Junction to ambient thermal resistance Rth(j-a) 120 °C/W on printed circuit, recommended pad layout 2

CAD (KiCad official)

  • Symbol: SMAJ30CA-TR
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: smaj30ca-tr-etched.step / smaj30ca-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smaj30ca-tr.step / smaj30ca-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (10 pp, sha256 4bb181453198810d, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF