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Contents

README

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SMAJ30CA-Q

BOURNS · TVS · SMA(DO-214AC)

SMAJ30CA-Q from BOURNS, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Bidirectional TVS terminal with no cathode band, interchangeable with the other terminal, 30 V working peak reverse voltage (VRWM), 33.3 to 36.8 V breakdown, 48.4 V max clamping at 8.3 A (10/1000 µs).
2 A2 passive Bidirectional TVS terminal with no cathode band, interchangeable with the other terminal, 30 V working peak reverse voltage (VRWM), 400 W minimum peak pulse power (1 ms).

Key specifications

Parameter Value
Manufacturer BOURNS
Package SMA(DO-214AC)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 33.3 36.8 V @ IT = 1.0 mA 2
Working Peak Reverse Voltage VRWM 30 V 2
Maximum Reverse Leakage IR 1 μA @ VRWM 2
Maximum Clamping Voltage (10/1000 µs) Vc 48.4 V @ Ipp (10/1000 µs) 2
Maximum Peak Pulse Current (10/1000 µs) Ipp 8.3 A 10/1000 µs 2
Maximum Clamping Voltage (8/20 µs) Vc 62.9 V @ Ipp (8/20 µs) 2
Maximum Peak Pulse Current (8/20 µs) Ipp 41.5 A 8/20 µs 2
Breakdown Voltage Tolerance -5 5 % Suffix CA denotes 5 % tolerance bidirectional device 1
Minimum Peak Pulse Power Dissipation PPK 400 Watts TP = 1 ms 1
Peak Forward Surge Current IFSM 40 Amps 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) 1
Operating Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 2. Mounted on 5.0 mm2 (0.03 mm thick) copper pads to each terminal. 1

CAD (KiCad official)

  • Symbol: SMAJ30CA-Q
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: smaj30ca-q-etched.step / smaj30ca-q-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smaj30ca-q.step / smaj30ca-q.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOURNS datasheet (6 pp, sha256 b88c3fa72464bcd9, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF