# SMAJ26CAHM2G

**Taiwan Semiconductor** · ESD And Surge Protection (TVS/ESD) · DO-214AC(SMA)

SMAJ26CAHM2G from Taiwan Semiconductor, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | DO-214AC(SMA) |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (min) | VBR | 28.9 |  |  | V | IT = 1 mA | 2 |
| Breakdown voltage (max) | VBR |  |  | 31.9 | V | IT = 1 mA | 2 |
| Maximum reverse leakage current | IR |  |  | 1 | µA | at VWM = 26 V | 2 |
| Maximum peak impulse current | IPPM |  |  | 9.5 | A | Non-repetitive current pulse, per Fig.5 | 2 |
| Maximum clamping voltage | VC |  |  | 42.1 | V | at IPPM | 2 |
| Peak power dissipation | PPK |  |  | 400 | W | TA = 25°C, tp = 1ms (Note 1) | 1 |
| Steady state power dissipation | PD |  |  | 1 | W |  | 1 |
| Peak forward surge current | IFSM |  |  | 40 | A | 8.3ms single half sine-wave, superimposed on rated load | 1 |
| Operating junction temperature range (min) | TJ | -55 |  |  | °C |  | 1 |
| Operating junction temperature range (max) | TJ |  |  | 150 | °C |  | 1 |
| Storage temperature range (min) | TSTG | -55 |  |  | °C |  | 1 |
| Storage temperature range (max) | TSTG |  |  | 150 | °C |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | ● Terminal: Matte tin plated leads, solderable per J-STD￾002 ● Meet JESD 201 class 2 whisker test | 1 |

## CAD (KiCad official)

- Symbol: `SMAJ26CAHM2G`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
- 3D model files: `smaj26cahm2g-etched.step` / `smaj26cahm2g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smaj26cahm2g.step` / `smaj26cahm2g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Taiwan Semiconductor datasheet](docs/smaj26cahm2g-datasheet.pdf) (7 pp, sha256 `bfd3022d45c69022`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smaj26cahm2g-datasheet.pdf)