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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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verification.json Verified: Published by the parts factory: tier mfr, 2 pins · Ray 8d ago

SMA6J8.5A-TR

STMicroelectronics · TVS · SMA(DO-214AC)

SMA6J8.5A-TR from STMicroelectronics, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMA(DO-214AC)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current at VRM, 25 °C IRM 20 µA at VRM = 8.5 V, 25 °C 3
Reverse leakage current at VRM, 85 °C IRM 50 µA at VRM = 8.5 V, 85 °C 3
Breakdown voltage VBR 9.4 V at IR = 1 mA, Tamb = 25 °C 3
Breakdown voltage VBR 9.9 V at IR = 1 mA, Tamb = 25 °C 3
Breakdown voltage VBR 10.4 V at IR = 1 mA, Tamb = 25 °C 3
Clamping voltage, 10/1000 µs surge VCL 13.3 V 10/1000 µs, IPP = 41.7 A 3
Peak pulse current, 10/1000 µs IPP 41.7 A 10/1000 µs 3
Dynamic resistance, 10/1000 µs RD 0.07 Ω 10/1000 µs 3
Clamping voltage, 8/20 µs surge VCL 19.5 V 8/20 µs, IPP = 205 A 3
Peak pulse current, 8/20 µs IPP 205 A 8/20 µs 3
Dynamic resistance, 8/20 µs RD 0.044 Ω 8/20 µs 3
Breakdown voltage temperature coefficient αT 7.3 10-4/°C 3
Peak pulse power dissipation PPP 600 W 10/1000 µs, Tj initial = Tamb 2
Power dissipation on infinite heatsink P 4 W Tamb = 55 °C 2
Storage temperature range Tstg -65 175 °C 2
Operating junction temperature range Tj -55 175 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Junction to leads thermal resistance Rth(j-l) 30 °C/W 2
Junction to ambient thermal resistance Rth(j-a) 120 °C/W on printed circuit on recommended pad layout 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper copper surface under each lead (printed circuit board 6

CAD (KiCad official)

  • Symbol: SMA6J8.5A-TR
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: sma6j8-5a-tr-etched.step / sma6j8-5a-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sma6j8-5a-tr.step / sma6j8-5a-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (13 pp, sha256 6de68bfe2405caa1, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF