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SM7055-12

Public Made by Adom

by adom

Shenzhen Sunmoon Micro AC-DC Controllers & Regulators, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SM7055-12

Shenzhen Sunmoon Micro · AC-DC Controllers & Regulators · DIP-8

SM7055-12 from Shenzhen Sunmoon Micro, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground; connect to PCB copper for heat dissipation (RthJA 45 °C/W with 200 mm² copper on all GND pins).
2 NC unconnected No-connect (floating) pin.
3 NC unconnected No-connect (floating) pin.
4 HVDD power_in Chip supply pin, abs max -0.3 to 20 V with 10 mA clamp current, turn-on 11.5 V and turn-off 8 V (3.5 V hysteresis) per electrical table.
5 DRAIN passive Drain of the built-in 730 V high-voltage MOSFET (-0.3 to 730 V), also used as the chip start-up pin; tied with pins 6, 7, 8.
6 DRAIN passive Drain of the built-in 730 V high-voltage MOSFET (-0.3 to 730 V), also used as the chip start-up pin; tied with pins 5, 7, 8.
7 DRAIN passive Drain of the built-in 730 V high-voltage MOSFET (-0.3 to 730 V), also used as the chip start-up pin; tied with pins 5, 6, 8.
8 DRAIN passive Drain of the built-in 730 V high-voltage MOSFET (-0.3 to 730 V), also used as the chip start-up pin; tied with pins 5, 6, 7.

Key specifications

Parameter Value
Manufacturer Shenzhen Sunmoon Micro
Package DIP-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain pin max withstand voltage VDS(max) -0.3 730 V TA=25℃ 3
Drain pin max voltage at startup VDS(ST) -0.3 730 V TA=25℃ 3
Chip supply voltage HVDD -0.3 20 V TA=25℃ 3
Clamp current IHVDD 10 mA TA=25℃ 3
ESD voltage VESD 2000 V TA=25℃ 3
Junction temperature TJ -40 150 ℃ TA=25℃ 3
Storage temperature TSTG -55 150 ℃ TA=25℃ 3
Thermal resistance RthJA 45 ℃/W PCB with 200mm2 copper, 35um thick, connected to all GND pins 3
Drain-source breakdown voltage BVDS 730 V 3
DRAIN off-state leakage current IDSS 0.1 mA 3
On-resistance RDS(on) 22 Ohm ID=0.2A 3
HVDD turn-on voltage HVDDON 11.5 V 3
HVDD turn-off voltage HVDDOFF 8 V 3
HVDD hysteresis voltage HVDDHYS 3.5 V 3
HVDD operating current IDD2 0.5 mA HVDD=11V 3
Charging current IDDCH -500 uA VDS=100V; HVDD=5V 3
Oscillation frequency FOSC 60 KHz 3
Frequency jitter range △Fosc 4 % 3
Over-temperature protection temperature TOVT 150 ℃ 3

CAD (KiCad official)

  • Symbol: SM7055-12
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: sm7055-12-etched.step / sm7055-12-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sm7055-12.step / sm7055-12.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen Sunmoon Micro datasheet (9 pp, sha256 d75b5ecb3e053ec8, retrieved 2026-10-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF