# SM5817PL-TP

**MCC(Micro Commercial Components)** · Schottky Barrier Diodes (SBD) · SOD-123FL

SM5817PL-TP from MCC(Micro Commercial Components), in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Junction Temperature Range |  | -65 |  | 125 | °C |  | 1 |
| Storage Temperature Range |  | -65 |  | 125 | °C |  | 1 |
| Maximum Recurrent Peak Reverse Voltage (SM5817PL column) |  |  |  | 20 | V |  | 1 |
| Maximum RMS Voltage (SM5817PL column) |  |  |  | 14 | V |  | 1 |
| Maximum DC Blocking Voltage (SM5817PL column) |  |  |  | 20 | V |  | 1 |
| Repetitive Peak Forward Current | IFRM | 1.2 |  |  | A |  | 1 |
| Forward Voltage | VF |  |  | 0.45 | V |  | 1 |
| Typical Junction Capacitance | CJ |  | 50 |  | pF | f=1.0MHz, Vr=4V | 1 |
| Typical Thermal Resistance Junction to Ambient |  |  | 88 |  | °C/W | Note 2: PC board mounted on 0.2*0.2'' (5*5mm) copper pad area | 1 |
| Typical Thermal Resistance Junction to Case |  |  | 43 |  | °C/W | Note 2: PC board mounted on 0.2*0.2'' (5*5mm) copper pad area | 1 |
| Typical Thermal Resistance Junction to Lead |  |  | 30 |  | °C/W | Note 2: PC board mounted on 0.2*0.2'' (5*5mm) copper pad area | 1 |

## CAD (KiCad official)

- Symbol: `SM5817PL-TP`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files: `sm5817pl-tp-etched.step` / `sm5817pl-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sm5817pl-tp.step` / `sm5817pl-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/sm5817pl-tp-datasheet.pdf) (3 pp, sha256 `4ed6ed8d6b31b041`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sm5817pl-tp-datasheet.pdf)