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README

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SM4305PSKPC-TRG-VB

VBsemi Elec · MOSFETs · DFN5x6-8

SM4305PSKPC-TRG-VB from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the P-channel MOSFET, rated for a drain-source voltage of -30 V (VDS).
2 S passive Source terminal of the P-channel MOSFET, rated for a drain-source voltage of -30 V (VDS).
3 S passive Source terminal of the P-channel MOSFET, rated for a drain-source voltage of -30 V (VDS).
4 G input Gate terminal of the P-channel MOSFET, with a gate-source voltage limit of ±20 V (VGS) in the absolute maximum ratings.
5 D passive Drain terminal of the P-channel MOSFET, rated for a drain-source voltage of -30 V (VDS).
6 D passive Drain terminal of the P-channel MOSFET, rated for a drain-source voltage of -30 V (VDS).
7 D passive Drain terminal of the P-channel MOSFET, rated for a drain-source voltage of -30 V (VDS).
8 D passive Drain terminal of the P-channel MOSFET, rated for a drain-source voltage of -30 V (VDS).
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package DFN5x6-8
Category Triode/MOS Tube/Transistor
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -60 A TC = 25 °C 1
Continuous Drain Current ID -50.7 A TC = 70 °C 1
Continuous Drain Current ID -47.3 A TA = 25 °C 1
Continuous Drain Current ID -43.9 A TA = 70 °C 1
Pulsed Drain Current IDM -150 A t = 300 µs 1
Continuous Source-Drain Diode Current IS -58 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -46 A TA = 25 °C 1
Single Pulse Avalanche Current IAS -40 A L = 0.1 mH 1
Single Pulse Avalanche Energy EAS 80 mJ 1
Maximum Power Dissipation PD 75 W TC = 25 °C 1
Maximum Power Dissipation PD 40 W TC = 70 °C 1
Maximum Power Dissipation PD 3.1 W TA = 25 °C 1
Maximum Power Dissipation PD 2 W TA = 70 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 33 40 °C/W t ≤ 10 s 1
Maximum Junction-to-Ambient RthJA 90 °C/W Steady state (note d) 1
Maximum Junction-to-Foot (Drain) RthJF 15 17 °C/W Steady state 1
Drain-Source Breakdown Voltage V(BR)DSS -30 V VGS = 0 V, ID = -250 µA 2
VDS Temperature Coefficient ΔVDS/ΔTJ -24 mV/°C ID = -250 µA 2
VGS(th) Temperature Coefficient ΔVGS(th)/ΔTJ 6 mV/°C 2
Gate-Source Threshold Voltage VGS(th) -1 -2.5 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -150 150 µA VDS = 0 V, VGS = ±25 V 2
Gate-Source Leakage IGSS -15 15 µA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -10 µA VDS = -30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -20 A VDS ≤ -5 V, VGS = -10 V 2
Drain-Source On-State Resistance RDS(on) 0.008 Ω VGS = -10 V, ID = -13 A 2
Drain-Source On-State Resistance RDS(on) 0.009 Ω VGS = -6 V, ID = -10 A 2
Drain-Source On-State Resistance RDS(on) 0.012 Ω VGS = -4.5 V, ID = -8 A 2
Forward Transconductance gfs 44 S VDS = -15 V, ID = -13 A 2
Total Gate Charge Qg 102 153 nC VDS = -15 V, VGS = -10 V, ID = -17.3 A 2
Total Gate Charge Qg 66 80 nC VDS = -15 V, VGS = -5 V, ID = -17.3 A 2
Gate Resistance Rg 1.3 2.6 Ω f = 1 MHz 2
Turn-On Delay Time td(on) 70 105 ns VDD = 0 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -4.5 V, Rg = 1 Ω 2
Rise Time tr 70 105 ns VDD = 0 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 45 68 ns VDD = 0 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -4.5 V, Rg = 1 Ω 2
Fall Time tf 27 41 ns VDD = 0 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-On Delay Time td(on) 18 30 ns VDD = -15 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -10 V, Rg = 1 Ω 2
Rise Time tr 15 25 ns VDD = -15 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 52 80 ns VDD = -15 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -10 V, Rg = 1 Ω 2
Fall Time tf 14 25 ns VDD = -15 V, RL = 1.5 Ω, ID ≈ -10 A, VGEN = -10 V, Rg = 1 Ω 2
Body Diode Voltage VSD -0.78 -1.2 V IS = -10 A, VGS = 0 V 2
Body Diode Reverse Recovery Time trr 35 53 ns IF = -10 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 25 38 nC IF = -10 A, dI/dt = 100 A/µs, TJ = 25 °C 2

CAD (KiCad official)

  • Symbol: SM4305PSKPC-TRG-VB
  • Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
  • 3D model: DFN5x6-8 (KiCad packages3D, STEP)
  • 3D model files: sm4305pskpc-trg-vb-etched.step / sm4305pskpc-trg-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sm4305pskpc-trg-vb.step / sm4305pskpc-trg-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (7 pp, sha256 5a6be5b1c52a7438, retrieved 2026-11-02, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF