SM30T6.8CAY
Public Made by Adomby adom
STMicroelectronics ESD And Surge Protection (TVS/ESD), SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
SM30T6.8CAY
STMicroelectronics · ESD And Surge Protection (TVS/ESD) · SMC(DO-214AB)
SM30T6.8CAY from STMicroelectronics, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SMC(DO-214AB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse leakage current (25 °C) | IRM | 20 | µA | at VRM = 5 V, 25 °C | 3 | ||
| Reverse leakage current (85 °C) | IRM | 50 | µA | at VRM = 5 V, 85 °C | 3 | ||
| Breakdown voltage | VBR | 6.4 | 6.8 | 7.1 | V | at IBR = 10 mA | 3 |
| Clamping voltage, 10/1000 µs surge | VCL | 9.2 | V | 10/1000 µs | 3 | ||
| Peak pulse current, 10/1000 µs surge | IPP | 327 | A | 10/1000 µs | 3 | ||
| Dynamic resistance, 10/1000 µs surge | RD | 6.42 | mΩ | 10/1000 µs | 3 | ||
| Clamping voltage, 8/20 µs surge | VCL | 14.4 | V | 8/20 µs | 3 | ||
| Peak pulse current, 8/20 µs surge | IPP | 1610 | A | 8/20 µs | 3 | ||
| Dynamic resistance, 8/20 µs surge | RD | 4.53 | mΩ | 8/20 µs | 3 | ||
| Peak pulse voltage, contact discharge | VPP | -30 | 30 | kV | ISO10605, C = 330 pF, R = 330 Ω, contact discharge | 2 | |
| Peak pulse voltage, air discharge | VPP | -30 | 30 | kV | ISO10605, C = 330 pF, R = 330 Ω, air discharge | 2 | |
| Peak pulse power dissipation | PPP | 3000 | W | Tj initial = Tamb | 2 | ||
| Storage temperature range | Tstg | -65 | 175 | °C | 2 | ||
| Operating junction temperature range | Tj | -55 | 175 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10 s | 2 | ||
| Voltage temperature coefficient | αT | 5.7 | 10-4/°C | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Lead finishing: matte tin plating Complies with the following standards | 1 |
CAD (KiCad official)
- Symbol:
SM30T6.8CAY - Footprint:
Diode_SMD:D_SMC - 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files:
sm30t6-8cay-etched.step/sm30t6-8cay-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sm30t6-8cay.step/sm30t6-8cay.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (16 pp, sha256
f6d47dc33b5be94c, retrieved 2026-10-16, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SM30T6.8CAY
**STMicroelectronics** · ESD And Surge Protection (TVS/ESD) · SMC(DO-214AB)
SM30T6.8CAY from STMicroelectronics, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SMC(DO-214AB) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse leakage current (25 °C) | IRM | | | 20 | µA | at VRM = 5 V, 25 °C | 3 |
| Reverse leakage current (85 °C) | IRM | | | 50 | µA | at VRM = 5 V, 85 °C | 3 |
| Breakdown voltage | VBR | 6.4 | 6.8 | 7.1 | V | at IBR = 10 mA | 3 |
| Clamping voltage, 10/1000 µs surge | VCL | | | 9.2 | V | 10/1000 µs | 3 |
| Peak pulse current, 10/1000 µs surge | IPP | | | 327 | A | 10/1000 µs | 3 |
| Dynamic resistance, 10/1000 µs surge | RD | | | 6.42 | mΩ | 10/1000 µs | 3 |
| Clamping voltage, 8/20 µs surge | VCL | | | 14.4 | V | 8/20 µs | 3 |
| Peak pulse current, 8/20 µs surge | IPP | | | 1610 | A | 8/20 µs | 3 |
| Dynamic resistance, 8/20 µs surge | RD | | | 4.53 | mΩ | 8/20 µs | 3 |
| Peak pulse voltage, contact discharge | VPP | -30 | | 30 | kV | ISO10605, C = 330 pF, R = 330 Ω, contact discharge | 2 |
| Peak pulse voltage, air discharge | VPP | -30 | | 30 | kV | ISO10605, C = 330 pF, R = 330 Ω, air discharge | 2 |
| Peak pulse power dissipation | PPP | | | 3000 | W | Tj initial = Tamb | 2 |
| Storage temperature range | Tstg | -65 | | 175 | °C | | 2 |
| Operating junction temperature range | Tj | -55 | | 175 | °C | | 2 |
| Maximum lead temperature for soldering | TL | | | 260 | °C | during 10 s | 2 |
| Voltage temperature coefficient | αT | | 5.7 | | 10-4/°C | | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | • Lead finishing: matte tin plating Complies with the following standards | 1 |
## CAD (KiCad official)
- Symbol: `SM30T6.8CAY`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files: `sm30t6-8cay-etched.step` / `sm30t6-8cay-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sm30t6-8cay.step` / `sm30t6-8cay.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://www.st.com/resource/en/datasheet/sm30t6.8cay.pdf) (16 pp, sha256 `f6d47dc33b5be94c`, retrieved 2026-10-16, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sm30t6-8cay-datasheet.pdf)