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SM30T35CAY

STMicroelectronics · TVS · SMC(DO-214AB)

SM30T35CAY from STMicroelectronics, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMC(DO-214AB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current IRM 0.2 µA at VRM 3
Stand-off voltage VRM 30 V 3
Breakdown voltage VBR 33.3 35.1 36.9 V at IR = 1 mA 3
Clamping voltage 10/1000 µs VCL 48.4 V 10/1000 µs, IPP = 62.0 A 3
Peak pulse current 10/1000 µs IPP 62 A 10/1000 µs 3
Dynamic resistance 10/1000 µs RD 0.215 Ω 10/1000 µs 3
Clamping voltage 8/20 µs VCL 64.3 V 8/20 µs, IPP = 569 A 3
Peak pulse current 8/20 µs IPP 569 A 8/20 µs 3
Dynamic resistance 8/20 µs RD 0.051 Ω 8/20 µs 3
Voltage temperature coefficient αT 9.9 10-4/°C 3
Peak pulse power dissipation PPP 3000 W Tj initial = Tamb, 10/1000 µs 2
Peak pulse voltage, contact discharge (ISO10605 C=330 pF, R=330 Ω) VPP 30 kV Tamb = 25 °C 2
Peak pulse voltage, air discharge (ISO10605 C=330 pF, R=330 Ω) VPP 30 kV Tamb = 25 °C 2
Peak pulse voltage, contact discharge (ISO10605 / IEC 61000-4-2 C=150 pF, R=330 Ω) VPP 30 kV Tamb = 25 °C 2
Peak pulse voltage, air discharge (ISO10605 / IEC 61000-4-2 C=150 pF, R=330 Ω) VPP 30 kV Tamb = 25 °C 2
Storage temperature range Tstg -65 175 °C 2
Operating junction temperature range Tj -55 175 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Lead finishing: matte tin plating Complies with the following standards 1

CAD (KiCad official)

  • Symbol: SM30T35CAY
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: sm30t35cay-etched.step / sm30t35cay-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sm30t35cay.step / sm30t35cay.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (16 pp, sha256 78352e28f9839334, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF