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SM15-02HTG

UMW · ESD And Surge Protection (TVS/ESD) · SOT-23

SM15-02HTG from UMW, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O1 bidirectional Protected signal line that is clamped to pin 3 by the SM15 TVS array, rated for ±30 kV contact and air ESD per IEC 61000-4-2 and 50 A EFT per IEC 61000-4-4 (5/50 ns).
2 I/O2 bidirectional Protected signal line that is clamped to pin 3 by the SM15 TVS array, rated for ±30 kV contact and air ESD per IEC 61000-4-2 and 50 A EFT per IEC 61000-4-4 (5/50 ns).
3 GND power_in Common reference terminal to which pins 1 and 2 are clamped; the electrical tables test I/O-to-GND and 'Pin 1 or Pin 2 to Pin 3' conditions.

Key specifications

Parameter Value
Manufacturer UMW
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Voltage Drop VR 16.7 V IR=1mA 4
Leakage Current ILEAK 1 µA VR=15V 4
Clamp Voltage (IPP=1A) VC 24 V IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 4
Clamp Voltage (IPP=10A) VC 30 V IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 4
ESD Withstand Voltage (Contact Discharge) VESD -30 30 kV IEC 61000-4-2 (Contact Discharge) 4
ESD Withstand Voltage (Air Discharge) VESD -30 30 kV IEC 61000-4-2 (Air Discharge) 4
Peak Pulse Current (8/20µs) IPP 12 A tp=8/20µs 4
Diode Capacitance I/O-GND CI/O-GND 100 pF Reverse Bias=0V, f=1MHz 4
Diode Capacitance I/O-I/O CI/O-I/O 75 pF Reverse Bias=0V, f=1MHz 4
Reverse Stand off Voltage VRWM 15 V IR≤1µA 4
Dynamic Resistance RDYN 0.3 Ω TLP, tp=100ns, I/O to GND 4
Peak Pulse Power PPK 400 W tp=8/20µs 2
Junction Temperature TOP -40 125 °C 2
Storage Temperature TSTOR -55 150 °C 2

CAD (KiCad official)

  • Symbol: SM15-02HTG
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: sm15-02htg-etched.step / sm15-02htg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sm15-02htg.step / sm15-02htg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (11 pp, sha256 0e09b07cb6bbf5ef, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF