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SM08C

MDD(Microdiode Semiconductor) · IC · SOT-23

SM08C from MDD(Microdiode Semiconductor), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O 1 passive Protected bidirectional line 1, clamped to common pin 3 through a bidirectional TVS diode (SM08C VRWM 8 V, VB 8.5 V min at 1 mA).
2 I/O 2 passive Protected bidirectional line 2, clamped to common pin 3 through a bidirectional TVS diode (SM08C VRWM 8 V, VB 8.5 V min at 1 mA).
3 COMMON passive Common node shared by both bidirectional TVS diodes, connected to the reference/ground return of the protected lines.

Key specifications

Parameter Value
Manufacturer MDD(Microdiode Semiconductor)
Package SOT-23
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse stand-off voltage (working voltage) VRWM 8 V 2
Breakdown voltage VB 8.5 V IT = 1 mA 2
Clamping voltage at 1 A VC 13.4 V @1A 2
Clamping voltage at peak pulse current VC 24 V @ 15 A (IPP column of this row) 2
Reverse leakage current IR 2 µA 2
Junction capacitance CT 120 pF 2
ESD per IEC 61000-4-2 (Air) VESD -30 30 kV IEC 61000-4-2 (Air) 1
ESD per IEC 61000-4-2 (Contact) VESD -30 30 kV IEC 61000-4-2 (Contact) 1
Peak pulse power PPP 350 W tp = 8/20 µs waveform 1
Operating temperature TOPT -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Lead solder temperature (10 second duration) TL 260 °C 10 s duration 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminal: Matte tin plated. http://www.microdiode.com Page :2 1

CAD (KiCad official)

  • Symbol: SM08C
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: sm08c-etched.step / sm08c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sm08c.step / sm08c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD(Microdiode Semiconductor) datasheet (5 pp, sha256 deddb74e0c252eba, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF