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SL1210300

TECHFUSE · Resettable Fuses · 1210

SL1210300 from TECHFUSE, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer TECHFUSE
Package 1210
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Thermal derating hold current at ambient -40 ℃ 4.5 A Maximum ambient operating temperature -40 ℃ 3
Thermal derating hold current at ambient -20 ℃ 4 A Maximum ambient operating temperature -20 ℃ 3
Thermal derating hold current at ambient 0 ℃ 3.5 A Maximum ambient operating temperature 0 ℃ 3
Thermal derating hold current at ambient 25 ℃ 3 A Maximum ambient operating temperature 25 ℃ 3
Thermal derating hold current at ambient 40 ℃ 2.6 A Maximum ambient operating temperature 40 ℃ 3
Thermal derating hold current at ambient 50 ℃ 2.3 A Maximum ambient operating temperature 50 ℃ 3
Thermal derating hold current at ambient 60 ℃ 2.1 A Maximum ambient operating temperature 60 ℃ 3
Thermal derating hold current at ambient 70 ℃ 1.8 A Maximum ambient operating temperature 70 ℃ 3
Maximum hold current (no trip) IH 3 A 25℃ still air; reflow soldering 260℃ for 20 sec 2
Minimum trip current IT 6 A 25℃ still air; reflow soldering 260℃ for 20 sec 2
Maximum continuous voltage (Vmax) Vmax 6 V Maximum continuous voltage at rated current 2
Maximum fault current (Imax) Imax 50 A At rated voltage 2
Typical power dissipation (Pdtyp) Pdtyp 1.2 W Typical; air environment 2
Maximum time to trip (Ttrip) Ttrip 12 s At assigned current; reflow soldering 260℃ for 20 sec 2
Minimum resistance, initial un-soldered state (Rmin) Rmin 0.004 Ω 25℃ 2
Maximum resistance, initial un-soldered state (Rmax) Rmax 0.008 Ω 25℃ 2
Maximum resistance after reflow (R1max) R1max 0.018 Ω 25℃, measured one hour after reflow soldering 260℃ for 20 sec 2
Recommended storage temperature 40 ℃ 2
Recommended storage relative humidity 70 %R.H. 2

CAD (KiCad official)

  • Symbol: SL1210300
  • Footprint: Fuse:Fuse_1210_3225Metric
  • 3D model: 1210 (KiCad packages3D, STEP)
  • 3D model files: sl1210300-etched.step / sl1210300-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sl1210300.step / sl1210300.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TECHFUSE datasheet (5 pp, sha256 8ae482acc55ca041, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF