# SL0805300

**TECHFUSE** · Resettable Fuses · 0805

SL0805300 from TECHFUSE, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum continuous voltage (Vmax) at rated current | Vmax |  |  | 6 | V | at rated current | 2 |
| Maximum fault current (Imax) at rated voltage | Imax |  |  | 50 | A | at rated voltage | 2 |
| Minimum trip current (IT) | IT | 6 |  |  | A | 25℃ still air | 2 |
| Maximum time to trip (Ttrip) | Ttrip |  |  | 12 | s | at assigned current | 2 |
| Minimum resistance, initial un-soldered state (Rmin) | Rmin | 0.007 |  |  | Ω | initial (un-soldered) state | 2 |
| Maximum resistance, initial un-soldered state (Rmax) | Rmax |  |  | 0.02 | Ω | initial (un-soldered) state | 2 |
| Maximum resistance at 25℃ one hour after reflow (R1max) | R1max |  |  | 0.045 | Ω | 25℃, one hour after reflow soldering 260℃ for 20 sec | 2 |
| Maximum hold current (IH) without trip | IH |  |  | 3 | A | 25℃ still air | 2 |
| Typical power dissipation (Pdtyp) | Pdtyp |  | 1 |  | W | typical power dissipated in still air | 2 |
| Resistance after passive aging |  |  |  | 0.045 | Ω | 85℃, 1000 hours; criterion ≤ R1max | 2 |
| Resistance after moisture resistance |  |  |  | 0.045 | Ω | 85% RH, 85℃, 1000 hrs; criterion ≤ R1max | 2 |
| Resistance after thermal shock |  |  |  | 0.045 | Ω | +85℃/-40℃, 20 times; MIL-STD-202 Method 107G; criterion ≤ R1max | 2 |
| Resistance change after vibration |  | -5 |  | 5 | % | MIL-STD-883C Method 2007.1 Condition A | 2 |
| Recommended storage temperature |  |  |  | 40 | ℃ | storage | 2 |
| Recommended storage relative humidity |  |  |  | 70 | %R.H. | storage | 2 |

## CAD (KiCad official)

- Symbol: `SL0805300`
- Footprint: `Fuse:Fuse_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `sl0805300-etched.step` / `sl0805300-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sl0805300.step` / `sl0805300.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TECHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588905565476540416) (4 pp, sha256 `7cbf94f435d86576`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sl0805300-datasheet.pdf)