# SL0805175

**TECHFUSE** · Resettable Fuses · 0805

SL0805175 from TECHFUSE, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TECHFUSE |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (maximum current without trip, 25℃) | IH |  |  | 1.75 | A | 25℃ still air | 2 |
| Trip current (minimum current that always trips, 25℃) | IT | 3.5 |  |  | A | 25℃ still air | 2 |
| Maximum continuous voltage (rated voltage) | Vmax |  |  | 6 | V | at rated current | 2 |
| Maximum fault current (withstand without damage) | Imax |  |  | 50 | A | at rated voltage | 2 |
| Maximum time to trip | Ttrip |  |  | 5 | s | at 8.0 A, 25℃ still air | 2 |
| Minimum resistance, initial (un-soldered) | Rmin | 0.008 |  |  | Ω | 25℃, initial un-soldered state | 2 |
| Maximum resistance, initial (un-soldered) | Rmax |  |  | 0.032 | Ω | 25℃, initial un-soldered state | 2 |
| Maximum resistance at 25℃ one hour after reflow | R1max |  |  | 0.06 | Ω | 25℃, one hour after reflow 260℃ for 20 s, PWB 0.030 in 1.5 oz copper | 2 |
| Typical power dissipation | Pdtyp |  | 1 |  | W | in still air | 2 |
| Resistance after passive aging (criterion) | R1max |  |  | 0.06 | Ω | 85℃, 1000 hours passive aging; criterion ≤ R1max | 2 |
| Resistance after moisture resistance (criterion) | R1max |  |  | 0.06 | Ω | 85% RH, 85℃, 1000 hrs; criterion ≤ R1max | 2 |
| Resistance after thermal shock (criterion) | R1max |  |  | 0.06 | Ω | MIL-STD-202 Method 107G, +85℃/-40℃, 20 cycles; criterion ≤ R1max | 2 |
| Recommended storage temperature |  |  |  | 40 | ℃ | storage, maximum | 2 |
| Recommended storage relative humidity |  |  |  | 70 | % R.H. | storage, maximum | 2 |
| Hold current at ambient temperature | IH |  |  | 2.6 | A | ambient -40℃, thermal derating | 3 |
| Hold current at ambient temperature | IH |  |  | 2.3 | A | ambient -20℃, thermal derating | 3 |
| Hold current at ambient temperature | IH |  |  | 1.9 | A | ambient 0℃, thermal derating | 3 |
| Hold current at ambient temperature | IH |  |  | 1.75 | A | ambient 25℃, thermal derating | 3 |
| Hold current at ambient temperature | IH |  |  | 1.6 | A | ambient 40℃, thermal derating | 3 |
| Hold current at ambient temperature | IH |  |  | 1.2 | A | ambient 50℃, thermal derating | 3 |
| Hold current at ambient temperature | IH |  |  | 1.1 | A | ambient 60℃, thermal derating | 3 |
| Hold current at ambient temperature | IH |  |  | 1 | A | ambient 70℃, thermal derating | 3 |

## CAD (KiCad official)

- Symbol: `SL0805175`
- Footprint: `Fuse:Fuse_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `sl0805175-etched.step` / `sl0805175-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sl0805175.step` / `sl0805175.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TECHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588906795897536512) (4 pp, sha256 `7cbf94f435d86576`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sl0805175-datasheet.pdf)