component
SK6252B
Public Made by Adomby adom
Suntek DC-DC Converters, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSK6252B
Suntek · DC-DC Converters · SOT-23-6
SK6252B from Suntek, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin for the regulator; the datasheet calls for a large copper area here to cool the chip. |
| 2 | SW | output | Switching pin, rated -3 V to 19 V (-5 V to 19 V for transients under 10 ns) per the absolute maximum ratings. |
| 3 | IN | power_in | Power supply pin, with a recommended input voltage range of 4.5 V to 17 V and an absolute maximum of 18 V. |
| 4 | FB | input | Feedback input that connects to the center of the external resistor divider; the internal reference is 0.765 V and the absolute maximum range is -0.3 V to 6 V. |
| 5 | EN | input | Enable pin: drive logic-high to enable the IC and logic-low to disable it into micro-power shutdown, with rising threshold 1.4 V and falling threshold 0.8 V. |
| 6 | BS | power_in | Supply input for the high-side MOSFET gate drive circuit, which requires a 0.1 µF (typical) capacitor between BS and SW; BS voltage to SW is limited to 6.5 V absolute maximum. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Suntek |
| Package | SOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | 4.5 | 17 | V | 5 | |||
| Output Voltage Range | 0.765 | 7 | V | 5 | |||
| Feedback Voltage | 0.746 | 0.765 | 0.784 | V | 5 | ||
| Supply Current (Quiescent) | 0.6 | 0.8 | mA | VEN =3.0V | 5 | ||
| Under-Voltage Lockout Threshold, Wake up VIN Voltage | 4.3 | 4.5 | V | 5 | |||
| Under-Voltage Lockout Threshold, Shutdown VIN Voltage | 3.6 | 3.8 | V | 5 | |||
| VIN voltage | VIN | -0.3 | 18 | V | 3 | ||
| EN voltage | EN | -0.3 | 18 | V | 3 | ||
| SW voltage | SW | -3 | 19 | V | 3 | ||
| SW voltage (transient) | SW | -5 | 19 | V | <10 ns transient | 3 | |
| BS voltage (to SW) | BS | -0.3 | 6.5 | V | 3 | ||
| FB voltage | FB | -0.3 | 6 | V | 3 | ||
| FB voltage | FB | -0.1 | 6 | V | 4 | ||
| Output current | 0 | 2 | A | 4 | |||
| Operating junction temperature, TJ | TJ | -40 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 3 | ||
| Lead Temperature (Soldering) | 260 | °C | Soldering, 10 sec. | 3 | |||
| Operating junction temperature | -40 | 125 | °C | 4 | |||
| Operating temperature range | -40 | 85 | °C | 4 | |||
| Input voltage VIN | VIN | 4.5 | 17 | V | 4 | ||
| Input voltage EN | EN | -0.1 | 17 | V | 4 | ||
| BST voltage | BST | -0.1 | 21 | V | 4 | ||
| High-Side Switch On-Resistance | 110 | mΩ | ISW=100mA | 5 | |||
| Low-Side Switch On-Resistance | 70 | mΩ | ISW=-100mA | 5 | |||
| Supply Current (Shutdown) | 4 | uA | VEN =0 or EN = GND | 5 | |||
| Valley Switch Current Limit | 2 | A | 5 | ||||
| Output UVP threshold | 60 | % | Hiccup detect (H > L) | 5 | |||
| Hiccup wait time | 1.8 | ms | 5 | ||||
| Hiccup time before restart | 32 | ms | 5 | ||||
| Over Voltage Protection Threshold | 18 | V | 5 | ||||
| Switching Frequency | 500 | KHz | 5 | ||||
| Maximum Duty Cycle | 90 | % | VFB=90% | 5 | |||
| Minimum Off-Time | 200 | nS | 5 | ||||
| EN Rising Threshold | 1.4 | V | 5 | ||||
| EN Falling Threshold | 0.8 | V | 5 | ||||
| Hysteresis VIN voltage | 500 | mV | 5 | ||||
| Soft Start | 1.5 | mS | 5 | ||||
| Thermal Shutdown | 160 | ℃ | 5 | ||||
| Thermal Hysteresis | 30 | ℃ | 5 | ||||
| Junction-to-ambient thermal resistance | RθJA | 105 | °C/W | Notes (1)(2): per JESD 51-7; simulated on 4-layer JEDEC board | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 55 | °C/W | 4 | |||
| Junction-to-board thermal resistance | RθJB | 17.5 | °C/W | 4 | |||
| Junction-to-top characterization parameter | ψJT | 3.5 | °C/W | 4 | |||
| Junction-to-board characterization parameter | ψJB | 17.5 | °C/W | 4 |
CAD (KiCad official)
- Symbol:
SK6252B - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
sk6252b-etched.step/sk6252b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sk6252b.step/sk6252b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Suntek datasheet (14 pp, sha256
255e9f9b56c10306, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).