# SK56_R1_00001

**PANJIT International** · Schottky Barrier Diodes (SBD) · DO-214AB(SMC)

SK56_R1_00001 from PANJIT International, in a DO-214AB(SMC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal, marked by the color band on the case; the part is rated 5 A average forward current with VRRM 20 to 60 V across the SK52~SK56 series. |
| 2 | Anode | passive | Anode terminal of the Schottky barrier rectifier; maximum forward voltage is 0.55 V (SK52/SK53) or 0.75 V at 5 A depending on the series grade. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | PANJIT International |
| Package | DO-214AB(SMC) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 60 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 42 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 60 | V |  | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 5 | A | TL=75°C | 1 |
| Peak Forward Surge Current | IFSM |  |  | 100 | A | 8.3ms single half sine-wave superimposed on rated load | 1 |
| Maximum Forward Voltage | VF |  |  | 0.75 | V | 5A (Note 1: pulse PW=300µsec, 1% duty cycle) | 1 |
| Maximum DC Reverse Current | IR |  |  | 0.1 | mA | TJ=25°C, rated DC blocking voltage | 1 |
| Maximum DC Reverse Current | IR |  |  | 20 | mA | TJ=100°C, rated DC blocking voltage | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance, junction to lead | RθJL |  | 17 |  | °C/W | Note 2: mounted on P.C. Board with 14mm2 copper pad areas | 1 |
| Typical Thermal Resistance, junction to ambient | RθJA |  | 55 |  | °C/W | Note 2: mounted on P.C. Board with 14mm2 copper pad areas | 1 |

## CAD (KiCad official)

- Symbol: `SK56_R1_00001`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: DO-214AB(SMC) (KiCad packages3D, STEP)
- 3D model files: `sk56-r1-00001-etched.step` / `sk56-r1-00001-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sk56-r1-00001.step` / `sk56-r1-00001.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [PANJIT International datasheet](docs/sk56-r1-00001-datasheet.pdf) (5 pp, sha256 `064b565cd619aa33`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sk56-r1-00001-datasheet.pdf)