# SK33

**SMC(Sangdest Microelectronicstronic (Nanjing))** · Schottky Barrier Diodes (SBD) · SMC(DO-214AB)

SK33 from SMC(Sangdest Microelectronicstronic (Nanjing)), in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SMC(Sangdest Microelectronicstronic (Nanjing)) |
| Package | SMC(DO-214AB) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage | VRRM |  |  | 30 | V |  | 1 |
| Working Peak Reverse Voltage | VRWM |  |  | 30 | V |  | 1 |
| DC Blocking Voltage | VR |  |  | 30 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 21 | V |  | 1 |
| Average Rectified Output Current | IO |  |  | 3 | A | @TL = 75°C | 1 |
| Non-Repetitive Peak Forward Surge Current | IFSM |  |  | 100 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 |
| Peak Reverse Current | IRM |  |  | 0.5 | mA | @TA = 25°C, at rated DC blocking voltage | 1 |
| Peak Reverse Current | IRM |  |  | 20 | mA | @TA = 100°C, at rated DC blocking voltage | 1 |
| Operating Temperature Range | TJ | -65 |  | 125 | °C |  | 1 |
| Storage Temperature Range | TSTG | -65 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance Junction to Ambient | RθJA |  | 55 |  | °C/W | Note 1: mounted on P.C. Board with 8.0mm2 copper pad areas | 1 |

## CAD (KiCad official)

- Symbol: `SK33`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files: `sk33-etched.step` / `sk33-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sk33.step` / `sk33.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SMC(Sangdest Microelectronicstronic (Nanjing)) datasheet](docs/sk33-datasheet.pdf) (4 pp, sha256 `9e9f84594ab32c1b`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sk33-datasheet.pdf)