# SK10U60AAP

**Shikues** · Schottky Diodes · TO-277

SK10U60AAP from Shikues, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the large exposed tab of the TO-277 package, per the page 1 symbol and 3D view. |
| 2 | A | passive | Anode lead, which must be electrically connected to pin 3 at the printed circuit board. |
| 3 | A | passive | Anode lead, which must be electrically connected to pin 2 at the printed circuit board. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shikues |
| Package | TO-277 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature Range | TJ | -55 |  | 125 | °C |  | 2 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 2 |
| Max. Repetitive Peak Reverse Voltage | VRRM | 62 |  | 70 | V | @0.5mA | 2 |
| Max. Average Forward Rectified Current | IF(AV) |  |  | 10 | A |  | 2 |
| Max. Reverse Current | IR |  | 30 | 70 | μA | @60V | 2 |
| Repetitive peak reverse voltage (Major Rating) | VRRM |  |  | 60 | V |  | 2 |
| Surge non repetitive forward current | IFSM |  |  | 300 | A | 10 ms sine or 6 ms rect. pulse | 2 |
| Maximum average forward current (Major Rating) | IF(AV) |  |  | 10 | A | Tc=35°C, 50% duty cycle, rectangular waveform | 2 |
| Maximum junction temperature | Tj(max) |  |  | 150 | °C |  | 1 |
| Typical thermal resistance, junction to ambient | RJA |  | 45 |  | °C/W | Free air, mounted on recommended PCB, 2oz pad area (note 1) | 2 |
| Typical thermal resistance, junction to mount | RJM |  | 1.3 |  | °C/W | Cathode pad 18.8mm x 14.4mm, anode pad 5.6mm x 14.4mm (note 2) | 2 |

## CAD (KiCad official)

- Symbol: `SK10U60AAP`
- Footprint: `Package_TO_SOT_SMD:TO-277A`
- 3D model: TO-277 (KiCad packages3D, STEP)
- 3D model files: `sk10u60aap-etched.step` / `sk10u60aap-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sk10u60aap.step` / `sk10u60aap.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shikues datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602998976224645120) (4 pp, sha256 `0fcdb230c9070bf9`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sk10u60aap-datasheet.pdf)