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SIT8008BI-21-YYS-12.000000

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SiTime Programmable Oscillators, SMD3225-4P. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SIT8008BI-21-YYS-12.000000

SiTime · Programmable Oscillators · SMD3225-4P

SIT8008BI-21-YYS-12.000000 from SiTime, in a SMD3225-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE/ST/NC input Factory-programmed as Output Enable (low puts OUT in high-Z, high gives the specified frequency), Standby (low puts the device in sleep at reduced current with output weakly pulled low, high resumes within 5 ms), or No Connect (no function); with OE or ST, a pull-up of 10 kΩ or less is recommended if the pin is not externally driven, with VIH of 70% Vdd and VIL of 30% Vdd.
2 GND power_in Electrical ground; a 0.1 µF or higher capacitor between VDD and GND is required.
3 OUT output Oscillator LVCMOS/HCMOS clock output at the specified frequency, with 20%-80% rise/fall time and 45-55% duty cycle per Table 1.
4 VDD power_in Power supply voltage, which must be within the rated range for the factory-programmed supply option; a 0.1 µF or higher capacitor to GND is required.

Key specifications

Parameter Value
Manufacturer SiTime
Package SMD3225-4P
Category Crystals, Oscillators, Resonators
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Frequency Range f 1 110 MHz 1
Supply Voltage (Vdd_YY option) Vdd_YY 1.62 3.63 V 1
Operating Temperature Range (Industrial) T_use -40 85 °C Industrial 1
Current Consumption Idd 3.8 4.5 mA No load condition, f = 20 MHz, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY 1
OE Disable Current I_OD 4.2 mA Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY. OE = GND, Output in high-Z state 1
Standby Current I_std 2.1 4.3 µA ST = GND, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY. Output is weakly pulled down 1
Duty Cycle DC 45 55 % All Vdds. See Duty Cycle definition in Figure 3 and Footnote 6 2
Rise/Fall Time (20% to 80%) Tr, Tf 2.7 ns 20% - 80% Vdd_YY 2
Output High Voltage VOH 90 % Vdd IOH = -4 mA (Vdd_3.0 and Vdd_3.3); IOH = -3 mA (Vdd_2.8 and Vdd_2.5); IOH = -2 mA (Vdd_1.8) 2
Output Low Voltage VOL 10 % Vdd IOL = 4 mA (Vdd_3.0 and Vdd_3.3); IOL = 3 mA (Vdd_2.8 and Vdd_2.5); IOL = 2 mA (Vdd_1.8) 2
Input High Voltage VIH 70 % Vdd Pin 1, OE or ST 2
Input Low Voltage VIL 30 % Vdd Pin 1, OE or ST 2
Input Pull-up Impedance Z_in 50 87 150 kΩ Pin 1, OE logic high or logic low, or ST logic high 2
Input Pull-up Impedance (ST logic low) Z_in 2 MΩ Pin 1, ST logic low 2
Startup Time T_start 5 ms Measured from the time Vdd reaches its rated minimum value 2
Enable/Disable Time T_oe 130 ns f = 110 MHz. For other frequencies, T_oe = 100 ns + 3 * cycles 2
Resume Time T_resume 5 ms Measured from the time ST pin crosses 50% threshold 2
RMS Period Jitter T_jitt 3.3 ps f = 75 MHz, Vdd_YY 2
Peak-to-peak Period Jitter T_pk 12 25 ps f = 75 MHz, Vdd_2.5, Vdd_2.8, Vdd_3.0, Vdd_3.3, Vdd_XX, Vdd_YY 2
RMS Phase Jitter (random) T_phj 1.4 ps f = 75 MHz, Integration bandwidth = 900 kHz to 7.5 MHz. Vdd_YY 2
RMS Phase Jitter (random) T_phj 2.3 ps f = 75 MHz, Integration bandwidth = 12 kHz to 20 MHz. Vdd_YY 2
Storage Temperature -65 150 °C 3
Supply Voltage (Vdd) Vdd -0.5 4 V 3
Electrostatic Discharge 2000 V 3
Soldering Temperature 260 °C Follow standard Pb free soldering guidelines 3
Junction Temperature 150 °C 3
Thermal Resistance Junction-to-Ambient (3225 package) θJA 109 °C/W 4 Layer Board 3
Thermal Resistance Junction-to-Ambient (3225 package) θJA 212 °C/W 2 Layer Board 3
Thermal Resistance Junction-to-Case Bottom (3225 package) θJC 27 °C/W Bottom 3
Maximum Operating Junction Temperature 95 °C Max operating ambient temperature 85°C 3
Maximum Operating Junction Temperature 80 °C Max operating ambient temperature 70°C 3

CAD (KiCad official)

  • Symbol: SIT8008BI-21-YYS-12.000000
  • Footprint: Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm
  • 3D model: SMD3225-4P (KiCad packages3D, STEP)
  • 3D model files: sit8008bi-21-yys-12-000000-etched.step / sit8008bi-21-yys-12-000000-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sit8008bi-21-yys-12-000000.step / sit8008bi-21-yys-12-000000.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SiTime datasheet (18 pp, sha256 fcdbddbb6ff5c9c4, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF