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Contents

README

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SIT65HVD08DR

SIT · RS-485 / RS-422 ICs · SOP-8

SIT65HVD08DR from SIT, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. Logic-high when A−B ≥ +200 mV, logic-low when A−B ≤ −200 mV. High-impedance (tri-state) when /RE is high. VOH ≥ VCC−1.5 V at IOUT = −4 mA; VOL ≤ 0.4 V at IOUT = +4 mA.
2 /RE input Receiver output enable, active-low. Logic-low enables the receiver output RO; logic-high places RO in a high-impedance state. VIH ≥ 2.0 V, VIL ≤ 0.8 V, input current ±2 µA max.
3 DE input Driver output enable, active-high. Logic-high enables the differential driver outputs on pins A and B; logic-low places the driver in a high-impedance state. With DE=0 and /RE=high the device enters low-current shutdown (typ. 0.1-0.4 µA).
4 DI input Driver input. When the driver is enabled, a logic-low on DI forces A low and B high; a logic-high on DI forces A high and B low. VIH ≥ 2.0 V, VIL ≤ 0.8 V.
5 GND power_in Ground reference (0 V).
6 A bidirectional Non-inverting RS-485/RS-422 bus pin. Driver output A when DE is high; receiver input A when /RE is low. Tolerates −15 V to +15 V bus fault voltage and ±16 kV contact-discharge ESD. Receiver input impedance ≥ 96 kΩ (1/8 unit load).
7 B bidirectional Inverting RS-485/RS-422 bus pin. Driver output B when DE is high; receiver input B when /RE is low. Tolerates −15 V to +15 V bus fault voltage and ±16 kV contact-discharge ESD. Receiver input impedance ≥ 96 kΩ (1/8 unit load).
8 VCC power_in Power supply, 3.0 V to 5.5 V nominal (absolute max +7 V). Typical supply current 430-510 µA active; ≤ 10 µA in shutdown. Bypass with a 100 nF ceramic capacitor to GND close to the pin.

Key specifications

Parameter Value
Manufacturer SIT
Package SOP-8
Category Interface
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • SIT65HVD08DR
  • SIT65HVD08DRD

CAD (KiCad official)

  • Symbol: SIT65HVD08DR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sit65hvd08dr-etched.step / sit65hvd08dr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sit65hvd08dr.step / sit65hvd08dr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SIT datasheet (14 pp, sha256 c6dca4fc6d9f01d7, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF