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SIP32509DT-T1-GE3

Vishay Intertech · AC-DC Controllers & Regulators · TSOT-23-6

SIP32509DT-T1-GE3 from Vishay Intertech, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	OUT	power_out	Output pin of the switch, tied internally with pin 2; includes 217 Ω typical output pulldown when disabled on SiP32509 only.
2	OUT	power_out	Output pin of the switch, tied internally with pin 1; supports up to 3 A maximum continuous switch current.
3	EN	input	Enable input compatible with TTL and CMOS logic, with VIL max 0.8 V and VIH min 1.8 V at VIN = 5 V, absolute maximum -0.3 to +6 V.
4	GND	power_in	Ground connection.
5	IN	power_in	Input pin of the switch, tied internally with pin 6; operating range 1.1 V to 5.5 V.
6	IN	power_in	Input pin of the switch, tied internally with pin 5; operating range 1.1 V to 5.5 V.

Key specifications

Parameter	Value
Manufacturer	Vishay Intertech
Package	TSOT-23-6
Category	Power Management ICs
Pins	6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Operating Voltage	VIN	1.1		5.5	V		2
Quiescent Current	IQ		10.5	17	μA	VIN = 1.2 V, EN = active	2
Quiescent Current	IQ		21	30	μA	VIN = 1.8 V, EN = active	2
Quiescent Current	IQ		34	50	μA	VIN = 2.5 V, EN = active	2
Quiescent Current	IQ		54	90	μA	VIN = 3.6 V, EN = active	2
Quiescent Current	IQ		68	110	μA	VIN = 4.3 V, EN = active	2
Quiescent Current	IQ		105	180	μA	VIN = 5 V, EN = active	2
Off Supply Current	IQ(off)			1	μA	EN = inactive, OUT = open	2
Off Switch Current	IDS(off)			1	μA	EN = inactive, OUT = GND	2
Reverse Blocking Current	IRB			10	μA	VOUT = 5 V, VIN = 0 V, VEN = inactive	2
On-Resistance	RDS(on)		47	54	mΩ	VIN = 1.2 V, IL = 100 mA, TA = 25 °C	2
On-Resistance	RDS(on)		44	52	mΩ	VIN = 1.8 V, IL = 100 mA, TA = 25 °C	2
On-Resistance	RDS(on)		46	52	mΩ	VIN = 5 V, IL = 100 mA, TA = 25 °C	2
On-Resistance Temp.-Coefficient	TCRDS		3570		ppm/°C		2
EN Input Low Voltage	VIL			0.3	V	VIN = 1.2 V	3
EN Input Low Voltage	VIL			0.4	V	VIN = 1.8 V	3
EN Input Low Voltage	VIL			0.5	V	VIN = 2.5 V	3
EN Input Low Voltage	VIL			0.6	V	VIN = 3.6 V	3
EN Input Low Voltage	VIL			0.7	V	VIN = 4.3 V	3
EN Input Low Voltage	VIL			0.8	V	VIN = 5 V	3
EN Input High Voltage	VIH	0.9			V	VIN = 1.2 V	3
EN Input High Voltage	VIH	1.2			V	VIN = 1.8 V	3
EN Input High Voltage	VIH	1.4			V	VIN = 2.5 V	3
EN Input High Voltage	VIH	1.6			V	VIN = 3.6 V	3
EN Input High Voltage	VIH	1.7			V	VIN = 4.3 V	3
EN Input High Voltage	VIH	1.8			V	VIN = 5 V	3
EN Input Leakage	ISINK	-1		1	μA	VEN = 5.5 V	3
Output Pulldown Resistance	RPD		217	280	Ω	EN = inactive, TA = 25 °C, (for SiP32509 only)	3
Output Turn-On Delay Time	td(on)		1.8		ms	VIN = 3.6 V, Rload = 10 Ω, TA = 25 °C	3
Output Turn-On Rise Time	t(on)	1.2	2.5	3.8	ms	VIN = 3.6 V, Rload = 10 Ω, TA = 25 °C	3
Output Turn-Off Delay Time	td(off)			0.001	ms	VIN = 3.6 V, Rload = 10 Ω, TA = 25 °C	3
Input Voltage Range	VIN	1.1		5.5	V		2
Operating Junction Temperature Range	TJ	-40		125	°C		2
Supply Input Voltage	VIN	-0.3		6	V		2
Enable Input Voltage	VEN	-0.3		6	V		2
Output Voltage	VOUT	-0.3		6	V		2
Maximum Continuous Switch Current	I max.			3	A	TA = 25 °C, see PCB layout	2
Maximum Repetitive Pulsed Current				6	A	1 ms, 10 % Duty Cycle	2
Maximum Non-Repetitive Pulsed Current				12	A	100 μs, EN = Active	2
ESD Rating (HBM)		8			kV	> 8 kV	2
Junction Temperature	TJ	-40		150	°C		2
Power Dissipation	PD			833	mW	Device mounted with all leads soldered or welded to PC board; derate 6.66 mW/°C above TA = 25 °C	2
Thermal Resistance	θJA		150		°C/W	Device mounted with all leads soldered or welded to PC board	2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts	copper		copper traces and vias for the IN and OUT pins should be	8

CAD (KiCad official)

Symbol: SIP32509DT-T1-GE3
Footprint: Package_TO_SOT_SMD:TSOT-23-6
3D model: TSOT-23-6 (KiCad packages3D, STEP)
3D model files: sip32509dt-t1-ge3-etched.step / sip32509dt-t1-ge3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sip32509dt-t1-ge3.step / sip32509dt-t1-ge3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Vishay Intertech datasheet (11 pp, sha256 3d769eab185af485, retrieved 2026-10-22, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF