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SI8663BC-B-IS1

Public Made by Adom

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Skyworks Solutions Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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SI8663BC-B-IS1

Skyworks Solutions · Digital Isolators · SOIC-16

SI8663BC-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Side 1 power supply, 2.5-5.5 V, requiring a 0.1 µF bypass capacitor to GND1 placed close to the package.
2 A1 input Side 1 digital input.
3 A2 input Side 1 digital input.
4 A3 input Side 1 digital input.
5 A4 output Side 1 digital output (Si8663 has 3 inputs on the VDD1 side, so this I/O pin is an output).
6 A5 output Side 1 digital output (Si8663 has 3 inputs on the VDD1 side, so this I/O pin is an output).
7 A6 output Side 1 digital output (Si8663 has 3 inputs on the VDD1 side, so this I/O pin is an output).
8 GND1 power_in Side 1 ground.
9 GND2 power_in Side 2 ground.
10 B6 input Side 2 digital input (Si8663 has 3 inputs on the VDD2 side, so this I/O pin is an input).
11 B5 input Side 2 digital input (Si8663 has 3 inputs on the VDD2 side, so this I/O pin is an input).
12 B4 input Side 2 digital input (Si8663 has 3 inputs on the VDD2 side, so this I/O pin is an input).
13 B3 output Side 2 digital output.
14 B2 output Side 2 digital output.
15 B1 output Side 2 digital output.
16 VDD2 power_in Side 2 power supply, 2.5-5.5 V, requiring a 0.1 µF bypass capacitor to GND2 placed close to the package.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Junction Operating Temperature TJ 150 °C 11
Ambient Operating Temperature TA -40 25 125 °C 11
Supply Voltage VDD1 VDD1 2.375 5.5 V 11
Supply Voltage VDD2 VDD2 2.375 5.5 V 11
Storage Temperature TSTG -65 150 °C 26
Ambient Temperature Under Bias TA -40 125 °C 26
Junction Temperature TJ 150 °C 26
Supply Voltage VDD1, VDD2 -0.5 7 V 26
Input Voltage VI -0.5 V max printed as VDD + 0.5 26
Output Voltage VO -0.5 V max printed as VDD + 0.5 26
Output Current Drive Channel IO 10 mA 26
Lead Solder Temperature 260 °C 10 s 26
Maximum Isolation (Input to Output) 4500 VRMS NB SOIC-16, 1 sec 26
IC Junction-to-Air Thermal Resistance θJA 105 °C/W NB SOIC-16 24
VDD Undervoltage Threshold (rising) VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising 11
VDD Undervoltage Threshold (falling) VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling 11
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 11
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 11
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 11
Input Hysteresis VHYS 0.38 0.44 0.5 V 11
High Level Input Voltage VIH 2 V 11
Low Level Input Voltage VIL 0.8 V 11
High Level Output Voltage (5 V) VOH 4.8 V loh = -4 mA; min printed VDD1,VDD2, 0.4; VDD = 5 V ±10% 11
Low Level Output Voltage VOL 0.2 0.4 V lol = 4 mA 11
Input Leakage Current IL -10 10 µA 11
DC Supply Current VDD1 (Si8663Bx, VI = 0) IDD1 2.6 3.9 mA All inputs 0 V or at supply; VI = 0(Bx) 12
DC Supply Current VDD1 (Si8663Bx, VI = 1) IDD1 6.5 9.1 mA All inputs 0 V or at supply; VI = 1(Bx) 12
1 Mbps Supply Current VDD1 (Si8663Bx) IDD1 4.9 6.8 mA All inputs = 500 kHz square wave, CI = 15 pF on all outputs 12
10 Mbps Supply Current VDD1 (Si8663Bx, 5 V) IDD1 5.7 8 mA All inputs = 5 MHz square wave, CI = 15 pF on all outputs; VDD = 5 V ±10% 13
100 Mbps Supply Current VDD1 (Si8663Bx, 5 V) IDD1 16.4 21.3 mA All inputs = 50 MHz square wave, CI = 15 pF on all outputs; VDD = 5 V ±10% 13
Maximum Data Rate 0 150 Mbps Si866xBx 13
Minimum Pulse Width 5 ns Si866xBx 13
Propagation Delay (5 V) tPHL, tPLH 5 8 13 ns See Figure 4.1 Propagation Delay Timing 13
Pulse Width Distortion /tPLH - tPHL/ (5 V) PWD 0.2 4.5 ns See Figure 4.1 Propagation Delay Timing 13
Propagation Delay Skew (5 V) tPSK(P-P) 2 4.5 ns 13
Channel-Channel Skew tPSK 0.4 2.5 ns 13
Output Rise Time tr 2.5 4 ns CL = 15 pF 13
Output Fall Time tf 2.5 4 ns CL = 15 pF 13
Common Mode Transient Immunity CMTI 35 50 kV/µs VI = VDD or 0 V, VCM = 1500 V 14
Startup Time tSU 15 40 µs 14
High Level Output Voltage (3.3 V) VOH 3.1 V loh = -4 mA; min printed VDD1,VDD2, 0.4; VDD = 3.3 V ±10% 15
10 Mbps Supply Current VDD1 (Si8663Bx, 3.3 V) IDD1 5.2 7.3 mA All inputs = 5 MHz square wave, CI = 15 pF on all outputs; VDD = 3.3 V ±10% 17
100 Mbps Supply Current VDD1 (Si8663Bx, 3.3 V) IDD1 12.3 15.9 mA All inputs = 50 MHz square wave, CI = 15 pF on all outputs; VDD = 3.3 V ±10% 17
High Level Output Voltage (2.5 V) VOH 2.3 V loh = -4 mA; min printed VDD1,VDD2, 0.4; VDD = 2.5 V ±5% 19
10 Mbps Supply Current VDD1 (Si8663Bx, 2.5 V) IDD1 5 7 mA All inputs = 5 MHz square wave, CI = 15 pF on all outputs; VDD = 2.5 V ±5% 20
100 Mbps Supply Current VDD1 (Si8663Bx, 2.5 V) IDD1 10.3 13.4 mA All inputs = 50 MHz square wave, CI = 15 pF on all outputs; VDD = 2.5 V ±5% 21
Propagation Delay (2.5 V) tPHL, tPLH 5 8 14 ns See Figure 4.1 Propagation Delay Timing; VDD = 2.5 V ±5% 21
Pulse Width Distortion /tPLH - tPHL/ (2.5 V) PWD 0.2 5 ns See Figure 4.1 Propagation Delay Timing; VDD = 2.5 V ±5% 21
Propagation Delay Skew (2.5 V) tPSK(P-P) 2 5 ns VDD = 2.5 V ±5% 21

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 32

CAD (KiCad official)

  • Symbol: SI8663BC-B-IS1
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: si8663bc-b-is1-etched.step / si8663bc-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8663bc-b-is1.step / si8663bc-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (42 pp, sha256 aea8c0805c804419, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF