component

SI8662AB-B-IS1

Public Made by Adom

by adom

Skyworks Solutions Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsignal isolation devicessi8662ab-b-is1factory-2.0.0extractor-text

Verified SI8662AB-B-IS1

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 16 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: SI8662AB-B-IS1 · SOIC-16 · 16 pins
  • ✓copper: 16 copper pads, none touching another net
  • ✓datasheet: all 16 pin names found in the 47-page datasheet
  • ✓distributor: lcsc C5918649, digikey SI8662AB-B-IS1-ND, mouser 634-SI8662AB-B-IS1
  • ✓family: SOIC-16_3.9x9.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-jeiro491/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height and body within the datasheet's package drawing (datasheet p.38)
  • ✓pads: 16 pins = 16 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 16 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ si8662ab-b-is1.kicad_sym✓ si8662ab-b-is1.kicad_mod✓ si8662ab-b-is1.step
Spot something wrong? Report it as an issue Propose a fix Records are signed by members of adom.
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 10h ago
viewers si8662ab-b-is1: viewers · Ray 10h ago
package.json Publish 0.1.0 · Ray 10h ago
page.json Set visibility: public · Ray 10h ago
README.md Publish 0.1.0 · Ray 10h ago
si8662ab-b-is1-etched.glb Publish 0.1.0 · Ray 10h ago
si8662ab-b-is1-etched.step si8662ab-b-is1: factory component page (tier=mfr) · Ray 10h ago
si8662ab-b-is1-hero.glb si8662ab-b-is1: hero GLB from the etched model (keeps the MPN mark) · Ray 10h ago
si8662ab-b-is1-hero.overlay.json Publish 0.1.0 · Ray 10h ago
si8662ab-b-is1.glb Publish 0.1.0 · Ray 10h ago
si8662ab-b-is1.kicad_mod Publish 0.1.0 · Ray 10h ago
si8662ab-b-is1.kicad_sym Publish 0.1.0 · Ray 10h ago
si8662ab-b-is1.lbr Publish 0.1.0 · Ray 10h ago
si8662ab-b-is1.step Publish 0.1.0 · Ray 10h ago
verification.json Verified: Published by the parts factory: tier mfr, 16 pins · Ray 10h ago

SI8662AB-B-IS1

Skyworks Solutions · Digital Isolators · SOIC-16

SI8662AB-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Side 1 power supply.
2 A1 input Side 1 digital input.
3 A2 input Side 1 digital input.
4 A3 input Side 1 digital input.
5 A4 bidirectional Side 1 digital input or output.
6 A5 bidirectional Side 1 digital input or output.
7 A6 bidirectional Side 1 digital input or output.
8 GND1 power_in Side 1 ground.
9 GND2 power_in Side 2 ground.
10 B6 bidirectional Side 2 digital input or output.
11 B5 bidirectional Side 2 digital input or output.
12 B4 bidirectional Side 2 digital input or output.
13 B3 output Side 2 digital output.
14 B2 output Side 2 digital output.
15 B1 output Side 2 digital output.
16 VDD2 power_in Side 2 power supply.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature TA -40 25 125 ºC 9
Supply Voltage VDD1 VDD1 2.5 5.5 V 9
Supply Voltage VDD2 VDD2 2.5 5.5 V 9
VDD Undervoltage Threshold (rising) VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising 15
VDD Undervoltage Threshold (falling) VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling 15
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 15
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 15
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 15
Input Hysteresis VHYS 0.38 0.44 0.5 V 15
High Level Input Voltage VIH 2 V 15
Low Level Input Voltage VIL 0.8 V 15
High Level Output Voltage VOH 3.1 V loh = -4 mA 15
Low Level Output Voltage VOL 0.2 0.4 V lol = 4 mA 15
Input Leakage Current IL -10 10 µA 16
DC Supply Current VDD1 (Si8662Ax) 2.2 3.3 mA All inputs 0 V or at supply; VI = 0(Ax) 18
DC Supply Current VDD2 (Si8662Ax) 3 4.5 mA All inputs 0 V or at supply; VI = 0(Ax) 18
DC Supply Current VDD1 (Si8662Ax) 7.5 10.5 mA All inputs 0 V or at supply; VI = 1(Ax) 18
DC Supply Current VDD2 (Si8662Ax) 5.6 8.4 mA All inputs 0 V or at supply; VI = 1(Ax) 18
1 Mbps Supply Current VDD1 (Si8662Ax) 5.1 7.1 mA All inputs = 500 kHz square wave, CI = 15 pF on all outputs 19
1 Mbps Supply Current VDD2 (Si8662Ax) 4.7 6.6 mA All inputs = 500 kHz square wave, CI = 15 pF on all outputs 19
Maximum Data Rate 0 1 Mbps 19
Minimum Pulse Width 250 ns 19
Propagation Delay tPHL, tPLH 35 ns See Figure 4.2 19
Pulse Width Distortion PWD 25 ns See Figure 4.2 19
Propagation Delay Skew (peak-to-peak) tPSK(P-P) 40 ns 19
Channel-Channel Skew tPSK 35 ns 19
Output Rise Time tr 2.5 4 ns CL = 15 pF 19
Output Fall Time tf 2.5 4 ns CL = 15 pF 20
Common Mode Transient Immunity CMTI 35 50 kV/µs VI = VDD or 0 V; VCM = 1500 V 20
Enable to Data Valid ten1 6 11 ns See Figure 4.1 20
Enable to Data Tri-State ten2 8 12 ns See Figure 4.1 20
Start-Up Time tSU 15 40 µs 20
Storage Temperature TSTG -65 150 ºC 29
Ambient Temperature Under Bias TA -40 125 ºC 29
Junction Temperature TJ 150 °C 29
Supply Voltage VDD1, VDD2 -0.5 7 V 29
Input Voltage VI -0.5 V Printed as VDD + 0.5 29
Output Voltage VO -0.5 V Printed as VDD + 0.5 29
Output Current Drive Channel (all devices unless otherwise stated) IO 10 mA All devices unless otherwise stated 29
Output Current Drive Channel (Si86xxxA-x-xx devices) IO 22 mA All Si86xxxA-x-xx devices 29
Latchup Immunity 100 V/ns Slew rate across GND1 and GND2 29
Lead Solder Temperature 260 ºC 10 s 29
Maximum Isolation (Input to Output), NB SOIC-16 and SOIC-8 4500 VRMS 1 sec 29
Maximum Isolation (Input to Output), WB SOIC-16 6500 VRMS 1 sec 29
IC Junction-to-Air Thermal Resistance, WB SOIC-16 θJA 100 ºC/W 27
IC Junction-to-Air Thermal Resistance, NB SOIC-16 θJA 105 ºC/W 27

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 38

CAD (KiCad official)

  • Symbol: SI8662AB-B-IS1
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: si8662ab-b-is1-etched.step / si8662ab-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8662ab-b-is1.step / si8662ab-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (47 pp, sha256 00fa9de0a782df1c, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF