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SI8661BC-B-IS1

Public Made by Adom

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Skyworks Solutions Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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SI8661BC-B-IS1

Skyworks Solutions · Digital Isolators · SOIC-16

SI8661BC-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Side 1 power supply, operating 2.5 V to 5.5 V and requiring a 0.1 µF bypass capacitor to GND1 placed close to the package.
2 A1 input Side 1 digital input.
3 A2 input Side 1 digital input.
4 A3 input Side 1 digital input.
5 A4 bidirectional Side 1 digital input or output, with direction set by the device channel configuration.
6 A5 bidirectional Side 1 digital input or output, with direction set by the device channel configuration.
7 A6 bidirectional Side 1 digital input or output, with direction set by the device channel configuration.
8 GND1 power_in Side 1 ground.
9 GND2 power_in Side 2 ground.
10 B6 bidirectional Side 2 digital input or output, with direction set by the device channel configuration.
11 B5 bidirectional Side 2 digital input or output, with direction set by the device channel configuration.
12 B4 bidirectional Side 2 digital input or output, with direction set by the device channel configuration.
13 B3 output Side 2 digital output.
14 B2 output Side 2 digital output.
15 B1 output Side 2 digital output.
16 VDD2 power_in Side 2 power supply, operating 2.5 V to 5.5 V and requiring a 0.1 µF bypass capacitor to GND2 placed close to the package.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package SOIC-16
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Junction Operating Temperature TJ 150 °C 11
Ambient Operating Temperature TA -40 25 125 °C 11
Supply Voltage VDD1 VDD1 2.375 5.5 V 11
Supply Voltage VDD2 VDD2 2.375 5.5 V 11
Storage Temperature TSTG -65 150 °C 26
Ambient Temperature Under Bias TA -40 125 °C 26
Junction Temperature TJ 150 °C 26
Supply Voltage VDD1, VDD2 -0.5 7 V 26
Output Current Drive Channel IO 10 mA 26
Lead Solder Temperature 260 °C 10 s 26
Maximum Isolation (Input to Output) 4500 VRMS NB SOIC-16, 1 sec 26
IC Junction-to-Air Thermal Resistance θJA 105 °C/W NB SOIC-16/QSOP-16 24
VDD Undervoltage Threshold rising VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising 11
VDD Undervoltage Threshold falling VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling 11
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 11
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 11
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 11
Input Hysteresis VHYS 0.38 0.44 0.5 V 11
High Level Input Voltage VIH 2 V 11
Low Level Input Voltage VIL 0.8 V 11
Low Level Output Voltage VOL 0.2 0.4 V Iol = 4 mA 11
Input Leakage Current IL -10 10 µA 11
VDD1 DC Supply Current, input low IDD1 1.7 2.7 mA Si8661Bx, VI = 0, 5 V 12
VDD2 DC Supply Current, input low IDD2 3.4 5.1 mA Si8661Bx, VI = 0, 5 V 12
VDD1 DC Supply Current, input high IDD1 7.9 11.1 mA Si8661Bx, VI = 1, 5 V 12
VDD2 DC Supply Current, input high IDD2 4.8 7.2 mA Si8661Bx, VI = 1, 5 V 12
VDD1 1 Mbps Supply Current IDD1 4.9 6.9 mA Si8661Bx, 500 kHz square wave, CI = 15 pF, 5 V 12
VDD2 1 Mbps Supply Current IDD2 4.6 6.4 mA Si8661Bx, 500 kHz square wave, CI = 15 pF, 5 V 12
VDD1 10 Mbps Supply Current, 5 V IDD1 5.2 7.3 mA Si8661Bx, 5 MHz square wave, CI = 15 pF, 5 V 12
VDD2 10 Mbps Supply Current, 5 V IDD2 6.1 8.5 mA Si8661Bx, 5 MHz square wave, CI = 15 pF, 5 V 12
VDD1 100 Mbps Supply Current, 5 V IDD1 8.8 11.8 mA Si8661Bx, 50 MHz square wave, CI = 15 pF, 5 V 13
VDD2 100 Mbps Supply Current, 5 V IDD2 23 29.8 mA Si8661Bx, 50 MHz square wave, CI = 15 pF, 5 V 13
VDD1 10 Mbps Supply Current, 3.3 V IDD1 5 7 mA Si8661Bx, 5 MHz square wave, CI = 15 pF, 3.3 V 17
VDD2 10 Mbps Supply Current, 3.3 V IDD2 5.3 7.4 mA Si8661Bx, 5 MHz square wave, CI = 15 pF, 3.3 V 17
VDD1 100 Mbps Supply Current, 3.3 V IDD1 7.4 9.9 mA Si8661Bx, 50 MHz square wave, CI = 15 pF, 3.3 V 17
VDD2 100 Mbps Supply Current, 3.3 V IDD2 16.4 21.3 mA Si8661Bx, 50 MHz square wave, CI = 15 pF, 3.3 V 17
VDD1 10 Mbps Supply Current, 2.5 V IDD1 5 6.9 mA Si8661Bx, 5 MHz square wave, CI = 15 pF, 2.5 V 20
VDD2 10 Mbps Supply Current, 2.5 V IDD2 4.9 6.9 mA Si8661Bx, 5 MHz square wave, CI = 15 pF, 2.5 V 20
VDD1 100 Mbps Supply Current, 2.5 V IDD1 6.7 9.1 mA Si8661Bx, 50 MHz square wave, CI = 15 pF, 2.5 V 21
VDD2 100 Mbps Supply Current, 2.5 V IDD2 13.4 17.4 mA Si8661Bx, 50 MHz square wave, CI = 15 pF, 2.5 V 21
Maximum Data Rate 0 150 Mbps Si866xBx 13
Minimum Pulse Width 5 ns Si866xBx 13
Propagation Delay, 5 V and 3.3 V tPHL, tPLH 5 8 13 ns See Figure 4.1; 5 V and 3.3 V tables 13
Propagation Delay, 2.5 V tPHL, tPLH 5 8 14 ns See Figure 4.1; 2.5 V table 21
Pulse Width Distortion, 5 V and 3.3 V PWD 0.2 4.5 ns /tPLH - tPHL/, See Figure 4.1; 5 V and 3.3 V tables 13
Pulse Width Distortion, 2.5 V PWD 0.2 5 ns /tPLH - tPHL/, See Figure 4.1; 2.5 V table 21
Propagation Delay Skew, 5 V and 3.3 V tPSK(P-P) 2 4.5 ns 5 V and 3.3 V tables 13
Propagation Delay Skew, 2.5 V tPSK(P-P) 2 5 ns 2.5 V table 21
Channel-Channel Skew tPSK 0.4 2.5 ns 13
Output Rise Time tr 2.5 4 ns CL = 15 pF 13
Output Fall Time tf 2.5 4 ns CL = 15 pF 13
Common Mode Transient Immunity CMTI 35 50 kV/µs VI = VDD or 0 V, VCM = 1500 V 14
Startup Time tSU 15 40 µs 14
High Level Output Voltage, 5 V VOH 4.8 V loh = -4 mA; min printed as VDD1,VDD2, 0.4 11
High Level Output Voltage, 3.3 V VOH 3.1 V loh = -4 mA; min printed as VDD1,VDD2, 0.4 15
High Level Output Voltage, 2.5 V VOH 2.3 V loh = -4 mA; min printed as VDD1,VDD2, 0.4 19
Output Impedance ZO 50 Ω nominal approx. 50 Ω, ±40% 11
Peak Eye Diagram Jitter tJIT(PK) 350 ps See Figure 2.3 Eye Diagram 13

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 32

CAD (KiCad official)

  • Symbol: SI8661BC-B-IS1
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: si8661bc-b-is1-etched.step / si8661bc-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8661bc-b-is1.step / si8661bc-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (42 pp, sha256 aea8c0805c804419, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF