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SI8651BB-B-IS1R

Public Made by Adom

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SKYWORKS SOLUTIONS, INC. Global Sourcing Parts, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SI8651BB-B-IS1R

SKYWORKS SOLUTIONS, INC. · Global Sourcing Parts · SOIC-16

SI8651BB-B-IS1R from SKYWORKS SOLUTIONS, INC., in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Side 1 power supply, 2.5-5.5 V, requires a 0.1 µF bypass capacitor to GND1 placed close to the package.
2 A1 input Side 1 digital input.
3 A2 input Side 1 digital input.
4 A3 input Side 1 digital input.
5 A4 input Side 1 digital input or output (input on the Si8651).
6 A5 bidirectional Side 1 digital input or output (the Si8651 diagram shows this as the reverse channel).
7 EN1 input Side 1 active-high enable input; may be left as NC.
8 GND1 power_in Side 1 ground.
9 GND2 power_in Side 2 ground.
10 EN2 input Side 2 active-high enable input; output goes to Hi-Z when low.
11 B5 bidirectional Side 2 digital input or output (the Si8651 diagram shows this as the reverse channel).
12 B4 output Side 2 digital input or output (output on the Si8651).
13 B3 output Side 2 digital output.
14 B2 output Side 2 digital output.
15 B1 output Side 2 digital output.
16 VDD2 power_in Side 2 power supply, 2.5-5.5 V, requires a 0.1 µF bypass capacitor to GND2 placed close to the package.

Key specifications

Parameter Value
Manufacturer SKYWORKS SOLUTIONS, INC.
Package SOIC-16
Category Global Sourcing Parts
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Junction Operating Temperature TJ 150 °C 12
Ambient Operating Temperature TA -40 25 125 °C 12
Supply Voltage VDD1 VDD1 2.375 5.5 V 12
Supply Voltage VDD2 VDD2 2.375 5.5 V 12
Storage Temperature TSTG -65 150 °C 25
Ambient Temperature Under Bias TA -40 125 °C 25
Junction Temperature TJ 150 °C 25
Supply Voltage VDD1, VDD2 -0.5 7 V 25
Input Voltage VI -0.5 V max printed as VDD + 0.5 V 25
Output Voltage VO -0.5 V max printed as VDD + 0.5 V 25
Output Current Drive Channel IO 10 mA All devices unless otherwise stated 25
Latchup Immunity 100 V/ns slew rate applied across GND1 and GND2 25
Lead Solder Temperature 260 °C 10 s 25
Maximum Isolation (Input to Output) 4500 VRMS 1 sec, NB SOIC-16, QSOP-16 25
IC Junction-to-Air Thermal Resistance θJA 105 °C/W NB SOIC-16/QSOP-16 24
VDD Undervoltage Threshold rising VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising 12
VDD Undervoltage Threshold falling VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling 12
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 12
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 12
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 12
Input Hysteresis VHYS 0.38 0.44 0.5 V 12
High Level Input Voltage VIH 2 V 12
Low Level Input Voltage VIL 0.8 V 12
High Level Output Voltage (5 V) VOH 4.8 V loh = -4 mA; min printed as VDD1,VDD2, 0.4; VDD = 5 V ±10% 12
Low Level Output Voltage (5 V) VOL 0.2 0.4 V lol = 4 mA 12
Input Leakage Current IL -10 10 μA 12
Enable Input High Current IENH 2 μA VENx = VIH 12
Enable Input Low Current IENL 2 μA VENx = VIL 12
Output Impedance ZO 50 Ω approximately 50 Ω, ±40% (note 1) 12
DC Supply Current VDD1, VI = 0 (Si8651Bx) 1.5 2.4 mA 5 V; All inputs 0 V or at supply; VI = 0(Bx) 13
DC Supply Current VDD2, VI = 0 (Si8651Bx) 2.7 4.1 mA 5 V; VI = 0(Bx) 13
DC Supply Current VDD1, VI = 1 (Si8651Bx) 6.6 9.2 mA 5 V; VI = 1(Bx) 13
DC Supply Current VDD2, VI = 1 (Si8651Bx) 4 6 mA 5 V; VI = 1(Bx) 13
1 Mbps Supply Current VDD1 (Si8651Bx) 4.2 5.8 mA 5 V; All inputs = 500 kHz square wave, CI = 15 pF on all outputs 13
1 Mbps Supply Current VDD2 (Si8651Bx) 3.8 5.3 mA 5 V; All inputs = 500 kHz square wave, CI = 15 pF on all outputs 13
10 Mbps Supply Current VDD1 (Si8651Bx) 4.4 6.2 mA 5 V; All inputs = 5 MHz square wave, CI = 15 pF on all outputs 13
10 Mbps Supply Current VDD2 (Si8651Bx) 4.9 6.9 mA 5 V; All inputs = 5 MHz square wave, CI = 15 pF on all outputs 13
100 Mbps Supply Current VDD1 (Si8651Bx) 8 10.8 mA 5 V; All inputs = 50 MHz square wave, CI = 15 pF on all outputs 14
100 Mbps Supply Current VDD2 (Si8651Bx) 18.4 24 mA 5 V; All inputs = 50 MHz square wave, CI = 15 pF on all outputs 14
Maximum Data Rate 0 150 Mbps Si865xBx 14
Minimum Pulse Width 5 ns Si865xBx 14
Propagation Delay (5 V) tPHL, tPLH 5 8 13 ns See Figure 4.2 Propagation Delay Timing 14
Pulse Width Distortion (5 V) PWD 0.2 4.5 ns /tPLH, tPHL/; See Figure 4.2 14
Propagation Delay Skew (5 V) tPSK(P-P) 2 4.5 ns 14
Channel-Channel Skew tPSK 0.4 2.5 ns 14
Output Rise Time tr 2.5 4 ns CL = 15 pF; See Figure 4.2 14
Output Fall Time tf 2.5 4 ns CL = 15 pF; See Figure 4.2 14
Common Mode Transient Immunity CMTI 35 50 kV/μs VI = VDD or 0 V; VCM = 1500 V 14
Enable to Data Valid ten1 6 11 ns See Figure 4.1 ENABLE Timing Diagram 14
Enable to Data Tri-State ten2 8 12 ns See Figure 4.1 ENABLE Timing Diagram 14
Start-up Time tSU 15 40 μs 14
High Level Output Voltage (3.3 V) VOH 3.1 V loh = -4 mA; VDD = 3.3 V ±10%; min printed as VDD1,VDD2, 0.4 16
High Level Output Voltage (2.5 V) VOH 2.3 V loh = -4 mA; VDD = 2.5 V ±5%; min printed as VDD1,VDD2, 0.4 18
100 Mbps Supply Current VDD1 (Si8651Bx, 3.3 V) 6.6 8.9 mA VDD = 3.3 V ±10%; All inputs = 50 MHz square wave, CI = 15 pF on all outputs 17
100 Mbps Supply Current VDD2 (Si8651Bx, 3.3 V) 13.2 17.1 mA VDD = 3.3 V ±10%; All inputs = 50 MHz square wave, CI = 15 pF on all outputs 17
100 Mbps Supply Current VDD1 (Si8651Bx, 2.5 V) 6 8.1 mA VDD = 2.5 V ±5%; All inputs = 50 MHz square wave, CI = 15 pF on all outputs 20
100 Mbps Supply Current VDD2 (Si8651Bx, 2.5 V) 10.8 14 mA VDD = 2.5 V ±5%; All inputs = 50 MHz square wave, CI = 15 pF on all outputs 20
Propagation Delay (2.5 V) tPHL, tPLH 5 8 14 ns VDD = 2.5 V ±5%; See Figure 4.2 20
Pulse Width Distortion (2.5 V) PWD 0.2 5 ns VDD = 2.5 V ±5%; /tPLH - tPHL/ 20
Propagation Delay Skew (2.5 V) tPSK(P-P) 2 5 ns VDD = 2.5 V ±5% 20

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 32

CAD (KiCad official)

  • Symbol: SI8651BB-B-IS1R
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: si8651bb-b-is1r-etched.step / si8651bb-b-is1r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8651bb-b-is1r.step / si8651bb-b-is1r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SKYWORKS SOLUTIONS, INC. datasheet (43 pp, sha256 09d461e7e459e538, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF