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SI8641AB-B-IS1
Public Made by Adomby adom
Skyworks Solutions Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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SI8641AB-B-IS1
Skyworks Solutions · Digital Isolators · SOIC-16
SI8641AB-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Side 1 power supply input; the datasheet specifies a supply range of 2.5 to 5.5 V. |
| 2 | GND1 | power_in | Side 1 ground; for narrow-body devices this pin must be externally connected to the Side 1 ground. |
| 3 | A1 | input | Side 1 digital input. |
| 4 | A2 | input | Side 1 digital input. |
| 5 | A3 | bidirectional | Side 1 digital input or output. |
| 6 | A4 | bidirectional | Side 1 digital input or output. |
| 7 | EN1 | input | Side 1 active high enable input for the Si8641 (this pin is NC on the Si8640). |
| 8 | GND1 | power_in | Side 1 ground; for narrow-body devices this pin must be externally connected to the Side 1 ground. |
| 9 | GND2 | power_in | Side 2 ground; for narrow-body devices this pin must also be connected to external ground. |
| 10 | EN2 | input | Side 2 active high enable input. |
| 11 | B4 | bidirectional | Side 2 digital input or output. |
| 12 | B3 | bidirectional | Side 2 digital input or output. |
| 13 | B2 | output | Side 2 digital output. |
| 14 | B1 | output | Side 2 digital output. |
| 15 | GND2 | power_in | Side 2 ground; for narrow-body devices this pin must also be connected to external ground. |
| 16 | VDD2 | power_in | Side 2 power supply input; the datasheet specifies a supply range of 2.5 to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Skyworks Solutions |
| Package | SOIC-16 |
| Category | Signal Isolation Devices |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Ambient Operating Temperature | TA | -40 | 25 | 125 | ºC | 9 | |
| Supply Voltage VDD1 | VDD1 | 2.5 | 5.5 | V | 9 | ||
| Supply Voltage VDD2 | VDD2 | 2.5 | 5.5 | V | 9 | ||
| Storage Temperature | TSTG | -65 | 150 | ºC | 29 | ||
| Ambient Temperature Under Bias | TA | -40 | 125 | ºC | 29 | ||
| Junction Temperature | TJ | 150 | °C | 29 | |||
| Supply Voltage | VDD1, VDD2 | -0.5 | 7 | V | 29 | ||
| Input Voltage | VI | -0.5 | V | Printed max is VDD + 0.5 V | 29 | ||
| Output Voltage | VO | -0.5 | V | Printed max is VDD + 0.5 V | 29 | ||
| Output Current Drive Channel (all devices unless otherwise stated) | IO | 10 | mA | All devices unless otherwise stated | 29 | ||
| Latchup Immunity | 100 | V/ns | Slew rate applied across GND1 and GND2 | 29 | |||
| Lead Solder Temperature | 260 | ºC | 10 s | 29 | |||
| Maximum Isolation (Input to Output) | 4500 | VRMS | 1 sec, NB SOIC-16, SOIC-8 | 29 | |||
| Maximum Isolation (Input to Output) | 6500 | VRMS | 1 sec, WB SOIC-16 | 29 | |||
| VDD Undervoltage Threshold rising | VDDUV+ | 1.95 | 2.24 | 2.375 | V | VDD1, VDD2 rising (5 V table) | 9 |
| VDD Undervoltage Threshold falling | VDDUV- | 1.88 | 2.16 | 2.325 | V | VDD1, VDD2 falling (5 V table) | 9 |
| VDD Undervoltage Hysteresis | VDDHYS | 50 | 70 | 95 | mV | 5 V table | 9 |
| Positive-Going Input Threshold | VT+ | 1.4 | 1.67 | 1.9 | V | All inputs rising | 9 |
| Negative-Going Input Threshold | VT- | 1 | 1.23 | 1.4 | V | All inputs falling | 9 |
| Input Hysteresis | VHYS | 0.38 | 0.44 | 0.5 | V | 9 | |
| High Level Input Voltage | VIH | 2 | V | 9 | |||
| Low Level Input Voltage | VIL | 0.8 | V | 9 | |||
| High Level Output Voltage | VOH | 4.8 | V | loh = -4 mA; VDD1,VDD2, 0.4 (5 V table) | 9 | ||
| Low Level Output Voltage | VOL | 0.2 | 0.4 | V | lol = 4 mA (5 V table) | 9 | |
| Input Leakage Current | IL | -10 | 10 | µA | 9 | ||
| DC Supply Current VDD1 (Si8641Ax) | VDD1 | 1.4 | 2.2 | mA | All inputs 0 V or at supply; VI = 0(Ax) (5 V table) | 10 | |
| DC Supply Current VDD2 (Si8641Ax) | VDD2 | 2.3 | 3.7 | mA | All inputs 0 V or at supply; VI = 0(Ax) (5 V table) | 10 | |
| DC Supply Current VDD1 (Si8641Ax) | VDD1 | 5.2 | 7.8 | mA | All inputs 0 V or at supply; VI = 1(Ax) (5 V table) | 10 | |
| DC Supply Current VDD2 (Si8641Ax) | VDD2 | 3.6 | 5.4 | mA | All inputs 0 V or at supply; VI = 1(Ax) (5 V table) | 10 | |
| 1 Mbps Supply Current VDD1 (Si8641Ax) | VDD1 | 3.4 | 4.8 | mA | All inputs = 500 kHz square wave, CI = 15 pF on all Outputs (5 V table) | 12 | |
| 1 Mbps Supply Current VDD2 (Si8641Ax) | VDD2 | 3.3 | 4.6 | mA | All inputs = 500 kHz square wave, CI = 15 pF on all Outputs (5 V table) | 12 | |
| Maximum Data Rate | 0 | 1 | Mbps | All models | 13 | ||
| Minimum Pulse Width | 250 | ns | 13 | ||||
| Propagation Delay | tPHL, tPLH | 35 | ns | See Figure 4.2 | 13 | ||
| Pulse Width Distortion | PWD | 25 | ns | /tPLH, tPHL/; See Figure 4.2 | 13 | ||
| Propagation Delay Skew | tPSK(P-P) | 40 | ns | 13 | |||
| Channel-Channel Skew | tPSK | 35 | ns | 13 | |||
| Output Rise Time | tr | 2.5 | 4 | ns | CL = 15 pF; See Figure 4.2 | 13 | |
| Output Fall Time | tf | 2.5 | 4 | ns | CL = 15 pF; See Figure 4.2 | 13 | |
| Common Mode Transient Immunity | CMTI | 35 | 50 | kV/µs | VI = VDD or 0 V; VCM = 1500 V | 13 | |
| Enable to Data Valid | ten1 | 6 | 11 | ns | See Figure 4.1 | 13 | |
| Enable to Data Tri-State | ten2 | 8 | 12 | ns | See Figure 4.1 | 13 | |
| Start-up Time | tSU | 15 | 40 | µs | 14 | ||
| Peak Eye Diagram Jitter | tJIT(PK) | 350 | ps | See Figure 2.2 | 13 | ||
| Enable Input High Current | ΙENH | 2 | µA | VENx = VIH | 9 | ||
| Enable Input Low Current | IENL | 2 | µA | VENx = VIL | 9 | ||
| Output Impedance | ZO | 50 | Ω | Nominal, approximately 50 Ω ±40% | 9 | ||
| IC Junction-to-Air Thermal Resistance | θJA | 100 | ºC/W | WB SOIC-16 | 27 | ||
| IC Junction-to-Air Thermal Resistance | θJA | 105 | ºC/W | NB SOIC-16 | 27 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. | 38 |
CAD (KiCad official)
- Symbol:
SI8641AB-B-IS1 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
si8641ab-b-is1-etched.step/si8641ab-b-is1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);si8641ab-b-is1.step/si8641ab-b-is1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Skyworks Solutions datasheet (47 pp, sha256
00fa9de0a782df1c, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).