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verification.json Verified: Published by the parts factory: tier mfr, 16 pins · Ray 10h ago

SI8641AB-B-IS1

Skyworks Solutions · Digital Isolators · SOIC-16

SI8641AB-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Side 1 power supply input; the datasheet specifies a supply range of 2.5 to 5.5 V.
2 GND1 power_in Side 1 ground; for narrow-body devices this pin must be externally connected to the Side 1 ground.
3 A1 input Side 1 digital input.
4 A2 input Side 1 digital input.
5 A3 bidirectional Side 1 digital input or output.
6 A4 bidirectional Side 1 digital input or output.
7 EN1 input Side 1 active high enable input for the Si8641 (this pin is NC on the Si8640).
8 GND1 power_in Side 1 ground; for narrow-body devices this pin must be externally connected to the Side 1 ground.
9 GND2 power_in Side 2 ground; for narrow-body devices this pin must also be connected to external ground.
10 EN2 input Side 2 active high enable input.
11 B4 bidirectional Side 2 digital input or output.
12 B3 bidirectional Side 2 digital input or output.
13 B2 output Side 2 digital output.
14 B1 output Side 2 digital output.
15 GND2 power_in Side 2 ground; for narrow-body devices this pin must also be connected to external ground.
16 VDD2 power_in Side 2 power supply input; the datasheet specifies a supply range of 2.5 to 5.5 V.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature TA -40 25 125 ºC 9
Supply Voltage VDD1 VDD1 2.5 5.5 V 9
Supply Voltage VDD2 VDD2 2.5 5.5 V 9
Storage Temperature TSTG -65 150 ºC 29
Ambient Temperature Under Bias TA -40 125 ºC 29
Junction Temperature TJ 150 °C 29
Supply Voltage VDD1, VDD2 -0.5 7 V 29
Input Voltage VI -0.5 V Printed max is VDD + 0.5 V 29
Output Voltage VO -0.5 V Printed max is VDD + 0.5 V 29
Output Current Drive Channel (all devices unless otherwise stated) IO 10 mA All devices unless otherwise stated 29
Latchup Immunity 100 V/ns Slew rate applied across GND1 and GND2 29
Lead Solder Temperature 260 ºC 10 s 29
Maximum Isolation (Input to Output) 4500 VRMS 1 sec, NB SOIC-16, SOIC-8 29
Maximum Isolation (Input to Output) 6500 VRMS 1 sec, WB SOIC-16 29
VDD Undervoltage Threshold rising VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising (5 V table) 9
VDD Undervoltage Threshold falling VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling (5 V table) 9
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 5 V table 9
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 9
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 9
Input Hysteresis VHYS 0.38 0.44 0.5 V 9
High Level Input Voltage VIH 2 V 9
Low Level Input Voltage VIL 0.8 V 9
High Level Output Voltage VOH 4.8 V loh = -4 mA; VDD1,VDD2, 0.4 (5 V table) 9
Low Level Output Voltage VOL 0.2 0.4 V lol = 4 mA (5 V table) 9
Input Leakage Current IL -10 10 µA 9
DC Supply Current VDD1 (Si8641Ax) VDD1 1.4 2.2 mA All inputs 0 V or at supply; VI = 0(Ax) (5 V table) 10
DC Supply Current VDD2 (Si8641Ax) VDD2 2.3 3.7 mA All inputs 0 V or at supply; VI = 0(Ax) (5 V table) 10
DC Supply Current VDD1 (Si8641Ax) VDD1 5.2 7.8 mA All inputs 0 V or at supply; VI = 1(Ax) (5 V table) 10
DC Supply Current VDD2 (Si8641Ax) VDD2 3.6 5.4 mA All inputs 0 V or at supply; VI = 1(Ax) (5 V table) 10
1 Mbps Supply Current VDD1 (Si8641Ax) VDD1 3.4 4.8 mA All inputs = 500 kHz square wave, CI = 15 pF on all Outputs (5 V table) 12
1 Mbps Supply Current VDD2 (Si8641Ax) VDD2 3.3 4.6 mA All inputs = 500 kHz square wave, CI = 15 pF on all Outputs (5 V table) 12
Maximum Data Rate 0 1 Mbps All models 13
Minimum Pulse Width 250 ns 13
Propagation Delay tPHL, tPLH 35 ns See Figure 4.2 13
Pulse Width Distortion PWD 25 ns /tPLH, tPHL/; See Figure 4.2 13
Propagation Delay Skew tPSK(P-P) 40 ns 13
Channel-Channel Skew tPSK 35 ns 13
Output Rise Time tr 2.5 4 ns CL = 15 pF; See Figure 4.2 13
Output Fall Time tf 2.5 4 ns CL = 15 pF; See Figure 4.2 13
Common Mode Transient Immunity CMTI 35 50 kV/µs VI = VDD or 0 V; VCM = 1500 V 13
Enable to Data Valid ten1 6 11 ns See Figure 4.1 13
Enable to Data Tri-State ten2 8 12 ns See Figure 4.1 13
Start-up Time tSU 15 40 µs 14
Peak Eye Diagram Jitter tJIT(PK) 350 ps See Figure 2.2 13
Enable Input High Current ΙENH 2 µA VENx = VIH 9
Enable Input Low Current IENL 2 µA VENx = VIL 9
Output Impedance ZO 50 Ω Nominal, approximately 50 Ω ±40% 9
IC Junction-to-Air Thermal Resistance θJA 100 ºC/W WB SOIC-16 27
IC Junction-to-Air Thermal Resistance θJA 105 ºC/W NB SOIC-16 27

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 38

CAD (KiCad official)

  • Symbol: SI8641AB-B-IS1
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: si8641ab-b-is1-etched.step / si8641ab-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8641ab-b-is1.step / si8641ab-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (47 pp, sha256 00fa9de0a782df1c, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF