SI8631BC-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD1	power_in	Side 1 power supply, operating range 2.5-5.5 V, requires a 0.1 µF bypass capacitor to GND1.
2	GND1	power_in	Side 1 ground; on narrow-body devices it must be externally connected to ground.
3	A1	input	Side 1 digital input.
4	A2	input	Side 1 digital input.
5	A3	bidirectional	Side 1 digital input or output.
6	NC	unconnected	No connect; not internally connected and can be left floating, tied to VDD or tied to GND.
7	EN1	input	Side 1 active-high enable (EN1 on Si8631; NC on Si8630/35); can be left NC, but should be tied to a logic level in noisy environments.
8	GND1	power_in	Side 1 ground; on narrow-body devices it must be externally connected to ground.
9	GND2	power_in	Side 2 ground; on narrow-body devices it must be externally connected to ground.
10	EN2	input	Side 2 active-high enable (NC on Si8635); output is high-impedance when low.
11	NC	unconnected	No connect; not internally connected and can be left floating, tied to VDD or tied to GND.
12	B3	bidirectional	Side 2 digital input or output.
13	B2	output	Side 2 digital output.
14	B1	output	Side 2 digital output.
15	GND2	power_in	Side 2 ground; on narrow-body devices it must be externally connected to ground.
16	VDD2	power_in	Side 2 power supply, operating range 2.5-5.5 V, requires a 0.1 µF bypass capacitor to GND2.

Key specifications

Parameter	Value
Manufacturer	Skyworks Solutions
Package	SOIC-16
Category	Signal Isolation Devices
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
VDD Undervoltage Threshold rising	VDDUV+	1.95	2.24	2.375	V	VDD1, VDD2 rising	11
VDD Undervoltage Threshold falling	VDDUV-	1.88	2.16	2.325	V	VDD1, VDD2 falling	11
VDD Undervoltage Hysteresis	VDDHYS	50	70	95	mV		11
Positive-Going Input Threshold	VT+	1.4	1.67	1.9	V	All inputs rising	11
Negative-Going Input Threshold	VT-	1	1.23	1.4	V	All inputs falling	11
Input Hysteresis	VHYS	0.38	0.44	0.5	V		11
High Level Input Voltage	VIH	2			V		11
Low Level Input Voltage	VIL			0.8	V		11
High Level Output Voltage (5 V)	VOH		4.8		V	Ioh = -4 mA; min printed as VDD1, VDD2, 0.4; VDD = 5 V ±10%	11
High Level Output Voltage (3.3 V)	VOH		3.1		V	Ioh = -4 mA; min printed as VDD1, VDD2, 0.4; VDD = 3.3 V ±10%	15
High Level Output Voltage (2.5 V)	VOH		2.3		V	Ioh = -4 mA; min printed as VDD1, VDD2, 0.4; VDD = 2.5 V ±5%	18
Low Level Output Voltage	VOL		0.2	0.4	V	Iol = 4 mA	11
Input Leakage Current (Si863xxA/B/C/D)	IL			10	µA	printed as ±10	11
Enable Input Current (Si863xxA/B/C/D)	IENH, IENL		2		µA	VENx = VIH or VIL	11
DC Supply Current VDD1, VI = 0 (5 V)			1.3	2.1	mA	Si8631Bx; VI = 0(Bx); VDD = 5 V ±10%	12
DC Supply Current VDD2, VI = 0 (5 V)			1.7	2.7	mA	Si8631Bx; VI = 0(Bx); VDD = 5 V ±10%	12
DC Supply Current VDD1, VI = 1 (5 V)			3.9	5.9	mA	Si8631Bx; VI = 1(Bx); VDD = 5 V ±10%	12
DC Supply Current VDD2, VI = 1 (5 V)			3	4.5	mA	Si8631Bx; VI = 1(Bx); VDD = 5 V ±10%	12
1 Mbps Supply Current VDD1 (5 V)			2.7	3.8	mA	Si8631Bx; 500 kHz square wave, CI = 15 pF; VDD = 5 V ±10%	12
1 Mbps Supply Current VDD2 (5 V)			2.6	3.6	mA	Si8631Bx; 500 kHz square wave, CI = 15 pF; VDD = 5 V ±10%	12
10 Mbps Supply Current VDD1 (5 V)			3	4.2	mA	Si8631Bx; 5 MHz square wave, CI = 15 pF; VDD = 5 V ±10%	12
10 Mbps Supply Current VDD2 (5 V)			3.1	4.4	mA	Si8631Bx; 5 MHz square wave, CI = 15 pF; VDD = 5 V ±10%	12
100 Mbps Supply Current VDD1 (5 V)			6.6	8.8	mA	Si8631Bx; 50 MHz square wave, CI = 15 pF; VDD = 5 V ±10%	12
100 Mbps Supply Current VDD2 (5 V)			9.9	13.4	mA	Si8631Bx; 50 MHz square wave, CI = 15 pF; VDD = 5 V ±10%	12
100 Mbps Supply Current VDD1 (3.3 V)			5.2	7	mA	Si8631Bx; 50 MHz square wave, CI = 15 pF; VDD = 3.3 V ±10%	16
100 Mbps Supply Current VDD2 (3.3 V)			7.3	9.8	mA	Si8631Bx; 50 MHz square wave, CI = 15 pF; VDD = 3.3 V ±10%	16
100 Mbps Supply Current VDD1 (2.5 V)			4.5	6.1	mA	Si8631Bx; 50 MHz square wave, CI = 15 pF; VDD = 2.5 V ±5%	19
100 Mbps Supply Current VDD2 (2.5 V)			6.1	8.2	mA	Si8631Bx; 50 MHz square wave, CI = 15 pF; VDD = 2.5 V ±5%	19
Maximum Data Rate		0		150	Mbps	Si863xBx, Ex	12
Minimum Pulse Width				5	ns		13
Propagation Delay (5 V and 3.3 V)	tPHL, tPLH	5	8	13	ns	See Figure 4.2; VDD = 5 V ±10% or 3.3 V ±10%	13
Propagation Delay (2.5 V)	tPHL, tPLH	5	8	14	ns	See Figure 4.2; VDD = 2.5 V ±5%	19
Pulse Width Distortion (5 V and 3.3 V)	PWD		0.2	4.5	ns	/tPLH, tPHL/; See Figure 4.2; VDD = 5 V ±10% or 3.3 V ±10%	13
Pulse Width Distortion (2.5 V)	PWD		0.2	5	ns	/tPLH -tPHL/; See Figure 4.2; VDD = 2.5 V ±5%	19
Propagation Delay Skew (5 V and 3.3 V)	tPSK(P-P)		2	4.5	ns	VDD = 5 V ±10% or 3.3 V ±10%	13
Propagation Delay Skew (2.5 V)	tPSK(P-P)		2	5	ns	VDD = 2.5 V ±5%	19
Channel-Channel Skew	tPSK		0.4	2.5	ns		13
Output Rise Time	tr		2.5	4	ns	CL = 15 pF; See Figure 4.2	13
Output Fall Time	tf		2.5	4	ns	CL = 15 pF; See Figure 4.2	13
Common Mode Transient Immunity (Si86xxxB/C/D)	CMTI	35	50		kV/µs	VI = VDD or 0 V; VCM = 1500 V; See Figure 4.3	13
Enable to Data Valid	ten1		6	11	ns	See Figure 4.1	13
Enable to Data Tri-State	ten2		8	12	ns	See Figure 4.1	13
Input power loss to valid default output	tSD		8	12	ns	See Figure 3.1	13
Start-up Time	tSU		15	40	µs		13
Ambient Operating Temperature	TA	-40	25	125	°C		11
Supply Voltage VDD1	VDD1	2.5		5.5	V		11
Supply Voltage VDD2	VDD2	2.5		5.5	V		11
Storage Temperature	TSTG	-65		150	°C		25
Junction Temperature	TJ			150	°C		25
Supply Voltage	VDD1, VDD2	-0.5		7	V		25
Input Voltage	VI	-0.5			V	max printed as VDD + 0.5	25
Output Voltage	VO	-0.5			V	max printed as VDD + 0.5	25
Output Current Drive Channel	IO			10	mA		25
Lead Solder Temperature				260	°C	10 s	25
Maximum Isolation (Input to Output), NB SOIC-16				4500	VRMS	1 sec	25
IC Junction-to-Air Thermal Resistance, NB SOIC-16	θJA		105		°C/W		24
Capacitance (Input-Output)	CIO		2		pF	f = 1 MHz	22

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	PC		4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.	31

CAD (KiCad official)

Symbol: SI8631BC-B-IS1
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16 (KiCad packages3D, STEP)
3D model files: si8631bc-b-is1-etched.step / si8631bc-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8631bc-b-is1.step / si8631bc-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Skyworks Solutions datasheet (38 pp, sha256 c69ba44cca206b60, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

SI8631BC-B-IS1

Verified SI8631BC-B-IS1

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README