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SI8602AB-B-IS

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Skyworks Solutions I2C Isolators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsignal isolation devicessi8602ab-b-isfactory-2.0.0extractor-text

Verified SI8602AB-B-IS

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: SI8602AB-B-IS · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 39-page datasheet
  • ✓distributor: lcsc C7315672, digikey SI8602AB-B-IS-ND, mouser 634-SI8602AB-B-IS
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-asxq7mn2/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height and body within the datasheet's package drawing (datasheet p.29)
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ si8602ab-b-is.kicad_sym✓ si8602ab-b-is.kicad_mod✓ si8602ab-b-is.step
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Ray Publish 0.1.0 f9edaee 14h ago

SI8602AB-B-IS

Skyworks Solutions · I2C Isolators · SOIC-8

SI8602AB-B-IS from Skyworks Solutions, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AVDD power_in Side A power supply terminal; connect to a source of 3.0 to 5.5 V.
2 ASDA bidirectional Side A data (open drain) input or output.
3 ASCL input Side A clock input; standard CMOS input for Si8602.
4 AGND power_in Side A ground terminal.
5 BGND power_in Side B ground terminal.
6 BSCL output Side B clock output; push-pull output for Si8602.
7 BSDA bidirectional Side B data (open drain) input or output.
8 BVDD power_in Side B power supply terminal; connect to a source of 3.0 to 5.5 V.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package SOIC-8
Category Signal Isolation Devices
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature TA -40 25 125 °C 13
Supply Voltage AVDD AVDD 3 5.5 V 13
Supply Voltage BVDD BVDD 3 5.5 V 13
Si8602 AVDD Current Idda 1.8 2.7 mA All channels = 0 dc 13
Si8602 BVDD Current Iddb 1.8 2.7 mA All channels = 0 dc 13
Si8602 AVDD Current Idda 4.7 7.1 mA All channels = 1 dc 13
Si8602 BVDD Current Iddb 3.1 4.7 mA All channels = 1 dc 13
Si8602 AVDD Current Idda 2.5 3.8 mA All channels = 1.7 MHz 13
Si8602 BVDD Current Iddb 2.1 3.2 mA All channels = 1.7 MHz 13
I2C Logic Input Threshold (Side A) I2CVT (Side A) 410 540 mV 14
I2C Logic Low Output Voltage (Side A) I2CVOL (Side A) 540 800 mV ISDAA, ISCLA (>0.5 mA, <3.0 mA) 14
I2C Input/Output Logic Low Level Difference (Side A) I2CΔV (Side A) 50 mV ISDAA, ISCLA (>0.5 mA, <3.0 mA) 14
Logic Low Input Voltage (Side B) I2CVIL (Side B) 0.8 V 14
Logic High Input Voltage (Side B) I2CVIH (Side B) 2 V 14
Logic Low Output Voltage (Side B) I2CVOL (Side B) 500 mV ISCLB = 35 mA 14
SCL and SDA Logic High Leakage Isdaa, Isdab, Iscla, Isclb 2 10 µA SDAA, SCLA = VSSA; SDAB, SCLB = VSSB 14
Pin Capacitance Side A CA 10 pF 14
Pin Capacitance Side B CB 10 pF 14
Maximum I2C Bus Frequency Fmax 1.7 MHz 15
Propagation Delay Side A to B Rising, 5 V Tphab 38 45 ns No bus capacitance, R1 = 1400, R2 = 499; Side A measured at 0.6 V 15
Propagation Delay Side A to B Falling, 5 V Tplab 15 26 ns No bus capacitance, R1 = 1400, R2 = 499; Side A measured at 0.6 V 15
Propagation Delay Side B to A Rising, 5 V Tphba 33 46 ns No bus capacitance, R1 = 1400, R2 = 499 15
Propagation Delay Side B to A Falling, 5 V Tplba 11 22 ns No bus capacitance, R1 = 1400, R2 = 499 15
Propagation Delay Side A to B Rising, 3.3 V Tphab 44 55 ns No bus capacitance, R1 = 806, R2 = 499; Side A measured at 0.6 V 15
Propagation Delay Side A to B Falling, 3.3 V Tplab 17 29 ns No bus capacitance, R1 = 806, R2 = 499; Side A measured at 0.6 V 15
Propagation Delay Side B to A Rising, 3.3 V Tphba 30 40 ns No bus capacitance, R1 = 806, R2 = 499 15
Propagation Delay Side B to A Falling, 3.3 V Tplba 14 27 ns No bus capacitance, R1 = 806, R2 = 499 15
Pulse Width Distortion Side A Low to Side B Low, 5 V PWDAB 22 32 ns No bus capacitance, R1 = 1400, R2 = 499 15
Pulse Width Distortion Side B Low to Side A Low, 5 V PWDBA 21 32 ns No bus capacitance, R1 = 1400, R2 = 499 15
Pulse Width Distortion Side A Low to Side B Low, 3.3 V PWDAB 27 35 ns No bus capacitance, R1 = 806, R2 = 499 15
Pulse Width Distortion Side B Low to Side A Low, 3.3 V PWDBA 15 25 ns No bus capacitance, R1 = 806, R2 = 499 15
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 16
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 16
Input Hysteresis VHYS 0.38 0.44 0.5 V 16
High Level Input Voltage VIH 2 V 16
Low Level Input Voltage VIL 0.8 V 16
High Level Output Voltage VOH 4.8 V loh = -4 mA 16
Low Level Output Voltage VOL 0.2 0.4 V lol = 4 mA 16
Input Leakage Current IL -10 10 µA 16
Output Impedance ZO 50 Ω 16
Maximum Data Rate 0 10 Mbps 16
Minimum Pulse Width 40 ns 16
Propagation Delay tPHL, tPLH 20 ns See Figure 5.1 Propagation Delay Timing (Non-I2C Channels) 16
Pulse Width Distortion PWD 12 ns See Figure 5.1 Propagation Delay Timing (Non-I2C Channels) 16
Propagation Delay Skew tPSK(P-P) 20 ns 16
Channel-Channel Skew tPSK 10 ns 16
Output Rise Time tr 2.5 4 ns C3 = 15 pF 16
Output Fall Time tf 2.5 4 ns C3 = 15 pF 16
Peak Eye Diagram Jitter tJIT(PK) 350 ps 16
VDD Undervoltage Threshold rising VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising 17
VDD Undervoltage Threshold falling VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling 17
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 17
Common Mode Transient Immunity CMTI 35 50 kV/µs VI = VDD or 0 V, VCM = 1500 V 17
Shut Down Time from UVLO tSD 3 µs 17
Start-up Time tSTART 15 40 µs 17
Junction-to-Air Thermal Resistance (NB SOIC-8) θJA 140 °C/W NB SOIC-8 21
Storage Temperature TSTG -65 150 ºC 22
Ambient Temperature Under Bias TA -40 125 ºC 22
Junction Temperature TJ 150 °C 22
Supply Voltage VDD -0.5 7 V 22
Input Voltage VI -0.5 V max printed as VDD + 0.5 V 22

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 32

CAD (KiCad official)

  • Symbol: SI8602AB-B-IS
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: si8602ab-b-is-etched.step / si8602ab-b-is-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8602ab-b-is.step / si8602ab-b-is.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (39 pp, sha256 52656d4ac754bd94, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF