component
SI8271GB-ISR
Public Made by Adomby adom
Skyworks Solutions Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSI8271GB-ISR
Skyworks Solutions · Gate Drivers · SOIC-8
SI8271GB-ISR from Skyworks Solutions, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VI | input | Digital driver control signal input, TTL-level compatible with >400 mV hysteresis, VIH min 2.0 V and VIL max 0.8 V. |
| 2 | VDDI | power_in | Input side power supply, specified at 2.5-5.5 V. |
| 3 | GNDI | power_in | Input side ground. |
| 4 | EN | input | Dedicated enable input; shutdown time from enable false and restart time from enable true are each 60 ns max. |
| 5 | GND | power_in | Driver side ground; driver outputs can be grounded to the same or a separate ground from the input side. |
| 6 | VO- | output | Gate drive pull-low output with separate pull-up/down paths for slew-rate control; peak output current 4.0 A (tPW 10 µs, duty cycle 0.2%). |
| 7 | VO+ | output | Gate drive pull-high output with separate pull-up/down paths for slew-rate control; peak output current 4.0 A (tPW 10 µs, duty cycle 0.2%) and voltage limited to VDD + 0.5 V max. |
| 8 | VDD | power_in | Driver side power supply, specified at 4.2-30 V with an absolute maximum of 36 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Skyworks Solutions |
| Package | SOIC-8 |
| Category | Motor Driver ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Supply Voltage | VDDI | 2.5 | 5.5 | V | VDDI, GNDI | 21 | |
| Driver Supply Voltage | VDDx | 4.2 | 30 | V | VDDx, GNDx | 21 | |
| Operating Temperature | TA | -40 | 125 | °C | 30 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 30 | ||
| Junction Temperature | TJ | 150 | °C | 30 | |||
| Input-side supply voltage | VDDI | -0.6 | 6 | V | 30 | ||
| Driver-side supply voltage | VDD, VDDA, VDDB | -0.6 | 36 | V | 30 | ||
| Voltage on any input pin with respect to ground | VI, VIA, VIB, EN, DT | -0.5 | V | max printed as VDD + 0.5 V; not converted | 30 | ||
| Voltage on any output pin with respect to ground | VO+, VO-, VOA, VOB | -0.5 | V | max printed as VDD + 0.5 V; not converted | 30 | ||
| Transient voltage on output pins | VO+, VO-, VOA, VOB | -1.2 | V | Transient for 200 ns | 30 | ||
| Peak Output Current | IOPK | 4 | A | tPW = 10 µs, duty cycle = 0.2% | 30 | ||
| Lead Solder Temperature | 260 | °C | 10 s | 30 | |||
| HBM Rating ESD | ESD | 3.5 | kV | HBM | 30 | ||
| CDM Rating | 2000 | V | CDM | 30 | |||
| Maximum Isolation Voltage (Input to Output) | 3000 | VRMS | 1 sec; NB SOIC-16 and SOIC-8 | 30 | |||
| Latch-up Immunity | 400 | kV/μs | 30 | ||||
| Input Supply Quiescent Current | IDDQ | 7.9 | 10 | mA | 21 | ||
| Input Supply Active Current | IDDI | 8 | 10 | mA | f = 500 kHz | 21 | |
| Output Supply Quiescent Current | IDDxQ | 2.5 | 4 | mA | 21 | ||
| Output Supply Active Current | IDDx2 | 10 | 11 | mA | f = 500 kHz (no load) | 21 | |
| VDDI UVLO Threshold + | VDDIUV+ | 1.85 | 2.2 | 2.45 | V | 21 | |
| VDDI UVLO Threshold, | VDDIUV- | 1.75 | 2.1 | 2.35 | V | 21 | |
| UVLO Threshold + (Driver Side) | VDDxUV+ | 2.7 | 3.5 | 4 | V | 3 V Threshold | 21 |
| UVLO Threshold - (Driver Side) | VDDxUV- | 2.5 | 3 | 3.8 | V | 3 V Threshold | 22 |
| Logic High Input Threshold | VIH | 2 | V | 22 | |||
| Logic Low Input Threshold | VIL | 0.8 | V | 22 | |||
| Input Hysteresis | VHYST | 350 | 400 | mV | 22 | ||
| Logic High Output Voltage | VOH | 0.04 | V | IO = -1 mA; min printed as VDDx, 0.04 V (value shown is the printed 0.04) | 22 | ||
| Logic Low Output Voltage | VOL | 0.04 | V | IO = 1 mA | 22 | ||
| Propagation Delay Si8271/3/5 with low jitter | tPLH, tPHL | 20 | 30 | 60 | ns | CL = 200 pF | 22 |
| Propagation Delay Si8271/3/5 with deglitch option | tPLH, tPHL | 30 | 45 | 75 | ns | CL = 200 pF | 22 |
| Pulse Width Distortion Si8271/3/5 all options | PWD | 3.6 | 8 | ns | /tPLH, tPHL/ | 22 | |
| Thermal Resistance Junction-to-Air | θJA | 115 | °C/W | SOIC-8 NB package | 28 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. | 35 |
CAD (KiCad official)
- Symbol:
SI8271GB-ISR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
si8271gb-isr-etched.step/si8271gb-isr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);si8271gb-isr.step/si8271gb-isr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Skyworks Solutions datasheet (47 pp, sha256
9b13c1864576d860, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).