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Si512
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Nanjing Zhongke Microelectronics RFID ICs, QFN-32-EP(5x5). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSi512
Nanjing Zhongke Microelectronics · RFID ICs · QFN-32-EP(5x5)
Si512 from Nanjing Zhongke Microelectronics, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SDI | input | I2C bus serial data input. |
| 2 | PVDD | power_in | Pad power supply pin, 2.3 to 3.6 V. |
| 3 | DVDD | power_in | Digital power supply pin, 2.3 to 3.6 V. |
| 4 | DVSS | power_in | Digital ground pin. |
| 5 | PVSS | power_in | Pad power supply ground pin. |
| 6 | NRSTPD | input | Not reset and power down; LOW switches off oscillator and current sinks, positive edge initiates reset. |
| 7 | MFIN | input | Communication interface input accepting digital serial data stream. |
| 8 | MFOUT | output | Communication interface output delivering serial data stream. |
| 9 | SVDD | power_in | Power supply for MFIN/MFOUT pads, 2.3 to 3.6 V. |
| 10 | TVSS | power_in | Transmitter ground supplying output stage of TX1 and TX2. |
| 11 | TX1 | output | Transmitter 1 output delivering modulated 13.56 MHz energy carrier. |
| 12 | TVDD | power_in | Transmitter power supply for TX1 and TX2 output stage, 2.3 to 3.6 V. |
| 13 | TX2 | output | Transmitter 2 output delivering modulated 13.56 MHz energy carrier. |
| 14 | TVSS | power_in | Transmitter ground supplying output stage of TX1 and TX2. |
| 15 | AVDD | power_in | Analog power supply pin, 2.3 to 3.6 V. |
| 16 | VMID | power_in | Internal reference voltage output pin. |
| 17 | RX | input | Receiver input for RF field detection at 13.56 MHz. |
| 18 | AVSS | power_in | Analog ground pin. |
| 19 | AUX1 | output | Auxiliary output pin used for testing and monitoring. |
| 20 | AUX2 | output | Auxiliary output pin used for testing and monitoring. |
| 21 | OSCIN | input | Crystal oscillator input to inverting amplifier; accepts 27.12 MHz external clock. |
| 22 | OSCOUT | output | Crystal oscillator output from inverting amplifier. |
| 23 | IRQ | output | Interrupt request output signaling interrupt event to host controller. |
| 24 | SD/NSS/RX | bidirectional | Multiplexed pin: I2C SDA (serial data), SPI NSS (chip select), or UART RX (receive address) depending on interface type. |
| 25 | D1/ADR_5 | bidirectional | Multiplexed pin: test port D1 or I2C bus address bit 5 input depending on interface type. |
| 26 | D2/ADR_4 | bidirectional | Multiplexed pin: test port D2 or I2C bus address bit 4 input depending on interface type. |
| 27 | D3/ADR_3 | bidirectional | Multiplexed pin: test port D3 or I2C bus address bit 3 input depending on interface type. |
| 28 | D4/ADR_2 | bidirectional | Multiplexed pin: test port D4 or I2C bus address bit 2 input depending on interface type. |
| 29 | D5/ADR_1/SCK/DTRQ | bidirectional | Multiplexed pin: test port D5, I2C address bit 1, SPI serial clock, or UART handshake request depending on interface type. |
| 30 | D6/ADR_0/MOSI/MX | bidirectional | Multiplexed pin: test port D6, I2C address bit 0, SPI master-out-slave-in, or UART controller output depending on interface type. |
| 31 | D7/SCL/MISO/TX | bidirectional | Multiplexed pin: test port D7, I2C serial clock, SPI master-in-slave-out, or UART data output depending on interface type. |
| 32 | EA | input | External address input pin to configure I2C slave address at power-up or reset. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nanjing Zhongke Microelectronics |
| Package | QFN-32-EP(5x5) |
| Category | RF And Wireless |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
Si512 - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
si512-etched.step/si512-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);si512.step/si512.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nanjing Zhongke Microelectronics datasheet (134 pp, sha256
bf6bea380f15b758, retrieved 2026-09-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).