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SI4632DY-T1-E3-VB

VBsemi Elec · MOSFETs · SO-8

SI4632DY-T1-E3-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the N-channel MOSFET, tied to pins 2 and 3; continuous source current (diode) is 2.9 A for 10 s and 1.3 A steady state.
2 S passive Source of the N-channel MOSFET, tied to pins 1 and 3; continuous source current (diode) is 2.9 A for 10 s and 1.3 A steady state.
3 S passive Source of the N-channel MOSFET, tied to pins 1 and 2; continuous source current (diode) is 2.9 A for 10 s and 1.3 A steady state.
4 G input Gate of the N-channel MOSFET with a maximum gate-source voltage of ±20 V and a threshold of 1.0 to 3.0 V.
5 D passive Drain of the N-channel MOSFET, tied to pins 6, 7 and 8; VDS is 30 V max and RDS(on) is 0.003 Ω at VGS = 10 V.
6 D passive Drain of the N-channel MOSFET, tied to pins 5, 7 and 8; VDS is 30 V max and RDS(on) is 0.003 Ω at VGS = 10 V.
7 D passive Drain of the N-channel MOSFET, tied to pins 5, 6 and 8; VDS is 30 V max and RDS(on) is 0.003 Ω at VGS = 10 V.
8 D passive Drain of the N-channel MOSFET, tied to pins 5, 6 and 7; VDS is 30 V max and RDS(on) is 0.003 Ω at VGS = 10 V.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SO-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate Threshold Voltage VGS(th) 1 3 V VDS = VGS, ID = 250 µA 2
Gate-Body Leakage IGSS -100 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 5 µA VDS = 30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) 30 A VDS ≥ 5 V, VGS = 10 V 2
Drain-Source On-State Resistance RDS(on) 0.003 Ω VGS = 10 V, ID = 25 A 2
Drain-Source On-State Resistance RDS(on) 0.004 Ω VGS = 4.5 V, ID = 22 A 2
Forward Transconductance gfs 110 S VDS = 15 V, ID = 25 A 2
Diode Forward Voltage VSD 0.72 1.1 V IS = 2.9 A, VGS = 0 V 2
Total Gate Charge Qg 45 70 nC VDS = 15 V, VGS = 4.5 V, ID = 20 A 2
Turn-On Delay Time td(on) 27 40 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Rise Time tr 21 35 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Turn-Off Delay Time td(off) 107 160 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Fall Time tf 43 65 ns VDD = 15 V, RL = 15 Ω, ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω 2
Source-Drain Reverse Recovery Time trr 45 70 ns IF = 2.9 A, dI/dt = 100 A/µs 2
Input Capacitance Ciss 6500 pF VDS = 15 V, VGS = 4.5 V, ID = 20 A 2
Output Capacitance Coss 930 pF VDS = 15 V, VGS = 4.5 V, ID = 20 A 2
Reverse Transfer Capacitance Crss 610 pF VDS = 15 V, VGS = 4.5 V, ID = 20 A 2
Gate-Source Charge Qgs 20 nC VDS = 15 V, VGS = 4.5 V, ID = 20 A 2
Gate-Drain Charge Qgd 16 nC VDS = 15 V, VGS = 4.5 V, ID = 20 A 2
Gate Resistance Rg 1.1 Ω f = 1.0 MHz 2
Drain-Source Voltage VDS 30 V TA = 25 °C 1
Gate-Source Voltage VGS -20 20 V TA = 25 °C 1
Continuous Drain Current (10 s) ID 25 A TJ = 150 °C, TA = 25 °C, 10 s 1
Continuous Drain Current (Steady State) ID 17 A TJ = 150 °C, TA = 25 °C, steady state 1
Continuous Drain Current (10 s) ID 20 A TJ = 150 °C, TA = 70 °C, 10 s 1
Continuous Drain Current (Steady State) ID 13 A TJ = 150 °C, TA = 70 °C, steady state 1
Pulsed Drain Current IDM 70 A 10 µs pulse width 1
Continuous Source Current (10 s) IS 2.9 A Diode conduction, 10 s 1
Continuous Source Current (Steady State) IS 1.3 A Diode conduction, steady state 1
Avalanche Current IAS 50 A 1
Maximum Power Dissipation (10 s) PD 3.5 W TA = 25 °C, 10 s 1
Maximum Power Dissipation (Steady State) PD 1.6 W TA = 25 °C, steady state 1
Maximum Power Dissipation (10 s) PD 2.2 W TA = 70 °C, 10 s 1
Maximum Power Dissipation (Steady State) PD 1 W TA = 70 °C, steady state 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Junction-to-Ambient Thermal Resistance (10 s) RthJA 29 35 °C/W t ≤ 10 s 1
Junction-to-Ambient Thermal Resistance (Steady State) RthJA 67 80 °C/W Steady State 1
Junction-to-Foot (Drain) Thermal Resistance RthJF 13 16 °C/W Steady State 1

CAD (KiCad official)

  • Symbol: SI4632DY-T1-E3-VB
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: si4632dy-t1-e3-vb-etched.step / si4632dy-t1-e3-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si4632dy-t1-e3-vb.step / si4632dy-t1-e3-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (8 pp, sha256 0b0d44e8024a8927, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF