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README

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SI4447ADY-T1-GE3-VB

VBsemi Elec · MOSFETs · SO-8

SI4447ADY-T1-GE3-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the P-channel MOSFET; pins 1 to 3 are the source, with a drain-source voltage rating of -40 V.
2 S passive Source terminal of the P-channel MOSFET; pins 1 to 3 are the source, with a drain-source voltage rating of -40 V.
3 S passive Source terminal of the P-channel MOSFET; pins 1 to 3 are the source, with a drain-source voltage rating of -40 V.
4 G input Gate terminal of the P-channel MOSFET; the gate-source voltage is rated at ±20 V.
5 D passive Drain terminal of the P-channel MOSFET; pins 5 to 8 are the drain, with a continuous drain current of -16.1 A at TC = 25 °C.
6 D passive Drain terminal of the P-channel MOSFET; pins 5 to 8 are the drain, with a continuous drain current of -16.1 A at TC = 25 °C.
7 D passive Drain terminal of the P-channel MOSFET; pins 5 to 8 are the drain, with a continuous drain current of -16.1 A at TC = 25 °C.
8 D passive Drain terminal of the P-channel MOSFET; pins 5 to 8 are the drain, with a continuous drain current of -16.1 A at TC = 25 °C.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SO-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -40 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -16.1 A TJ = 150 °C, TC = 25 °C 1
Continuous Drain Current ID -12.9 A TJ = 150 °C, TC = 70 °C 1
Continuous Drain Current ID -10.2 A TA = 25 °C (notes b, c) 1
Continuous Drain Current ID -8.2 A TA = 70 °C (notes b, c) 1
Pulsed Drain Current IDM -50 A 1
Continuous Source-Drain Diode Current IS -5.3 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -2.1 A TA = 25 °C (notes b, c) 1
Single Pulse Avalanche Current IAS -28 A L = 0.1 mH 1
Single Pulse Avalanche Energy EAS 39 mJ 1
Maximum Power Dissipation PD 6.3 W TC = 25 °C 1
Maximum Power Dissipation PD 4 W TC = 70 °C 1
Maximum Power Dissipation PD 2.5 W TA = 25 °C (notes b, c) 1
Maximum Power Dissipation PD 1.6 W TA = 70 °C (notes b, c) 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 37 50 °C/W t = 10 s (note c) 1
Maximum Junction-to-Ambient RthJA 85 °C/W steady state (note d) 1
Maximum Junction-to-Foot (Drain) RthJF 16 20 °C/W steady state 1
Drain-Source Breakdown Voltage VDS -40 V VGS = 0 V, ID = - 250 µA 2
Gate-Source Threshold Voltage VGS(th) -1.2 -2.5 V VDS = VGS, ID = - 250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = - 40 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -5 µA VDS = - 40 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -25 A VDS - 5 V, VGS = - 10 V 2
Drain-Source On-State Resistance RDS(on) 0.01 Ω VGS = - 10 V, ID = - 10.2 A 2
Drain-Source On-State Resistance RDS(on) 0.014 Ω VGS = - 4.5 V, ID = - 8.4 A 2
Total Gate Charge Qg 64 95 nC VDS = - 20 V, VGS = - 10 V, ID = - 10.2 A 2
Total Gate Charge Qg 33 50 nC VDS = - 20 V, VGS = - 4.5 V, ID = - 10.2 A 2
Gate Resistance Rg 0.4 2 4 Ω f = 1 MHz 2
Turn-On Delay Time td(on) 57 86 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Rise Time tr 50 75 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 40 60 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Fall Time tf 17 26 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Turn-On Delay Time td(on) 13 20 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 10 V, Rg = 1 Ω 2
Rise Time tr 11 20 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 45 68 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 10 V, Rg = 1 Ω 2
Fall Time tf 9 18 ns VDD = - 20 V, RL = 2.4 Ω, ID - 8.2 A, VGEN = - 10 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS -5.3 A TC = 25 °C 2
Pulse Diode Forward Current ISM -50 A 2
Body Diode Voltage VSD -0.8 -1.2 V IS = - 8.2 A, VGS 0 V 2
Body Diode Reverse Recovery Time trr 36 54 ns IF = - 8.2 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 41 62 nC IF = - 8.2 A, dI/dt = 100 A/µs, TJ = 25 °C 2

CAD (KiCad official)

  • Symbol: SI4447ADY-T1-GE3-VB
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: si4447ady-t1-ge3-vb-etched.step / si4447ady-t1-ge3-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si4447ady-t1-ge3-vb.step / si4447ady-t1-ge3-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 d38516dc5fb04c03, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF