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SI4355-B1A-FMR

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SKYWORKS SILICON LABS RF Transceiver ICs, QFN-20-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SI4355-B1A-FMR

SKYWORKS SILICON LABS · RF Transceiver ICs · QFN-20-EP(3x3)

SI4355-B1A-FMR from SKYWORKS SILICON LABS, in a QFN-20-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin.
2 SDN input Shutdown input (0 to VDD V): SDN = 1 puts the part in shutdown mode and all register contents are lost, while SDN = 0 selects all other modes.
3 RXp input Differential RF receiver input pin (RXp/RXn pair).
4 RXn input Differential RF receiver input pin (RXp/RXn pair).
5 NC unconnected No connect pin.
6 GND power_in Ground pin.
7 VDD power_in Supply voltage; recommended supply range is 1.8 to 3.6 V.
8 VDD power_in Supply voltage; recommended supply range is 1.8 to 3.6 V.
9 GND power_in Ground pin.
10 GPIO0 bidirectional General purpose digital I/O; I/O drive voltage VGPIO is 1.8 to 3.6 V.
11 GPIO1 bidirectional General purpose digital I/O; I/O drive voltage VGPIO is 1.8 to 3.6 V.
12 nIRQ output Interrupt status output: nIRQ = 0 indicates an interrupt event has occurred, and the interrupt status register gives the event details.
13 SCLK input Serial clock input (0 to VDD V) providing the serial data clock for the 4-line serial data bus.
14 SDO output Serial data output (0 to VDD V) providing readback of internal control registers.
15 SDI input Serial data input (0 to VDD V) carrying the serial data stream for the 4-line serial data bus.
16 nSEL input Serial interface select input (0 to VDD V) providing the select/enable function for the 4-line serial data bus.
17 XOUT output Crystal oscillator output.
18 XIN input Crystal oscillator input; no DC bias is required, but if used it should be set to 7 V as printed in the datasheet.
19 GPIO2 bidirectional General purpose digital I/O; I/O drive voltage VGPIO is 1.8 to 3.6 V.
20 GPIO3 bidirectional General purpose digital I/O; I/O drive voltage VGPIO is 1.8 to 3.6 V.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer SKYWORKS SILICON LABS
Package QFN-20-EP(3x3)
Category RF And Wireless
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Temperature TA -40 25 85 C 4
Supply Voltage VDD 1.8 3.6 V 4
I/O Drive Voltage VGPIO 1.8 3.6 V 4
Supply Voltage Range VDD 1.8 3.3 3.6 V 4
VDD to GND -0.3 3.6 V 8
Voltage on Digital Control Inputs -0.3 V 8
Voltage on Analog Inputs -0.3 V 8
RX Input Power 10 dBm 8
Operating Ambient Temperature Range TA -40 85 C 8
Storage Temperature Range TSTG -55 125 C 8
Synthesizer Frequency Range (283-350 MHz band) FSYN 283 350 MHz 5
Synthesizer Frequency Range (425-525 MHz band) FSYN 425 525 MHz 5
Synthesizer Frequency Range (850-960 MHz band) FSYN 850 960 MHz 5
RX Frequency Range (283-350 MHz band) FRX 283 350 MHz 5
RX Frequency Range (425-525 MHz band) FRX 425 525 MHz 5
RX Frequency Range (850-960 MHz band) FRX 850 960 MHz 5
RX Channel Bandwidth BW 40 850 kHz 5
BER Variation vs Power Level PRX_RES 0 0.1 ppm Up to +5 dBm Input Level 6
RSSI Resolution RESRSSI -0.5 0.5 dB 6
Spurious Emissions POB_RX1 -54 dBm Measured at RX pins 6
XTAL Range XTAL-RANGE 25 32 MHz 6
POR Reset Time tPOR 5 ms 6
Power Saving Mode Current (Shutdown) IShutdown 30 nA RC oscillator, main digital regulator, and low power digital regulator OFF 4
Power Saving Mode Current (Standby) IStandby 50 nA Register values maintained and RC oscillator/WUT OFF 4
Power Saving Mode Current (Ready) IReady 2 mA Crystal Oscillator and Main Digital Regulator ON, all other blocks OFF 4
SPI Active Current ISPI Active 1.35 mA SPI Active State 4
TUNE Mode Current ITune_RX 6.5 mA RX Tune 4
RX Mode Current IRX 10 mA 4
Synthesizer Frequency Resolution (850-960 MHz) FRES-960 114.4 Hz 850-960 MHz 5
Synthesizer Frequency Resolution (425-525 MHz) FRES-525 57.2 Hz 425-525 MHz 5
Synthesizer Frequency Resolution (283-350 MHz) FRES-350 38.1 Hz 283-350 MHz 5
Synthesizer Settling Time tLOCK 130 µs Measured from exiting Ready mode with XOSC running to any frequency, including VCO Calibration 5
RX Sensitivity (2.4 kbps GFSK) PRX-_2 -116 dBm BER < 0.1%, 2.4 kbps, GFSK, BT = 0.5, f = 30 kHz, 114 kHz Rx BW 5
RX Sensitivity (40 kbps GFSK) PRX-_40 -108 dBm BER < 0.1%, 40 kbps, GFSK, BT = 0.5, f = 25 kHz, 114 kHz Rx BW 5
RX Sensitivity (128 kbps GFSK) PRX-_128 -103 dBm BER < 0.1%, 128 kbps, GFSK, BT = 0.5, f = 70 kHz, 305 kHz Rx BW 5
RX Sensitivity (OOK, 1 kbps) PRX-_OOK -113 dBm BER < 0.1%, 1 kbps, 185 kHz Rx BW, OOK, PN15 data 5
RX Sensitivity (OOK, 40 kbps) PRX-_OOK -102 dBm BER < 0.1%, 40 kbps, 185 kHz Rx BW, OOK, PN15 data 5
1-Ch Offset Selectivity C/I1-CH -56 dB Desired ref signal 3 dB above sensitivity, BER < 0.1%; CW interferer, desired 1.2 kbps F = 5.2 kHz GFSK, BT = 0.5, Rx BW = 58 kHz, channel spacing = 100 kHz 6
2-Ch Offset Selectivity C/I2-CH -59 dB 6
Blocking 200 kHz-1 MHz 200KBLOCK -58 dB Desired ref signal 3 dB above sensitivity, BER < 0.1%; CW interferer, desired 1.2 kbps F = 5.2 kHz GFSK, BT = 0.5, RX BW = 58 kHz 6
Blocking 1 MHz Offset 1MBLOCK -61 dB 6
Blocking 8 MHz Offset 8MBLOCK -79 dB 6
Image Rejection ImREJ -40 dB Rejection at the image frequency, IF = 468 kHz 6
30 MHz XTAL Start-Up Time t30M 250 µs Using XTAL and board layout in reference design; varies with XTAL type and layout 6
30 MHz XTAL Cap Resolution 30MRES 70 fF 6
Rise Time TRISE 2.3 ns 0.1 x VDD to 0.9 x VDD, CL = 10 pF, DRV<1:0>=HH 7
Fall Time TFALL 2 ns 0.9 x VDD to 0.1 x VDD, CL = 10 pF, DRV<1:0>=HH 7
Input Capacitance CIN 2 pF 7
Input Current IIN -10 10 µA 0<VIN<VDD 7
Input Current If Pullup is Activated IINP 1 10 µA VIL = 0 V 7
Junction to Ambient Thermal Resistance JA 30 C/W Still air 8
Junction Temperature TJ 125 C 8

CAD (KiCad official)

  • Symbol: SI4355-B1A-FMR
  • Footprint: Package_DFN_QFN:UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm
  • 3D model: QFN-20-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: si4355-b1a-fmr-etched.step / si4355-b1a-fmr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si4355-b1a-fmr.step / si4355-b1a-fmr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SKYWORKS SILICON LABS datasheet (34 pp, sha256 0167ca134eeaee26, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF