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SI4151DY-T1-GE3
Public Made by Adomby adom
Vishay Intertech MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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SI4151DY-T1-GE3
Vishay Intertech · MOSFETs · SO-8
SI4151DY-T1-GE3 from Vishay Intertech, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source of the P-channel MOSFET, tied with pins 2 and 3; continuous source-drain diode current is -5.1 A at TC = 25 °C. |
| 2 | S | passive | Source of the P-channel MOSFET, tied with pins 1 and 3; continuous source-drain diode current is -5.1 A at TC = 25 °C. |
| 3 | S | passive | Source of the P-channel MOSFET, tied with pins 1 and 2; continuous source-drain diode current is -5.1 A at TC = 25 °C. |
| 4 | G | input | Gate of the P-channel MOSFET; gate-source voltage limit is ±25 V with threshold of -1 V to -2.5 V. |
| 5 | D | passive | Drain of the P-channel MOSFET, tied with pins 6, 7 and 8; drain-source voltage is -30 V max and continuous drain current is -20.5 A at TC = 25 °C. |
| 6 | D | passive | Drain of the P-channel MOSFET, tied with pins 5, 7 and 8; drain-source voltage is -30 V max and continuous drain current is -20.5 A at TC = 25 °C. |
| 7 | D | passive | Drain of the P-channel MOSFET, tied with pins 5, 6 and 8; drain-source voltage is -30 V max and continuous drain current is -20.5 A at TC = 25 °C. |
| 8 | D | passive | Drain of the P-channel MOSFET, tied with pins 5, 6 and 7; drain-source voltage is -30 V max and continuous drain current is -20.5 A at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SO-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | VDS | -30 | V | VGS = 0 V, ID = -250 μA | 2 | ||
| Gate-source threshold voltage | VGS(th) | -1 | -2.5 | V | VDS = VGS, ID = -250 μA | 2 | |
| Gate-source leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 25 V | 2 | |
| Zero gate voltage drain current | IDSS | -1 | μA | VDS = -30 V, VGS = 0 V | 2 | ||
| Zero gate voltage drain current (70 °C) | IDSS | -15 | μA | VDS = -30 V, VGS = 0 V, TJ = 70 °C | 2 | ||
| Drain-source on-state resistance | RDS(on) | 0.00625 | 0.0075 | Ω | VGS = -10 V, ID = -10 A | 2 | |
| Drain-source on-state resistance | RDS(on) | 0.0102 | 0.013 | Ω | VGS = -4.5 V, ID = -10 A | 2 | |
| Total gate charge | Qg | 58 | 87 | nC | VDS = -15 V, VGS = -10 V, ID = -10 A | 2 | |
| Total gate charge | Qg | 28 | 42 | nC | VDS = -15 V, VGS = -4.5 V, ID = -10 A | 2 | |
| Gate resistance | Rg | 1.1 | 2.2 | 3.8 | Ω | f = 1 MHz | 2 |
| Turn-on delay time | td(on) | 26 | 54 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Rise time | tr | 67 | 135 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Turn-off delay time | td(off) | 30 | 60 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Fall time | tf | 20 | 40 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Turn-on delay time | td(on) | 12 | 24 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Rise time | tr | 7 | 14 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Turn-off delay time | td(off) | 40 | 80 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Fall time | tf | 8 | 16 | ns | VDD = -15 V, RL = 1.5 Ω, ID ≅ -10 A, VGEN = -10 V, Rg = 1 Ω | 2 | |
| Continuous source-drain diode current | IS | -5.1 | A | TC = 25 °C | 2 | ||
| Pulse diode forward current | ISM | -150 | A | 2 | |||
| Body diode voltage | VSD | -0.75 | -1.1 | V | IS = -5 A, VGS = 0 V | 2 | |
| Body diode reverse recovery time | trr | 18 | 36 | ns | IF = -10 A, di/dt = 100 A/μs, TJ = 25 °C | 2 | |
| Body diode reverse recovery charge | Qrr | 8 | 16 | nC | IF = -10 A, di/dt = 100 A/μs, TJ = 25 °C | 2 | |
| Drain-source voltage | VDS | -30 | V | TA = 25 °C | 1 | ||
| Gate-source voltage | VGS | -25 | 25 | V | TA = 25 °C | 1 | |
| Continuous drain current | ID | -20.5 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Continuous drain current | ID | -16.4 | A | TJ = 150 °C, TC = 70 °C | 1 | ||
| Continuous drain current | ID | -15.2 | A | TJ = 150 °C, TA = 25 °C, b, c | 1 | ||
| Continuous drain current | ID | -12.1 | A | TJ = 150 °C, TA = 70 °C, b, c | 1 | ||
| Pulsed drain current | IDM | -150 | A | t = 100 μs | 1 | ||
| Continuous source-drain diode current | IS | -5.1 | A | TC = 25 °C | 1 | ||
| Continuous source-drain diode current | IS | -2.8 | A | TA = 25 °C, b, c | 1 | ||
| Single pulse avalanche current | IAS | -20 | A | L = 0.1 mH | 1 | ||
| Single pulse avalanche energy | EAS | 20 | mJ | L = 0.1 mH | 1 | ||
| Maximum power dissipation | PD | 5.6 | W | TC = 25 °C | 1 | ||
| Maximum power dissipation | PD | 3.6 | W | TC = 70 °C | 1 | ||
| Maximum power dissipation | PD | 3.1 | W | TA = 25 °C, b, c | 1 | ||
| Maximum power dissipation | PD | 2 | W | TA = 70 °C, b, c | 1 | ||
| Operating junction and storage temperature range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering recommendations (peak temperature) | 260 | °C | d, e | 1 | |||
| Maximum junction-to-ambient | RthJA | 34 | 40 | °C/W | t ≤ 10 s, b, d | 1 | |
| Maximum junction-to-case (drain) | RthJF | 18 | 22 | °C/W | Steady state | 1 | |
| VDS temperature coefficient | ΔVDS/TJ | -27 | mV/°C | ID = -250 μA | 2 | ||
| VGS(th) temperature coefficient | ΔVGS(th)/TJ | 4.4 | mV/°C | ID = -250 μA | 2 | ||
| Forward transconductance | gfs | 37 | S | VDS = -10 V, ID = -10 A | 2 | ||
| Input capacitance | Ciss | 3250 | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output capacitance | Coss | 410 | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse transfer capacitance | Crss | 375 | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Gate-source charge | Qgs | 10.7 | nC | VDS = -15 V, VGS = -4.5 V, ID = -10 A | 2 | ||
| Gate-drain charge | Qgd | 9.9 | nC | VDS = -15 V, VGS = -4.5 V, ID = -10 A | 2 | ||
| Reverse recovery fall time | ta | 9 | ns | IF = -10 A, di/dt = 100 A/μs, TJ = 25 °C | 2 | ||
| Reverse recovery rise time | tb | 9 | ns | IF = -10 A, di/dt = 100 A/μs, TJ = 25 °C | 2 |
CAD (KiCad official)
- Symbol:
SI4151DY-T1-GE3 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
si4151dy-t1-ge3-etched.step/si4151dy-t1-ge3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);si4151dy-t1-ge3.step/si4151dy-t1-ge3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (7 pp, sha256
b3aa0bc8b5eae67b, retrieved 2026-10-26, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).