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SI4056ADY-T1-GE3

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Vishay Intertech MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SI4056ADY-T1-GE3

Vishay Intertech · MOSFETs · SO-8

SI4056ADY-T1-GE3 from Vishay Intertech, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the N-channel MOSFET; the datasheet gives a continuous source-drain diode current IS of 4.5 A at TC = 25 °C.
2 S passive Source terminal of the N-channel MOSFET; the datasheet gives a continuous source-drain diode current IS of 4.5 A at TC = 25 °C.
3 S passive Source terminal of the N-channel MOSFET; the datasheet gives a continuous source-drain diode current IS of 4.5 A at TC = 25 °C.
4 G input Gate terminal; the gate-source voltage is rated at ±20 V and the gate-source threshold VGS(th) is 1 V min to 2.5 V max at ID = 250 µA.
5 D passive Drain terminal of the N-channel MOSFET; the drain-source breakdown voltage VDS is 100 V min and the continuous drain current is 8.3 A at TC = 25 °C.
6 D passive Drain terminal of the N-channel MOSFET; the drain-source breakdown voltage VDS is 100 V min and the continuous drain current is 8.3 A at TC = 25 °C.
7 D passive Drain terminal of the N-channel MOSFET; the drain-source breakdown voltage VDS is 100 V min and the continuous drain current is 8.3 A at TC = 25 °C.
8 D passive Drain terminal of the N-channel MOSFET; the drain-source breakdown voltage VDS is 100 V min and the continuous drain current is 8.3 A at TC = 25 °C.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SO-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 100 V 1
Gate-source voltage VGS -20 20 V 1
Continuous drain current ID 8.3 A TJ = 150 °C; TC = 25 °C 1
Continuous drain current ID 6.6 A TJ = 150 °C; TC = 70 °C 1
Continuous drain current ID 5.9 A TJ = 150 °C; TA = 25 °C, notes b, c 1
Continuous drain current ID 4.7 A TJ = 150 °C; TA = 70 °C, notes b, c 1
Pulsed drain current IDM 40 A t = 100 μs 1
Continuous source-drain diode current IS 4.5 A TC = 25 °C 1
Continuous source-drain diode current IS 2.3 A TA = 25 °C, notes b, c 1
Single pulse avalanche current IAS 12 A L = 0.1 mH 1
Single pulse avalanche energy EAS 7.2 mJ 1
Maximum power dissipation PD 5 W TC = 25 °C 1
Maximum power dissipation PD 3.2 W TC = 70 °C 1
Maximum power dissipation PD 2.5 W TA = 25 °C, notes b, c 1
Maximum power dissipation PD 1.6 W TA = 70 °C, notes b, c 1
Operating junction and storage temperature range TJ, Tstg -55 150 °C 1
Soldering recommendations (peak temperature) 260 °C note c 1
Maximum junction-to-ambient RthJA 43 50 °C/W t ≤ 10 s 1
Maximum junction-to-case (drain) RthJC 19 25 °C/W Steady state 1
Drain-source breakdown voltage VDS 100 V VGS = 0 V, ID = 250 μA 2
Gate-source threshold voltage VGS(th) 1 2.5 V VDS = VGS, ID = 250 μA 2
Gate-source leakage IGSS 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero gate voltage drain current IDSS 1 μA VDS = 100 V, VGS = 0 V 2
Zero gate voltage drain current IDSS 15 μA VDS = 100 V, VGS = 0 V, TJ = 70 °C 2
On-state drain current ID(on) 20 A VDS ≥ 10 V, VGS = 10 V 2
Drain-source on-state resistance RDS(on) 0.0243 0.0292 Ω VGS = 10 V, ID = 5.9 A 2
Drain-source on-state resistance RDS(on) 0.0277 0.033 Ω VGS = 4.5 V, ID = 5.5 A 2
Gate resistance Rg 0.3 0.87 1.5 Ω f = 1 MHz 2
Total gate charge Qg 19.2 29 nC VDS = 50 V, VGS = 10 V, ID = 10 A 2
Total gate charge Qg 8.8 14 nC VDS = 50 V, VGS = 4.5 V, ID = 10 A 2
Turn-on delay time td(on) 9 18 ns VDD = 50 V, RL = 5 , ID 10 A, VGEN = 10 V, Rg = 1 2
Rise time tr 6 12 ns VDD = 50 V, RL = 5 , ID 10 A, VGEN = 10 V, Rg = 1 2
Turn-off delay time td(off) 19 38 ns VDD = 50 V, RL = 5 , ID 10 A, VGEN = 10 V, Rg = 1 2
Turn-on delay time td(on) 14 28 ns VDD = 50 V, RL = 5 , ID 10 A, VGEN = 4.5 V, Rg = 1 2
Rise time tr 8 16 ns VDD = 50 V, RL = 5 , ID 10 A, VGEN = 4.5 V, Rg = 1 2
Turn-off delay time td(off) 15 30 ns VDD = 50 V, RL = 5 , ID 10 A, VGEN = 4.5 V, Rg = 1 2
Fall time tf 5 10 ns VDD = 50 V, RL = 5 , ID 10 A, VGEN = 4.5 V, Rg = 1 2
Continuous source-drain diode current IS 35.4 A TC = 25 °C 2
Pulse diode forward current ISM 40 A 2
Body diode voltage VSD 0.78 1.1 V IS = 5 A, VGS = 0 V 2
Body diode reverse recovery time trr 29 58 ns IF = 10 A, di/dt = 100 A/μs, TJ = 25 °C 2
Body diode reverse recovery charge Qrr 39 78 nC IF = 10 A, di/dt = 100 A/μs, TJ = 25 °C 2

CAD (KiCad official)

  • Symbol: SI4056ADY-T1-GE3
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: si4056ady-t1-ge3-etched.step / si4056ady-t1-ge3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si4056ady-t1-ge3.step / si4056ady-t1-ge3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (9 pp, sha256 002b0fb2b530ec69, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF