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Contents

README

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SI3421DV-T1-GE3

Vishay Intertech · MOSFETs · TSOP-6

SI3421DV-T1-GE3 from Vishay Intertech, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D passive Drain terminal of the P-channel MOSFET, tied internally to pins 2, 5 and 6; the device is rated for VDS = -30 V.
2 D passive Drain terminal of the P-channel MOSFET, tied internally to pins 1, 5 and 6; the device is rated for VDS = -30 V.
3 G input Gate terminal of the MOSFET; the absolute maximum gate-source voltage is VGS = ±20 V.
4 S passive Source terminal of the P-channel MOSFET; the continuous source-drain diode current is rated at -3.5 A at TC = 25 °C.
5 D passive Drain terminal of the P-channel MOSFET, tied internally to pins 1, 2 and 6; the device is rated for VDS = -30 V.
6 D passive Drain terminal of the P-channel MOSFET, tied internally to pins 1, 2 and 5; the device is rated for VDS = -30 V.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package TSOP-6
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -8 A TC = 25 °C (package limited, note e) 1
Continuous Drain Current ID -8.3 A TA = 25 °C (notes a, b) 1
Continuous Drain Current ID -6.7 A TA = 70 °C (notes a, b) 1
Pulsed Drain Current IDM -50 A t = 100 µs 1
Continuous Source-Drain Diode Current IS -3.5 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -1.7 A TA = 25 °C (notes a, b) 1
Avalanche Current IAS -15 A L = 0.1 mH 1
Single-Pulse Avalanche Energy EAS 11.25 mJ 1
Maximum Power Dissipation PD 4.2 W TC = 25 °C 1
Maximum Power Dissipation PD 2.7 W TC = 70 °C 1
Maximum Power Dissipation PD 2 W TA = 25 °C (notes a, b) 1
Maximum Power Dissipation PD 1.3 W TA = 70 °C (notes a, b) 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 40 62.5 °C/W t 10 s (notes a, c) 1
Maximum Junction-to-Ambient (steady state) RthJA 110 °C/W Steady state (note c) 1
Maximum Junction-to-Foot Steady State RthJF 25 30 °C/W Steady state 1
Drain-Source Breakdown Voltage V(BR)DSS -30 V VGS = 0 V, ID = -250 µA 2
Gate-Source Threshold Voltage VGS(th) -1 -3 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -5 µA VDS = -30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -30 A VDS -10 V, VGS = -10 V 2
Drain-Source On-State Resistance RDS(on) 0.016 0.0192 Ω VGS = -10 V, ID = -7 A 2
Drain-Source On-State Resistance RDS(on) 0.0193 0.0232 Ω VGS = -6 V, ID = -5 A 2
Drain-Source On-State Resistance RDS(on) 0.0225 0.027 Ω VGS = -4.5 V, ID = -3 A 2
Total Gate Charge Qg 46 69 nC VDS = -15 V, VGS = -10 V, ID = -8.3 A 2
Total Gate Charge Qg 21 32 nC VDS = -15 V, VGS = -4.5 V, ID = -8.3 A 2
Gate Resistance Rg 1.6 8 16 Ω f = 1 MHz 2
Turn-On Delay Time td(on) 7 14 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -10 V, Rg = 1 2
Rise Time tr 9 18 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -10 V, Rg = 1 2
Turn-Off Delay Time td(off) 55 83 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -10 V, Rg = 1 2
Fall Time tf 13 20 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -10 V, Rg = 1 2
Turn-On Delay Time td(on) 58 87 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -4.5 V, Rg = 1 2
Rise Time tr 40 60 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -4.5 V, Rg = 1 2
Turn-Off Delay Time td(off) 36 54 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -4.5 V, Rg = 1 2
Fall Time tf 17 26 ns VDD = -15 V, RL = 2.24, ID -6.7 A, VGEN = -4.5 V, Rg = 1 2
Continuous Source-Drain Diode Current IS -3.5 A TC = 25 °C 2
Pulse Diode Forward Current ISM -50 A t = 100 µs 2
Body Diode Voltage VSD -0.85 -1.2 V IS = -6.7 A, VGS = 0 V 2
Body Diode Reverse Recovery Time trr 21.5 33 ns IF = -6.7 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 12 20 nC IF = -6.7 A, dI/dt = 100 A/µs, TJ = 25 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper pins 1,2,5, and 6. The copper plane connects the drain pins 8

CAD (KiCad official)

  • Symbol: SI3421DV-T1-GE3
  • Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-6 (KiCad packages3D, STEP)
  • 3D model files: si3421dv-t1-ge3-etched.step / si3421dv-t1-ge3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si3421dv-t1-ge3.step / si3421dv-t1-ge3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (11 pp, sha256 0e20d4f70eec97f6, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF