# SI3139KE-TP

**MCC Micro Commercial Components** · MOSFETs · SOT-523

SI3139KE-TP from MCC Micro Commercial Components, in a SOT-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage rated ±12 V, with a gate-threshold voltage of -0.35 V min to -1.1 V max at ID=-250µA. |
| 2 | S | passive | Source; P-channel MOSFET source terminal, continuous drain current -0.66 A. |
| 3 | D | passive | Drain; drain-source voltage rated -20 V, with pulsed drain current of -1.2 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOT-523 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -20 |  |  | V |  | 1 |
| Gate-Source Voltage | VGS |  |  | 12 | V |  | 1 |
| Drain Current-Continuous | ID | -0.66 |  |  | A |  | 1 |
| Pulsed Drain Current | IDM | -1.2 |  |  | A |  | 1 |
| Maximum Thermal Resistance, Junction to Ambient |  |  |  | 833 | °C/W | Junction to ambient | 1 |
| Operating Junction Temperature Range |  | -55 |  | 150 | °C | Operating junction temperature range | 1 |
| Storage Temperature Range |  | -55 |  | 150 | °C | Storage temperature range | 1 |

## CAD (KiCad official)

- Symbol: `SI3139KE-TP`
- Footprint: `Package_TO_SOT_SMD:SOT-523`
- 3D model: SOT-523, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.8 mm nominal SOT-523 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `si3139ke-tp-etched.step` / `si3139ke-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `si3139ke-tp.step` / `si3139ke-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC Micro Commercial Components datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588915694645338112) (4 pp, sha256 `b7f7f29f86dd2783`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/si3139ke-tp-datasheet.pdf)