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SI24R2E

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Nanjing Zhongke Microelectronics RF Chips, QFN-20-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SI24R2E

Nanjing Zhongke Microelectronics · RF Chips · QFN-20-EP(4x4)

SI24R2E from Nanjing Zhongke Microelectronics, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CE input Chip Enable turns the chip on and must be kept clear of disassembly, as stated in the pin function table.
2 CSN input SPI Chip Select; every new SPI command must start with a high-to-low transition on this pin.
3 SCK input SPI Clock input, with a maximum SCK frequency of 10 MHz.
4 MOSI input SPI data input from the master, MOSI (Master Out Slave In).
5 MISO output SPI data output to the master; the first byte shifted out is always the STATUS register.
6 IRQ output Maskable interrupt output, active low.
7 VCC power_in Power supply, +1.9 to +3.6 V DC.
8 VSS power_in Ground, 0 V.
9 XO output Crystal oscillator output, for the 16 MHz crystal (±60 ppm).
10 XI input Crystal oscillator input, for the 16 MHz crystal (±60 ppm).
11 VDD_PA power_out 1.8 V supply output for the internal power amplifier.
12 RFP passive RF antenna port 1 (differential RF pair with RFN).
13 RFN passive RF antenna port 2 (differential RF pair with RFP).
14 VSS power_in Ground, 0 V.
15 VCC power_in Power supply, +1.9 to +3.6 V DC.
16 IREF input Reference current input for the internal bias.
17 VSS power_in Ground, 0 V.
18 VCC power_in Power supply, +1.9 to +3.6 V DC.
19 VDD_D power_out Positive digital supply output for decoupling purposes.
20 VSS power_in Ground, 0 V.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Nanjing Zhongke Microelectronics
Package QFN-20-EP(4x4)
Category Radio Frequency Chip/Antenna
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD VDD -0.3 3.6 V 23
Input Voltage VI -0.3 5.25 V 23
Power Dissipation 100 mW 23
Operation Temperature -40 85 ℃ 23
Storage Temperature -40 125 ℃ 23
Supply voltage VDD 1.9 3.6 V 23
RF operation frequency FOP 2400 2525 MHz 24
Frequency deviation 2Mbps ΔFMOD(2Mbps) -330 330 KHz 24
Frequency deviation 1M/250Kbps ΔFMOD(1M/250Kbps) -175 175 KHz 24
Data rate RGFSK 250 2000 Kbps 24
RF Output Power PRF -30 7 dBm 24
1st Adjacent CH Power 2MHz PRF1 -20 dBm 1st Adjacent CH Power 2MHz 25
2nd Adjacent CH Power 4MHz PRF2 -46 dBm 2nd Adjacent CH Power 4MHz 25
Crystal frequency tolerance ΔF -60 60 ppm 25
Tdc Data to SCK Setup Tdc 2 ns 18
SCK to Data Hold Tdh 2 ns 18
CSN to Data Valid Tcsd 42 ns 18
SCK to Data Valid Tcd 58 ns 18
SCK Low Time Tcl 40 ns 18
SCK High Time Tch 40 ns 18
SCK Frequency Fsck 0 10 MHz 18
SCK Rise and Fall Tr,Tf 100 ns 18
CSN to SCK Setup Tcc 2 ns 18
SCK to CSN Hold Tcch 2 ns 18
CSN Inactive time Tcwh 50 ns 18
CSN to Output High Z Tcdz 42 ns 18
Supply current in Shutdown mode ISHD 0.7 µA 23
Supply current in Sleep mode Isleep 0.7 uA RCOSC,Watchdog and ATR Timer are active 23
Supply current in Standby mode ISTB 15 µA 23
Supply current in Idle-TX mode IIDLE 380 µA 23
TX mode supply current @7 dBm output power ITX@7dBm 25 mA @7 dBm output power 24
TX mode supply current @4 dBm output power ITX@4dBm 17 mA @4 dBm output power 24
TX mode supply current @0 dBm output power ITX@0dBm 13.5 mA @0 dBm output power 24
TX mode supply current @-6 dBm output power ITX@-6dBm 10 mA @-6 dBm output power 24
TX mode supply current @-12 dBm output power ITX@-12dBm 8.5 mA @-12 dBm output power 24
RF channel space FCH 1 MHz 2MHz at least when 2Mpbs 24
Modulation Bandwidth 2Mbps PBW@2Mbps 2.1 MHz 24
Modulation Bandwidth 1Mbps PBW@1Mbps 1.1 MHz 24
Modulation Bandwidth 250Kbps PBW@250Kbps 0.9 MHz 24
Crystal frequency FXO 16 MHz 25
Equivalent Series Resistance ESR 100 Ω 25

CAD (KiCad official)

  • Symbol: SI24R2E
  • Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
  • 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: si24r2e-etched.step / si24r2e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si24r2e.step / si24r2e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nanjing Zhongke Microelectronics datasheet (37 pp, sha256 15175c73931821a7, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF