component
SI2377EDS-T1-GE3
Public Made by Adomby adom
Vishay Intertech MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 23d ago |
| viewers | 23d ago |
| package.json | 23d ago |
| page.json | 23d ago |
| README.md | 23d ago |
| si2377eds-t1-ge3-etched.glb | 23d ago |
| si2377eds-t1-ge3-etched.step | 23d ago |
| si2377eds-t1-ge3-hero.glb | 23d ago |
| si2377eds-t1-ge3-hero.overlay.json | 23d ago |
| si2377eds-t1-ge3.glb | 23d ago |
| si2377eds-t1-ge3.kicad_mod | 23d ago |
| si2377eds-t1-ge3.kicad_sym | 23d ago |
| si2377eds-t1-ge3.lbr | 23d ago |
| si2377eds-t1-ge3.step | 23d ago |
SI2377EDS-T1-GE3
Vishay Intertech · MOSFETs · SOT-23
SI2377EDS-T1-GE3 from Vishay Intertech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel MOSFET, rated for a gate-source voltage of ±8 V (absolute maximum). |
| 2 | S | passive | Source of the P-channel MOSFET; continuous source-drain diode current is limited to -1.5 A at TC = 25 °C. |
| 3 | D | passive | Drain of the P-channel MOSFET, rated for -20 V drain-source voltage and -4.4 A continuous drain current at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | -20 | V | VGS = 0 V, ID = -250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | -0.4 | -1 | V | VDS = VGS, ID = -250 µA | 2 | |
| Gate-Source Leakage | IGSS | -6 | 6 | µA | VDS = 0 V, VGS = ± 8 V | 2 | |
| Gate-Source Leakage | IGSS | -0.5 | 0.5 | µA | VDS = 0 V, VGS = ± 4.5 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -20 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -10 | µA | VDS = -20 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | -15 | A | VDS ≤ -5 V, VGS = -4.5 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.05 | 0.061 | Ω | VGS = -4.5 V, ID = -3.2 A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 0.065 | 0.08 | Ω | VGS = -2.5 V, ID = -2.8 A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 0.09 | 0.11 | Ω | VGS = -1.8 V, ID = -1.5 A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 0.11 | 0.165 | Ω | VGS = -1.5 V, ID = -0.5 A | 2 | |
| Total Gate Charge | Qg | 14 | 21 | nC | VDS = -10 V, VGS = -8 V, ID = -5.3 A | 2 | |
| Total Gate Charge | Qg | 7.6 | 12 | nC | VDS = -10 V, VGS = -4.5 V, ID = -5.3 A | 2 | |
| Gate Resistance | Rg | 0.4 | 2 | 4 | kΩ | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | 0.2 | 0.3 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 1 | 1.5 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 4 | 6 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 2 | 3 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Turn-On Delay Time | td(on) | 0.09 | 0.14 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -8 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 0.4 | 0.6 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -8 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 5.2 | 7.8 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -8 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 2.3 | 3.5 | µs | VDD = -10 V, RL = 2.3 Ω, ID ≅ -4.3 A, VGEN = -8 V, Rg = 1 Ω | 2 | |
| Body Diode Voltage | VSD | -0.8 | -1.2 | V | IS = -3 A, VGS = 0 V | 2 | |
| Body Diode Reverse Recovery Time | trr | 30 | 60 | ns | IF = -3 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 20 | 40 | nC | 2 | ||
| Continuous Source-Drain Diode Current | IS | -1.5 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | -20 | A | 2 | |||
| VDS Temperature Coefficient | ΔVDS/TJ | -13 | mV/°C | ID = -250 µA | 2 | ||
| Forward Transconductance | gfs | 12 | S | VDS = -10 V, ID = -3.2 A | 2 | ||
| VGS(th) Temperature Coefficient | ΔVGS(th)/TJ | 2.5 | mV/°C | 2 | |||
| Gate-Source Charge | Qgs | 0.8 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 3.1 | nC | 2 | |||
| Reverse Recovery Fall Time | ta | 13 | ns | 2 | |||
| Reverse Recovery Rise Time | tb | 17 | ns | 2 | |||
| Drain-Source Voltage | VDS | -20 | V | 1 | |||
| Gate-Source Voltage | VGS | -8 | 8 | V | 1 | ||
| Continuous Drain Current | ID | -4.4 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | -3.5 | A | TJ = 150 °C, TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | -3.7 | A | TJ = 150 °C, TA = 25 °C (notes b, c) | 1 | ||
| Continuous Drain Current | ID | -2.9 | A | TJ = 150 °C, TA = 70 °C (notes b, c) | 1 | ||
| Pulsed Drain Current | IDM | -20 | A | 1 | |||
| Continuous Source-Drain Diode Current | IS | -1.5 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | -1 | A | TA = 25 °C (notes b, c) | 1 | ||
| Maximum Power Dissipation | PD | 1.8 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.1 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.25 | W | TA = 25 °C (notes b, c) | 1 | ||
| Maximum Power Dissipation | PD | 0.8 | W | TA = 70 °C (notes b, c) | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering Recommendations (Peak Temperature) | 260 | °C | Peak temperature (notes d, e) | 1 | |||
| Maximum Junction-to-Ambient | RthJA | 80 | 100 | °C/W | t ≤ 5 s (notes b, d) | 1 | |
| Maximum Junction-to-Ambient (steady state) | RthJA | 130 | °C/W | Steady state (note d) | 1 | ||
| Maximum Junction-to-Foot (Drain) | RthJF | 55 | 70 | °C/W | Steady state | 1 |
CAD (KiCad official)
- Symbol:
SI2377EDS-T1-GE3 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
si2377eds-t1-ge3-etched.step/si2377eds-t1-ge3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);si2377eds-t1-ge3.step/si2377eds-t1-ge3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (7 pp, sha256
9ac5aa85976cbb4c, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).