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Contents

README

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SI2333DDS-T1-GE3-MS

MSKSEMI · MOSFETs · SOT-23

SI2333DDS-T1-GE3-MS from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the P-channel MOSFET, with a Gate-Source voltage rating of ±12 V and a threshold of -0.3 V min to -1 V max at ID=-250uA.
2 S passive Source of the P-channel MOSFET; continuous source current is rated -5.5 A and pulsed source current -21.2 A.
3 D passive Drain of the P-channel MOSFET, rated for -12 V Drain-Source voltage and -5.5 A continuous drain current with RDS(ON) of 25 mΩ typ at VGS=-4.5V.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -12 V 2
Gate-Source Voltage VGS -12 12 V 2
Drain Current, Continuous ID -5.5 A TC=25℃ 2
Drain Current, Continuous ID -3.5 A TC=100℃ 2
Drain Current, Pulsed IDM -21.2 A 2
Power Dissipation PD 1.56 W TC=25℃ 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2
Thermal Resistance Junction to ambient RθJA 80 ℃/W 2
Drain-Source Breakdown Voltage BVDSS -12 V VGS=0V , ID=-250uA 3
Drain-Source Leakage Current IDSS -1 uA VDS=-20V , VGS=0V , TJ=25℃ 3
Drain-Source Leakage Current IDSS -10 uA VDS=-16V , VGS=0V , TJ=125℃ 3
Gate-Source Leakage Current IGSS -100 100 nA VGS=±12V , VDS=0V 3
Static Drain-Source On-Resistance RDS(ON) 25 35 mΩ VGS=-4.5V , ID=-4A 3
Static Drain-Source On-Resistance RDS(ON) 35 50 mΩ VGS=-2.5V , ID=-3A 3
Gate Threshold Voltage VGS(th) -0.3 -0.6 -1 V VGS=VDS , ID=-250uA 3
Continuous Source Current IS -5.5 A VG=VD=0V , Force Current 3
Pulsed Source Current ISM -21.2 A 3
Diode Forward Voltage VSD -1.2 V VGS=0V , IS=-1A , TJ=25℃ 3
BVDSS Temperature Coefficient △BVDSS/△TJ -0.02 V/℃ Reference to 25℃ , ID=-1mA 3
VGS(th) Temperature Coefficient △VGS(th) 2 mV/℃ 3
Forward Transconductance gfs 8.4 S VDS=-12V , IS=-3A 3
Total Gate Charge Qg 16.1 nC VDS=-10V , VGS=-4.5V , ID=-4A 3
Gate-Source Charge Qgs 1.8 nC VDS=-10V , VGS=-4.5V , ID=-4A 3
Gate-Drain Charge Qgd 3.8 nC VDS=-10V , VGS=-4.5V , ID=-4A 3
Turn-On Delay Time Td(on) 8.2 nS VDD=-10V , VGS=-4.5V , RG=25Ω ID=-1A 3
Rise Time Tr 30 nS VDD=-10V , VGS=-4.5V , RG=25Ω ID=-1A 3
Turn-Off Delay Time Td(off) 71.1 nS VDD=-10V , VGS=-4.5V , RG=25Ω ID=-1A 3
Fall Time Tf 19.8 nS VDD=-10V , VGS=-4.5V , RG=25Ω ID=-1A 3
Input Capacitance Ciss 1440 pF VDS=-15V , VGS=0V , F=1MHz 3
Output Capacitance Coss 155 pF VDS=-15V , VGS=0V , F=1MHz 3
Reverse Transfer Capacitance Crss 115 pF VDS=-15V , VGS=0V , F=1MHz 3

CAD (KiCad official)

  • Symbol: SI2333DDS-T1-GE3-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2333dds-t1-ge3-ms-etched.step / si2333dds-t1-ge3-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2333dds-t1-ge3-ms.step / si2333dds-t1-ge3-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (6 pp, sha256 463f8d3d09798068, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF