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Contents

README

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Si2323DS-T1-E3-HXY

HXY MOSFET · MOSFETs · SOT-23

Si2323DS-T1-E3-HXY from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±10 V, drive down to 1.8 V, and the device is ESD protected (1500 V HBM).
2 S passive Source of the P-channel MOSFET; the body diode forward current is limited to -4 A.
3 D passive Drain of the P-channel MOSFET; VDS is -20 V max and continuous drain current is -5 A.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-Source Voltage VGS -10 10 V TA=25℃ 1
Drain Current-Continuous ID -5 A TA=25℃ 1
Drain Current-Pulsed IDM -30 A Note 1: repetitive rating, pulse width limited by max junction temperature 1
Maximum Power Dissipation PD 1.4 W TA=25℃ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Drain-Source Voltage VDS -20 V TA=25℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 89.3 ℃/W Note 2: surface mounted on FR4 board, t ≤ 10 sec 1
Zero Gate Voltage Drain Current IDSS 1 μA VDS=-20V,VGS=0V 2
Gate-Body Leakage Current IGSS -10 10 μA VGS=±10V,VDS=0V 2
Drain-Source Breakdown Voltage BVDSS -20 V VGS=0V ID=-250μA 2
Gate Threshold Voltage VGS(th) -0.35 -0.55 -0.9 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(ON) 30 40 mΩ VGS=-4.5V, ID=-4A 2
Drain-Source On-State Resistance RDS(ON) 44 60 mΩ VGS=-2.5V, ID=-4A 2
Forward Transconductance gFS 8 S VDS=-5V,ID=-4A 2
Diode Forward Voltage VSD -1.2 V VGS=0V,IS=-4A 2
Diode Forward Current IS -4 A Note 2 2

CAD (KiCad official)

  • Symbol: Si2323DS-T1-E3-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2323ds-t1-e3-hxy-etched.step / si2323ds-t1-e3-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2323ds-t1-e3-hxy.step / si2323ds-t1-e3-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (7 pp, sha256 23f1f06f6459e977, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF