Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

Si2312BDS-T1-E3-HXY

HXY MOSFET · MOSFETs · SOT-23

Si2312BDS-T1-E3-HXY from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; VGS is rated ±12V absolute maximum, with a threshold of 0.5V min to 1.2V max at 250µA and operation down to 2.5V gate drive.
2 S passive Source of the N-channel MOSFET; continuous drain current is 3A and body diode forward current is 3.3A.
3 D passive Drain; VDS is rated 20V maximum with 3A continuous and 16A pulsed drain current.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 22 V VGS=0V ID=250μA 2
Gate Threshold Voltage VGS(th) 0.5 0.75 1.2 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 28 40 mΩ VGS=2.5V, ID=2.8A 2
Drain-Source On-State Resistance RDS(ON) 23 35 mΩ VGS=4.5V, ID=3A 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=20V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±12V,VDS=0V 2
Total Gate Charge Qg 2.9 5 nC VDS=10V,ID=3A, VGS=4.5V 2
Diode Forward Voltage VSD 0.75 1.2 V VGS=0V,IS=3.3A 2
Diode Forward Current IS 3.3 A 2
Drain-Source Voltage VDS 20 V 1
Gate-Source Voltage VGS -12 12 V 1
Drain Current-Continuous ID 3 A 1
Drain Current-Pulsed IDM 16 A Note 1 (repetitive rating, pulse width limited by maximum junction temperature) 1
Maximum Power Dissipation PD 0.9 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 139 ℃/W Note 2 (surface mounted on FR4 board, t ≤ 10 sec) 1

CAD (KiCad official)

  • Symbol: Si2312BDS-T1-E3-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2312bds-t1-e3-hxy-etched.step / si2312bds-t1-e3-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2312bds-t1-e3-hxy.step / si2312bds-t1-e3-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 d8cbd37716a5ac59, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF