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Ray Publish 0.1.0 70eccf1 14h ago

Si2308BDS-T1-GE3-HXY

HXY MOSFET · MOSFETs · SOT-23-3L

Si2308BDS-T1-GE3-HXY from HXY MOSFET, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the N-channel MOSFET; the datasheet rates Gate-Source Voltage at ±20V.
2 D passive Drain of the N-channel MOSFET; the datasheet rates Drain-Source Voltage at 60V and Drain Current-Continuous at 4.5A.
3 S passive Source of the N-channel MOSFET, the reference terminal for the gate-source ratings (±20V) and the body diode.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23-3L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 73 85 mΩ VGS=10V, ID=5A 2
Static Drain-Source On-Resistance RDS(ON) 82 93 mΩ VGS=4.5V, ID=5A 2
Gate Threshold Voltage VGS(th) 1.2 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=48V, VGS=0V, TJ=25°C 2
Drain-Source Leakage Current IDSS 5 uA VDS=48V, VGS=0V, TJ=55°C 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS 17 A VG=VD=0V, Force Current 2
Pulsed Source Current ISM 50 A 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=1A, TJ=25°C 2
Drain-Source Voltage VDS 60 V TA=25°C unless otherwise noted 1
Gate-Source Voltage VGS -20 20 V TA=25°C unless otherwise noted 1
Drain Current-Continuous ID 4.5 A TA=25°C unless otherwise noted 1
Drain Current-Pulsed IDM 15 A Note 1; TA=25°C unless otherwise noted 1
Maximum Power Dissipation PD 8 W TA=25°C unless otherwise noted 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 °C TA=25°C unless otherwise noted 1
Thermal Resistance, Junction-to-Ambient RθJA 89 °C/W Note 2 1

CAD (KiCad official)

  • Symbol: Si2308BDS-T1-GE3-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: si2308bds-t1-ge3-hxy-etched.step / si2308bds-t1-ge3-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2308bds-t1-ge3-hxy.step / si2308bds-t1-ge3-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 62d81216425b6c13, retrieved 2026-11-06, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF