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SI2307CDS-T1-GE3
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Vishay Intertech MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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si2307cds-t1-ge3: specified limits as data (metadata.characteristics, 40 rows from the datasheet)
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SI2307CDS-T1-GE3
Vishay Intertech · MOSFETs · SOT-23
SI2307CDS-T1-GE3 from Vishay Intertech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel MOSFET; gate-source voltage is rated ±20 V (VGS), per the absolute maximum ratings. |
| 2 | S | passive | Source of the P-channel MOSFET; the continuous source-drain diode current is rated at -1.5 A at TC = 25 °C. |
| 3 | D | passive | Drain of the P-channel MOSFET; drain-source voltage is -30 V (VDS), and the drain pin also provides the thermal connection to the PC board. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -30 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -3.5 | A | TJ = 150 °C; TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | -2.8 | A | TJ = 150 °C; TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | -2.7 | A | TJ = 150 °C; TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | -2.2 | A | TJ = 150 °C; TA = 70 °C | 1 | ||
| Pulsed Drain Current | IDM | -12 | A | 10 µs pulse width | 1 | ||
| Continuous Source-Drain Diode Current | IS | -1.5 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | -0.91 | A | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.8 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.14 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.1 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 0.7 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering Recommendations (Peak Temperature) | 260 | °C | Peak temperature | 1 | |||
| Maximum Junction-to-Ambient | RthJA | 90 | 115 | °C/W | t ≤ 5 s | 1 | |
| Maximum Junction-to-Ambient (steady state) | RthJA | 166 | °C/W | Steady state (note c) | 1 | ||
| Maximum Junction-to-Foot (Drain) | RthJF | 55 | 70 | °C/W | Steady state | 1 | |
| Gate-Source Threshold Voltage | VGS(th) | -1 | -3 | V | VDS = VGS, ID = -250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | nA | VDS = 0 V, VGS = ±20 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -30 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -10 | µA | VDS = -30 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| Drain-Source Breakdown Voltage | VDS | -30 | V | VGS = 0 V, ID = -250 µA | 2 | ||
| On-State Drain Current | ID(on) | -6 | A | VDS ≤ 5 V, VGS = - 10 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.073 | 0.088 | Ω | VGS = - 10 V, ID = - 3.5 A | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 0.11 | 0.138 | Ω | VGS = - 4.5 V, ID = - 2.5 A | 2 | |
| Total Gate Charge | Qg | 4.1 | 6.2 | nC | VDS = - 15 V, VGS = - 4.5 V, ID = - 2.5 A | 2 | |
| Turn-On Delay Time | td(on) | 40 | 60 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 40 | 60 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 20 | 40 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 17 | 30 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 | |
| Turn-On Delay Time | td(on) | 5.5 | 10 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 13 | 25 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 17 | 30 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 7.7 | 15 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 | |
| Continuous Source-Drain Diode Current | IS | -1.5 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | -12 | A | 2 | |||
| Body Diode Voltage | VSD | -0.8 | -1.2 | V | IS = -0.75 A, VGS = 0 V | 2 | |
| Body Diode Reverse Recovery Time | trr | 17 | 30 | ns | IF = -2.5 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 11 | 20 | nC | IF = -2.5 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 |
CAD (KiCad official)
- Symbol:
SI2307CDS-T1-GE3 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
si2307cds-t1-ge3-etched.step/si2307cds-t1-ge3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);si2307cds-t1-ge3.step/si2307cds-t1-ge3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (9 pp, sha256
17fd02335f13449d, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SI2307CDS-T1-GE3
**Vishay Intertech** · MOSFETs · SOT-23
SI2307CDS-T1-GE3 from Vishay Intertech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel MOSFET; gate-source voltage is rated ±20 V (VGS), per the absolute maximum ratings. |
| 2 | S | passive | Source of the P-channel MOSFET; the continuous source-drain diode current is rated at -1.5 A at TC = 25 °C. |
| 3 | D | passive | Drain of the P-channel MOSFET; drain-source voltage is -30 V (VDS), and the drain pin also provides the thermal connection to the PC board. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -30 | | | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | -3.5 | | | A | TJ = 150 °C; TC = 25 °C | 1 |
| Continuous Drain Current | ID | -2.8 | | | A | TJ = 150 °C; TC = 70 °C | 1 |
| Continuous Drain Current | ID | -2.7 | | | A | TJ = 150 °C; TA = 25 °C | 1 |
| Continuous Drain Current | ID | -2.2 | | | A | TJ = 150 °C; TA = 70 °C | 1 |
| Pulsed Drain Current | IDM | -12 | | | A | 10 µs pulse width | 1 |
| Continuous Source-Drain Diode Current | IS | -1.5 | | | A | TC = 25 °C | 1 |
| Continuous Source-Drain Diode Current | IS | -0.91 | | | A | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 1.8 | W | TC = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 1.14 | W | TC = 70 °C | 1 |
| Maximum Power Dissipation | PD | | | 1.1 | W | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 0.7 | W | TA = 70 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Soldering Recommendations (Peak Temperature) | | | | 260 | °C | Peak temperature | 1 |
| Maximum Junction-to-Ambient | RthJA | | 90 | 115 | °C/W | t ≤ 5 s | 1 |
| Maximum Junction-to-Ambient (steady state) | RthJA | | | 166 | °C/W | Steady state (note c) | 1 |
| Maximum Junction-to-Foot (Drain) | RthJF | | 55 | 70 | °C/W | Steady state | 1 |
| Gate-Source Threshold Voltage | VGS(th) | -1 | | -3 | V | VDS = VGS, ID = -250 µA | 2 |
| Gate-Source Leakage | IGSS | -100 | | | nA | VDS = 0 V, VGS = ±20 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | -1 | | | µA | VDS = -30 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | -10 | | | µA | VDS = -30 V, VGS = 0 V, TJ = 55 °C | 2 |
| Drain-Source Breakdown Voltage | VDS | -30 | | | V | VGS = 0 V, ID = -250 µA | 2 |
| On-State Drain Current | ID(on) | -6 | | | A | VDS ≤ 5 V, VGS = - 10 V | 2 |
| Drain-Source On-State Resistance | RDS(on) | | 0.073 | 0.088 | Ω | VGS = - 10 V, ID = - 3.5 A | 2 |
| Drain-Source On-State Resistance | RDS(on) | | 0.11 | 0.138 | Ω | VGS = - 4.5 V, ID = - 2.5 A | 2 |
| Total Gate Charge | Qg | | 4.1 | 6.2 | nC | VDS = - 15 V, VGS = - 4.5 V, ID = - 2.5 A | 2 |
| Turn-On Delay Time | td(on) | | 40 | 60 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 40 | 60 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 20 | 40 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 17 | 30 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω | 2 |
| Turn-On Delay Time | td(on) | | 5.5 | 10 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 13 | 25 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 17 | 30 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 7.7 | 15 | ns | VDD = - 15 V, RL = 15 Ω, ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω | 2 |
| Continuous Source-Drain Diode Current | IS | -1.5 | | | A | TC = 25 °C | 2 |
| Pulse Diode Forward Current | ISM | -12 | | | A | | 2 |
| Body Diode Voltage | VSD | | -0.8 | -1.2 | V | IS = -0.75 A, VGS = 0 V | 2 |
| Body Diode Reverse Recovery Time | trr | | 17 | 30 | ns | IF = -2.5 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 |
| Body Diode Reverse Recovery Charge | Qrr | | 11 | 20 | nC | IF = -2.5 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 |
## CAD (KiCad official)
- Symbol: `SI2307CDS-T1-GE3`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `si2307cds-t1-ge3-etched.step` / `si2307cds-t1-ge3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `si2307cds-t1-ge3.step` / `si2307cds-t1-ge3.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Vishay Intertech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586188050766434304) (9 pp, sha256 `17fd02335f13449d`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/si2307cds-t1-ge3-datasheet.pdf)