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SI2302A-TP

MCC(Micro Commercial Components) · MOSFETs · SOT-23

SI2302A-TP from MCC(Micro Commercial Components), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GATE input Gate of the N-channel enhancement-mode MOSFET; gate-source voltage limited to ±8V with threshold of 0.65V min to 1.2V max at ID=50µA.
2 SOURCE passive Source terminal of the N-channel MOSFET; continuous drain current is 3.0A and body diode forward current is 0.94A.
3 DRAIN passive Drain terminal of the N-channel MOSFET; drain-source voltage rated 20V with 3.0A continuous and 10A pulsed drain current.

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SOT-23
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 20 V VGS=0V, ID=10µA 2
Gate-Threshold Voltage VGS(th) 0.65 1.2 V VDS=VGS, ID=50µA 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±8V, VDS=0V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS=20V, VGS=0V 2
Drain-Source On-Resistance RDS(on) 72 mΩ VGS=4.5V, ID=3.6A 2
Drain-Source On-Resistance RDS(on) 110 mΩ VGS=2.5V, ID=3.1A 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=0.94A 2
Drain-Source Diode Forward Current IS 0.94 A 2
Drain-Source Voltage VDS 20 V 1
Gate-Source Voltage VGS -8 8 V 1
Drain Current-Continuous ID 3 A 1
Drain Current-Pulsed IDM 10 A Note1: pulse width limited by max junction temperature 1
Power Dissipation PD 1.25 W 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range Tstg -55 150 °C 1
Thermal Resistance Junction to Ambient RθJA 100 °C/W 1
Forward Transconductance gFS 8.5 S VDS=5V, ID=3.6A 2

CAD (KiCad official)

  • Symbol: SI2302A-TP
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2302a-tp-etched.step / si2302a-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2302a-tp.step / si2302a-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (4 pp, sha256 a22bdffe7dde5306, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF