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Contents

README

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Si2301BDS-HXY

HXY MOSFET · MOSFETs · SOT-23

Si2301BDS-HXY from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the P-channel MOSFET, with VGS rated ±12 V maximum and threshold VGS(th) of -0.4 V min to -1 V max at ID=-250μA.
2 S passive Source; the P-channel source terminal, with continuous drain current rated -3 A.
3 D passive Drain; rated for VDS of -20 V maximum, continuous ID of -3 A and pulsed IDM of -10 A.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -20 -24 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-20V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±12V,VDS=0V 2
Gate Threshold Voltage VGS(th) -0.4 -0.7 -1 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance (VGS=-4.5V) RDS(ON) 60 80 mΩ VGS=-4.5V, ID=-3A 2
Drain-Source On-State Resistance (VGS=-2.5V) RDS(ON) 85 103 Ω VGS=-2.5V, ID=-2A 2
Forward Transconductance gFS 5 S VDS=-5V,ID=-2A 2
Total Gate Charge Qg 3.3 12 nC VDS=-10V,ID=-3A, VGS=-2.5V 2
Diode Forward Voltage VSD -1.2 V VGS=0V,IS=1.3A 2
Diode Forward Current IS -3 A 2
Drain-Source Voltage VDS -20 V 1
Gate-Source Voltage VGS -12 12 V 1
Drain Current-Continuous ID -3 A 1
Drain Current-Pulsed IDM -10 A Note 1: Repetitive rating, pulse width limited by maximum junction temperature 1
Maximum Power Dissipation PD 1 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 125 ℃/W Note 2: Surface mounted on FR4 board, t ≤ 10 sec 1

CAD (KiCad official)

  • Symbol: Si2301BDS-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2301bds-hxy-etched.step / si2301bds-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2301bds-hxy.step / si2301bds-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (7 pp, sha256 460660361abd5ae0, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF