Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SI2300-HXY

HXY MOSFET · MOSFETs · SOT-23

SI2300-HXY from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the N-channel MOSFET; the absolute maximum gate-source voltage is ±12 V, and the part is specified for operation at gate voltages as low as 2.5 V.
2 D passive Drain of the MOSFET; absolute maximum ratings are 20 V drain-source voltage, 6 A continuous drain current and 25 A pulsed drain current.
3 S passive Source of the MOSFET, the reference terminal for VGS and VDS; the body diode forward voltage is 0.75 V typical and 1 V maximum at IS = 1 A with VGS = 0 V.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage V (BR) DSS 20 V VGS = 0V, ID = 250µA 2
Gate-source leakage current IGSS -100 100 nA VDS = 0V, VGS = ±12V 2
Gate threshold voltage VGS(th) 0.5 0.7 1 V VDS = VGS, ID = 250µA 2
Forward transconductance gfS 4 S VDS = 5V, ID = 3.8A 2
Gate-source voltage VGS -12 12 V 1
Operating junction and storage temperature range TJ,TSTG -55 150 ℃ 1
Drain-source voltage VDS 20 V TA = 25℃ unless otherwise noted 1
Drain current-continuous ID 6 A TA = 25℃ unless otherwise noted 1
Drain current-pulsed IDM 25 A Note 1 1
Maximum power dissipation PD 0.35 W TA = 25℃ unless otherwise noted 1
Thermal resistance, junction-to-ambient RθJA 100 ℃/W Note 2 1
Zero gate voltage drain current IDSS 1 µA VDS = 16V, VGS = 0V 2
Drain-source on-state resistance RDS(on) 22 27 mΩ VGS = 4.5V, ID = 5.0A 2
Drain-source on-state resistance RDS(on) 35 mΩ VGS = 2.5V, ID = 4.0A 2
Drain-source on-state resistance RDS(on) 73 mΩ VGS = 1.8V, ID = 2.0A 2
Diode forward voltage VSD 0.75 1 V VGS = 0V, IS = 1A 2

CAD (KiCad official)

  • Symbol: SI2300-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2300-hxy-etched.step / si2300-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2300-hxy.step / si2300-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (5 pp, sha256 696cde310e1d0c0e, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF