component

SHT40-CD1B-R3

Public Made by Adom

by adom

Sensirion Global Sourcing Parts, DFN-4(1.5x1.5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentglobal sourcing partssht40-cd1b-r3factory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 16d ago
viewers sht40-cd1b-r3: viewers · Ray 16d ago
package.json Publish 0.1.0 · Ray 16d ago
page.json Set visibility: public · Ray 16d ago
README.md Publish 0.1.0 · Ray 16d ago
sht40-cd1b-r3-etched.glb Publish 0.1.0 · Ray 16d ago
sht40-cd1b-r3-etched.step sht40-cd1b-r3: factory component page (tier=lcsc) · Ray 16d ago
sht40-cd1b-r3-hero.glb sht40-cd1b-r3: hero GLB from the etched model (keeps the MPN mark) · Ray 16d ago
sht40-cd1b-r3-hero.overlay.json Publish 0.1.0 · Ray 16d ago
sht40-cd1b-r3.glb Publish 0.1.0 · Ray 16d ago
sht40-cd1b-r3.kicad_mod Publish 0.1.0 · Ray 16d ago
sht40-cd1b-r3.kicad_sym Publish 0.1.0 · Ray 16d ago
sht40-cd1b-r3.lbr Publish 0.1.0 · Ray 16d ago
sht40-cd1b-r3.step Publish 0.1.0 · Ray 16d ago

SHT40-CD1B-R3

Sensirion · Global Sourcing Parts · DFN-4(1.5x1.5)

SHT40-CD1B-R3 from Sensirion, in a DFN-4(1.5x1.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDA bidirectional Serial data line of the I2C interface, bidirectional, for the 0x46 address variant of this part.
2 SCL input Serial clock line of the I2C interface, unidirectional input to the sensor.
3 VDD power_in Supply voltage; the datasheet states VDD = 1.08 V … 3.6 V.
4 VSS power_in Ground reference for the sensor.

Key specifications

Parameter Value
Manufacturer Sensirion
Package DFN-4(1.5x1.5)
Category Global Sourcing Parts
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 1.08 3.3 3.6 V 9
Power-up/down voltage (static power supply) VPOR 0.6 1.08 V Static power supply 9
Slew rate of the supply voltage VDD, slew 20 V/ms Voltage changes between VDD, min and VDD, max 9
Supply current (heater off), idle state IDD 0.08 1 µA Idle state, At 25 °C 9
Supply current (heater off), idle state IDD 3.4 µA Idle state, At 125 °C 9
Supply current (heater off), measurement IDD 320 500 µA Current while sensor is measuring 9
Supply current (heater on), nominal heater 200 mW IDD 60 100 mA Nomin. heater “200 mW” 9
Supply current (heater on), nominal heater 110 mW IDD 33 55 mA Nomin. heater “110 mW” 9
Supply current (heater on), nominal heater 20 mW IDD 6 10 mA Nomin. heater “20 mW” 9
Low level input voltage VIL 0 V 9
Pull up resistor Rp Rp 820 Ω VDD < 1.62 V 9
Pull up resistor Rp Rp 390 Ω VDD ≥ 1.62 V 9
Low level output voltage VOL 0.4 V VDD > 2.0 V, Rpullup > 390 Ω 9
Capacitive bus load Cb 400 pF RP ≤ 820 Ω: fast mode 9
Capacitive bus load Cb 340 pF Fast mode plus, Rp = 390 Ω, VDD > 1.62 V 9
Power-up time tPU 0.3 1 ms After hard reset, VDD ≥ VPOR 10
Soft reset time tSR 1 ms After soft reset 10
Measurement duration, low repeatability tMEAS,l 1.3 1.6 ms Low repeatability, including tPU 10
Measurement duration, medium repeatability tMEAS,m 3.7 4.5 ms Med. repeatability, including tPU 10
Measurement duration, high repeatability tMEAS,h 6.9 8.3 ms High repeatability, including tPU 10
Heater-on duration, long pulse tHeater 0.9 1 1.1 s Long pulse 10
Heater-on duration, short pulse tHeater 0.09 0.1 0.11 s Short pulse 10
Max voltage on any pin (lower limit) VSS -0.3 V 10
Operating temperature range -40 125 °C 10
Storage temperature range -40 150 °C 10
ESD HBM 2 kV 10
ESD CDM 500 V 10
Latch up 100 mA JESD78 Class II, 125 °C 10
Recommended normal temperature range 5 60 °C 7
Recommended normal relative humidity range 20 80 %RH 7
Junction-to-ambient thermal resistance RθJA 246 K/W Heater off, die pad soldered 16
Junction-to-ambient thermal resistance RθJA 308 K/W Heater on (200 mW assumed), die pad soldered 16
Junction-to-ambient thermal resistance RθJA 297 K/W Heater off, die pad not soldered 16
Junction-to-ambient thermal resistance RθJA 357 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-case thermal resistance RθJC 189 K/W Heater off, die pad soldered 16
Junction-to-case thermal resistance RθJC 255 K/W Heater on (200 mW assumed), die pad soldered 16
Junction-to-case thermal resistance RθJC 191 K/W Heater off, die pad not soldered 16
Junction-to-case thermal resistance RθJC 257 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-board thermal resistance RθJB 159 K/W Heater off, die pad soldered 16
Junction-to-board thermal resistance RθJB 225 K/W Heater on (200 mW assumed), die pad soldered 16
Junction-to-board thermal resistance RθJB 193 K/W Heater off, die pad not soldered 16
Junction-to-board thermal resistance RθJB 258 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-board characterization parameter ΨJB 159 K/W Heater off, die pad soldered 16
Junction-to-board characterization parameter ΨJB 223 K/W Heater on (200 mW assumed), die pad soldered 16
Junction-to-board characterization parameter ΨJB 191 K/W Heater off, die pad not soldered 16
Junction-to-board characterization parameter ΨJB 254 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-top characterization parameter ΨJT 38 K/W Heater off, die pad soldered 16
Junction-to-top characterization parameter ΨJT 105 K/W Heater on (200 mW assumed), die pad soldered 16
Junction-to-top characterization parameter ΨJT 44 K/W Heater off, die pad not soldered 16
Junction-to-top characterization parameter ΨJT 112 K/W Heater on (200 mW assumed), die pad not soldered 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper SHT4x is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening is centered on the top side of the package. The sensor chip is made of silicon, hosted on a copper lead 14

CAD (KiCad official)

  • Symbol: SHT40-CD1B-R3
  • Footprint: Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad
  • 3D model: DFN-4(1.5x1.5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.55 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: sht40-cd1b-r3-etched.step / sht40-cd1b-r3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sht40-cd1b-r3.step / sht40-cd1b-r3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Sensirion datasheet (23 pp, sha256 5e46000daf58f4a4, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF